Classifications

• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
  • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
  • G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/4201—Packages, e.g. shape, construction, internal or external details
  • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/4201—Packages, e.g. shape, construction, internal or external details
  • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
  • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/4201—Packages, e.g. shape, construction, internal or external details
  • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
  • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
  • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Definitions

• the invention relates to a micro system block, insbeson ⁇ particular for use m the micro-optical systems, consisting of a body, ametrisflacne and nozzle surfaces are provided for attachment to adjoining components of a micro-system at the surface at least.
• microsystem modules are primarily intended to be used in micro-optics to connect light sources and light guides to one another or to shape the light beam at the end of a light guide or at the exit of a light source in a special way, for example to collimate it, to bend or diverge.
• Such microsystem modules can also be used elsewhere in microstructure systems, where it is important to have certain functional areas, e.g. B. scanning areas, m an exact spatial relation to the adjacent components.
• micro-optic lens consists of an elongated glass fiber formed flattened on three sides and rounded at the fourth longitudinal side zylindermantelformig
• the cylindrical jacket-shaped rounded surface serves as an optically effective boundary surface, while the surface opposite the cylindrical jacket-shaped rounded surface serves as a flat support surface for connecting the adjacent components, which are designed here as diode lasers whose emitted light is to be collimated.
• the diode lasers are glued to the support surface of the micro-optical lens with a suitable adhesive or optical cement.
• the micro-optical lens will not be positioned correctly in relation to the diode lasers.
• the sensitive emitter surface of the diode laser can easily be damaged when gluing or cementing.
• micro-optical lenses which are intended as collimators for diode lasers, are known, for example, from US Pat. No. 5,181,224. These known collimators can be connected to a diode laser, for example, only with considerable measuring effort and, if necessary, with the aid of adapters or adapters. It is of course just as difficult to connect such micro-optical lenses to other micro-optical components with a precise fit elsewhere. Finally, with these micro-optical lenses there is a risk that the convexly projecting, optically effective boundary surfaces, which are very sensitive, will be damaged during transport, handling and assembly of the micro-optical lens.
• the invention relates to a microsystem module, in particular for the use of microoptical systems, consisting of a body, on the upper surface of which at least one functional surface and support surfaces are provided for attachment to adjoining components of a microsystem, this microsystem module being characterized in that
• the sensitive functional surfaces are nowhere outward beyond the outer contour of the module, but are arranged behind the support surfaces and are accordingly well protected against damage by contact. They also do not come into contact with the adjacent components during assembly, so that damage to the adjoining components, for example damage to the sensitive emitter of diode lasers, is reliably avoided.
• the fact that the support surfaces are already dimensionally arranged with the tightest tolerances in relation to the functional surfaces means that the dimensionally stable assembly days of the building block extremely relieved. For this purpose, only the support surfaces on the module need to be arranged in the correct relation to the counter surfaces on the adjoining components. If this dimensional relationship is correct, the arrangement of the functional surface relative to the adjacent components is also automatically correct, provided, of course, that their counter-support surfaces are also arranged correspondingly true to size.
• An expedient development of the invention provides that form-fitting elements are provided in the support surfaces for engagement in corresponding form-fitting elements on the adjacent components.
• Such positive locking elements e.g. B. m shape of recesses and protrusions and / or grooves and tongues make it possible to set the microsystem module m precisely adjusted in all directions without requiring complex measurements for the adjustment.
• the invention provides that the functional surfaces and / or the support surfaces are smooth polished. By polishing these surfaces, dimensional deviations resulting from the roughness of the surfaces are avoided.
• the dimensional relationships between such polished surfaces could be designed to within a few nanometers.
• a particularly preferred embodiment of the invention provides that the body consists of optically transparent material and the functional surfaces are designed as optically effective boundary surfaces.
• optics are understood to mean all systems which work with electromagnetic waves in the range of visible and invisible (ultraviolet, infrared) light, right down to the microwaves (millimeter waves).
• Optically permeable material is understood to mean materials such as optical glass, quartz, germanium, ruby, optical plastics, etc., which are suitable for transmitting and influencing electromagnetic waves of the type mentioned.
• the light is refracted at the optically effective boundary surfaces, reflected by total reflection or by a reflective coating, or diffracted by diffraction lines or gratings.
• the functional surfaces on the microsystem module suitable for micro-optical systems can be designed differently.
• they can be designed as concave or convex curved lens surfaces, it being possible to produce all lens shapes known from macro-optics.
• planar surfaces that are inclined relative to one another can be arranged in the functional surfaces to form prisms that refract or reflect the light.
• Diffraction lines or diffraction gratings can also be arranged in the functional surface, which diffract the light passing through.
• the functional surfaces can be completely or partially covered with a reflective coating.
• lens arrays can be produced on a single micro-optical component.
• a microoptical module designed according to the teaching of the invention can be designed, for example, as a refractive collimator that can be connected to a diode laser.
• the functional surface facing the emitter of the diode laser is a prism, the apex of which runs parallel to the longitudinal extension of the emitter of the diode laser and is rounded off in the vicinity of the emitter.
• the apex angle of the prism is larger than the emission angle orthogonal to the longitudinal extension of the emitter of the diode laser.
• the functional surface opposite the emitter of the diode laser is designed as a cylindrical surface, the cylindrical axis of which extends orthogonally to the apex of the prism.
• Such a refractive collimator is able to absorb and collimate the light band emitted by the emitter of the diode laser with very little loss.
• This collimator has a particularly high numerical aperture of, for example, 0.68 when quartz glass is used and, as a result, can almost completely collimate the light emitted by the diode laser.
• This refractive collimator also advantageously has support surfaces protruding beyond the functional surfaces. The special design and mutual assignment of the functional surfaces has the stated advantages even without the support surfaces. The protection of the patent should therefore also relate to collimators of the latter type, in which the support surfaces mentioned in claim 1 are missing.
• Another micro-optical module designed according to the teaching of the invention can be designed, for example, as a reflective optical coupler which is connected between a diode laser and an adjoining one can be used.
• Two functional elements are arranged on the functional surfaces of the optical coupler, namely, a first aspherical cylindrical lens and offset a flat mirror on the first functional surface and an aspherical cylindrical mirror and offset a second aspherical cylindrical lens on the second functional surface.
• the cylinder axes of the ooid cylinder lenses run orthogonally to one another. In contrast, their optical axes are arranged parallel to one another.
• the emitter of the diode laser is arranged in front of the first aspherical cylindrical lens.
• a reflective optical coupler is able to receive the light band emitted by the emitter of the diode laser with very little loss and to couple it in a focused manner into an optical waveguide.
• This reflective optical coupler advantageously has support surfaces protruding beyond the functional surfaces. The special design and mutual assignment of the functional surfaces has the stated advantages, however, even without these support surfaces.
• the protection of the patent should therefore also relate to reflective optical couplers of the latter type, in which the support surfaces mentioned in claim 1 are missing.
• Another microsystem module designed according to the teaching of the invention can be designed, for example, as an optical circuit board, by means of which at least two optoelectronic semiconductor modules can be connected to one another.
• the functional surfaces are designed, on the one hand, as lenses for emitting and decoupling light beams and, on the other hand, as mirrors for guiding beams within the optical printed circuit board.
• Such an optical Printed circuit board is able to receive a light beam emitted by an optoelectronic semiconductor component (IOE chip) connected on the input side via an first lens and to steer the course of the light beam inside the optical printed circuit board by means of the mirrors in such a way that the light beam passes through a second lens emerges from the optical circuit board and meets a second optoelectronic semiconductor device connected on the output side.
• the two optoelectronic semiconductor systems smd optically interconnected for the purpose of data exchange. By using corresponding wave-selective beam switches, it is possible to interconnect several optoelectronic semiconductor modules bidirectionally. By using a number of lenses and mirrors in the optical circuit boards, more complicated three-dimensional optical connection structures can also be realized.
• This optical circuit board advantageously has support surfaces protruding beyond the functional surfaces.
• the special design and mutual assignment of the functional surfaces has the stated advantages even without these support surfaces.
• the protection of the patent should therefore also relate to optical circuit boards of the latter type, in which the support surfaces mentioned in claim 1 are missing.
• a micro-optical module likewise designed according to the teaching of the invention can be connected, for example, as a wave-selective beam splitter to a light source, a light receiver and an optical waveguide.
• a light beam emerging from the optical waveguide is refracted by the same wave-selective functional element in such a way that it strikes the light receiver.
• Such waves ⁇ selective beam splitter allows eme bidirectional optical data transmission, but an optical fiber.
• a diode laser is usually used as the light source, the focused light band of which is coupled in via the wave-selective functional element of the beam splitter and a spherical lens m the optical waveguide.
• the light rays emerging from the optical waveguide are refracted at the wave-selective functional element, pass through the beam splitter, emerge from the opposite side and hit the light receiver, for example a photodiode.
• This wave-selective beam switch advantageously has support areas protruding beyond the functional areas.
• the special design and mutual assignment of the functional surfaces has the stated advantages, however, even without these support surfaces.
• the protection of the patent should therefore also relate to wave-selective beam switches of the latter type, in which the support surfaces mentioned in claim 1 are missing.
• the invention further relates to a method for producing microsystem modules of the type mentioned above, which method is characterized in that the support surfaces and the depressions with the surface contours of the functional surfaces assigned to these support surfaces are formed on a substrate by ultrasonic oscillating flaps with an appropriately shaped, one-piece Lappform herge ⁇ .
• the microstructures to be produced on the substrate namely the support surfaces and the depressions with the surface contours of the functional surfaces.
• a lapping mold made of hard metal which vibrates mechanically with an ultrasound frequency and has a negative impression of the microstructure to be produced, is pressed against the substrate using a sufficiently hard lapping agent (hard material powder or paste).
• a positive impression of the Lappform is formed on the surface of the substrate with high dimensional accuracy and relatively low surface roughness.
• the fact that a one-piece Lappform is used makes it possible in a simple manner to maintain the dimensional relationship between the support surfaces and the functional surfaces with the greatest accuracy.
• the surface roughness is so small that it can easily be polished by polishing with an electron beam.
• the energy density of the electron beam is adjusted so that only the surface of the surface to be polished is melted, so that the surface tension creates an absolutely smooth surface.
• This polishing with an electron beam is the subject of a German patent application DE 42 34 740 AI which goes back to the same applicants.
• the invention proposes that the negative contours of a large number of microsystem components be formed on a large-area Lapp mold, that the Lapp mold is molded on a correspondingly large-sized substrate and that the substrate is finally divided into the individual micro system components becomes.
• I shows a vertical longitudinal section through a microsystem module designed as a refractive collimator with a connected diode laser
• FIG. 2 shows a horizontal longitudinal section through the microsystem module according to FIG. 1;
• FIGS. 1 and 2 shows a perspective representation of the microsystem construction element according to FIGS. 1 and 2;
• FIG. 4 shows a perspective illustration of a microsystem component with form-fit elements in the support surfaces for engagement m corresponding form-fit elements on adjacent components;
• FIG. 5 shows a perspective representation of two cylindrical lens arrays arranged one behind the other
• FIG. 6 shows a perspective representation of a microsyster component with optically correlated diametrically opposite functional surfaces
• FIG. 7 shows a side view of a micro system component designed as a reflective optical coupler
• FIG. 8 shows a top view of the microsystem construction from FIG. 7; 9 shows a longitudinal section through a microsystem module designed as an optical conductor plate;
• FIG. 10 shows a longitudinal section through a microsystem module designed as a wave-selective beam switch
• FIG. 13 schematically shows in section the polishing of the optically active boundary surfaces by means of an electron beam.
• a microsystem module according to the invention for the use of m micro-optical systems in its entirety is designated by the reference number 1.
• the microsystem module 1 is designed as a refractive collimator. It consists of a body 2, for example quartz glass or another optically transparent material. In the body 2 recesses 3 and 4 are incorporated, at the bottom of which functional surfaces 5 and 6 are arranged smd.
• the functional surface 6 has an approximately cylindrical jacket-shaped curvature, the axis of this cylindrical jacket-shaped curvature extending perpendicular to the longitudinal extension of the apex of the prism at the opposite optically effective boundary plate 5.
• the body 2 is provided with support surfaces 7 and 8 which are used for connection to adjacent optical components 9, for example for connection to a diode laser which is provided with counter support surfaces 10 corresponding to the support surfaces 7.
• support surfaces 7 and 8 are provided with form-locking elements ⁇ a and 8a protruding from the surface, for example in the form of projections, which m m corresponding counter-shape locking elements 10a m the counter-support faces 10 on the adjacent optical components 9.
• the support surfaces 7 and 8 m are located in a precisely defined dimensional relation to the functional surfaces 5 and 6. Because the functional surfaces 5 and 6 are opposite the support surfaces 7 and 8 in the direction of the Stand back inside the body 2, they are arranged well protected. With the help of the support surfaces 7 and 8 on the body 2 and the counter support surfaces 10 on the adjacent optical component 9, the microsystem module 1 can be positioned very precisely on the diode laser 11 in a simple manner, and in such a way that the apex of the prism in the Functional surface 5 is exactly opposite the emitter of the diode laser 11 and is aligned exactly parallel to its longitudinal extension.
• the microsystem module 1 described above is shown in perspective. 4 shows a microsystem module 1 designed as a refractive collimator, the support surfaces 7 of which, which adjoin an optical component 9, are provided with projections 50. These projections 50 engage in corresponding depressions 51 on the adjacent component 9 em. This makes it possible to fix the micro system 1 m in the y and z directions precisely adjusted on the adjoining component 9 without the need for complex measurements for the adjustment.
• the two microsystem modules 1 each form a cylindrical lens array 60 and 61.
• the cylinder axes of the individual cylindrical lenses of the cylindrical lens arrays 60 and 61 run parallel to one another.
• the two cylindrical lens arrays 60 and 61 adjoin one another at their support surfaces 7 with functional surfaces facing one another.
• the cylinder axes of the two cylinder lens arrays 60 and 61 run at a right angle to one another.
• Such cylinder lens arrays 60 and 61 are often arranged one behind the other in order to achieve an optimal transformation and shaping of a beam of light rays passing therethrough.
• FIG. 6 shows a microsystem module 1, on the body 2 of which cylindrical lens arrays 70 and 71 are arranged on diametrically opposite sides, which are optically correlated through the body 2.
• the cylinder axes of the two cylinder lens arrays 70 and 71 run at a right angle to one another.
• FIG. 7 shows a microsystem module 1 designed as a reflective optical coupler.
• Functional surfaces 5 on its body 2 smd on diametrically opposite sides and 6, the functional elements 80 to 83 of which are optically correlated through the body 2.
• the emitter of a diode laser (not shown), which emits a light band, is arranged in front of an aspherical cylindrical lens 80.
• This enters the body 2 through the cylindrical lens 80 strikes an aspherical cylindrical mirror 81, is reflected by the latter onto a flat mirror 82 and from there onto a second aspherical cylindrical lens 83.
• the light band then emerges from the body 2 through the cylindrical lens 83 and is finally coupled into an optical waveguide, also not shown, which is arranged in front of the cylindrical lens 83.
• FIG. 8 shows a top view of the reflective optical coupler from FIG. 7.
• FIG. 9 shows a microsystem module 1 designed as an optical circuit board, which is connected to two optoelectronic semiconductor modules 90 and 91 and optically interconnects them.
• the functional surfaces of the optical printed circuit board are designed on the one hand as lenses 93 and 96 for coupling in and out light beams and on the other hand as mirrors 94 and 95 for beam guidance within the optical printed circuit board.
• the optical interconnection takes place in such a way that the first optoelectronic semiconductor component 90 emits a light beam 92 which is coupled into the body 2 of the optical circuit board via a first lens 93.
• the light beam 92 is guided via mirrors 94 and 95 in such a way that it is coupled out of the body 2 again via a second lens 96 and onto the second optoelectronic semiconductor module 91 meets. It is also possible to connect the two optoelectronic semiconductor components 90 and 91 in the opposite direction, ie the semiconductor component 91 emits a light beam 92 which the semiconductor component 90 then receives.
• a bidirectional connection of the two optoelectronic semiconductor modules 90 and 91 can be implemented by the interest rate of suitable beam switches.
• FIG. 10 shows a microsystem module 1 designed as a wave-selective beam splitter. This is connected to a light source 102, a light receiver 107 and a light waveguide 105.
• the functional surface 6 facing the light source 102 and the optical waveguide 105 has a functional element 101 with wave-selective behavior.
• a diode laser is used as the light source 102.
• the emitter of the diode laser 102 emits a light band 103, which is reflected on the wave-selective functional element 101 and the optical waveguide 105 is coupled in via a spherical lens 104 m.
• a light beam 106 is now coupled out of the optical waveguide 105, it is refracted at the wave-selective functional element 101 and an opposite functional element 100 such that it strikes the light receiver 107.
• This is designed as a photodiode.
• Such a wave-selective beam splitter enables bidirectional optical data transmission via an optical waveguide 105.
• the first step of the manufacturing process is based on, for example, a cuboid substrate 20 made of optically transparent material, for example quartz glass.
• the recesses 3 and 4 in the cuboid quartz glass body are produced by ultrasound Rocking rag. These are non-machined embossing with loose, m emer liquids or emer paste finely distributed hard material, which are activated by a Lappform made of hard metal vibrating with ultrasound frequency.
• FIG. 11 schematically shows this ultrasonic rocking flap for producing a raw form of an individual microsystem module 1.
• the Lappform is designated by the reference 21.
• On its surface facing the substrate 20 it has a negative impression of the recess 3 and 4 to be produced and functional surfaces 5 and 6.
• the lap shape 21 is coated on the side facing the substrate 20 with a layer 22 of abrasive.
• This abrasive is preferably an abrasive powder that contains hard-grain particles in finely divided form.
• the lapping mold 21 provided with the abrasive layer 22 is excited with mechanical vibrations in the ultrasound range and pressed against the substrate 20.
• the material of the substrate 20 is removed by undirected machining.
• the removal process is stopped.
• an exact positive impression of the Lappform 21 is formed on the substrate 20. In this way it is possible to produce the required structures on the surface of the microsystem construction element 1 to be produced with great dimensional accuracy.
• a large-area Lappform 31 is on a large area Provide substrate 30 facing surface with a negative impression of several adjacent depressions and optically effective boundary surfaces.
• the Lappform is coated on the side facing the substrate 30 with a layer 32 of abrasive.
• the material of the substrate 30 is now removed by means of non-directional machining with mechanical vibrations in the ultrasound range directed perpendicular to the substrate. In this way, so-called lens arrays can be produced on a single micro-optical component or the individual functional elements can be divided into individual microsystem components 1 along the lines 33 after production.
• the functional surfaces 5 and 6 are polished with a high-energy electron beam 43.
• This step is shown in FIG. 13.
• the electron gun shown there for producing an energy-rich electron beam 43 has a cathode 40 serving as an electron source, an anode 41 serving to accelerate the electron beam 43 and a slit diaphragm 42 serving to shape the electron beam 43.
• the very high-energy electron beam 43 generated in this way which has the shape of a flat rectangular band, is directed onto the surfaces to be polished on the substrate 2.
• the substrate 2 is then moved transversely to the plane of the band-shaped electron beam 43.
• the supply of energy in the surface to be polished is controlled by suitable measures so that only the surface is melted over the depth of the existing roughness, in each case to such an extent that the existing surface which roughness is compensated for by the surface tensions of the melt.

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Semiconductor Lasers (AREA)
• Optical Couplings Of Light Guides (AREA)

Applications Claiming Priority (5)

Publications (1)

Family

ID=26021016

Family Applications (1)

Country Status (10)

Families Citing this family (31)

Family Cites Families (39)

• 1996
  • 1996-03-20 DE DE19610881A patent/DE19610881B4/de not_active Expired - Fee Related
  • 1996-12-06 KR KR1019980704234A patent/KR19990071946A/ko not_active Application Discontinuation
  • 1996-12-06 EP EP96943897A patent/EP0888569A1/de not_active Ceased
  • 1996-12-06 CA CA002239866A patent/CA2239866A1/en not_active Abandoned
  • 1996-12-06 CN CNB961988568A patent/CN1152270C/zh not_active Expired - Fee Related
  • 1996-12-06 AU AU13688/97A patent/AU1368897A/en not_active Abandoned
  • 1996-12-06 JP JP52099697A patent/JP3995026B2/ja not_active Expired - Fee Related
  • 1996-12-06 IL IL12479696A patent/IL124796A0/xx unknown
  • 1996-12-06 WO PCT/EP1996/005471 patent/WO1997021126A1/de not_active Application Discontinuation
  • 1996-12-06 US US09/091,038 patent/US6416237B2/en not_active Expired - Fee Related
• 2002
  • 2002-03-08 US US10/094,747 patent/US6621631B2/en not_active Expired - Fee Related

Non-Patent Citations (1)

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