EP0858726A1 - Connecteur electrique - Google Patents

Connecteur electrique

Info

Publication number
EP0858726A1
EP0858726A1 EP97922966A EP97922966A EP0858726A1 EP 0858726 A1 EP0858726 A1 EP 0858726A1 EP 97922966 A EP97922966 A EP 97922966A EP 97922966 A EP97922966 A EP 97922966A EP 0858726 A1 EP0858726 A1 EP 0858726A1
Authority
EP
European Patent Office
Prior art keywords
contact pieces
spring device
contact
cover plate
connecting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97922966A
Other languages
German (de)
English (en)
Inventor
Hans-Georg Meissner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Multitest Elektronische Systeme GmbH
Original Assignee
Multitest Elektronische Systeme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Multitest Elektronische Systeme GmbH filed Critical Multitest Elektronische Systeme GmbH
Publication of EP0858726A1 publication Critical patent/EP0858726A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack

Definitions

  • the invention relates to an electrical connecting device for connecting electrical connections of a component, in particular a semiconductor component, to corresponding connecting lines, in particular arranged on a printed circuit board, according to the preamble of patent claim 1.
  • Electrical connection devices of this type are used in particular in machines for testing semiconductor components with integrated circuits in order to check the function of these electronic components on the manufacturer's side.
  • the electrical connections of the component for example the pins of an IC chip, are contacted fully automatically via the electrical connection device with a circuit board connected to the actual test device (also called DUT board or "device under test board”) .
  • Modern test machines work with a throughput of 3000 semiconductor components per hour and more. This means that the positioning and contacting of the Components with the corresponding connection lines of the DUT circuit board must be done very quickly. Furthermore, this process must be carried out with the highest precision, since semiconductor components can have up to several 100 pins, which are designed to be correspondingly small and have a spacing of only 0.5 to 1 mm, for example. In addition, the electrical connection must be established within this short time in an absolutely reliable manner, since otherwise an incorrect test result would be achieved and the component would be declared as a committee.
  • An electrical connection device according to the preamble of claim 1 is known from US Pat. No. 5,069,629.
  • the electrical connection between the pins of the component to be tested and the corresponding connecting lines of the DUT circuit board is made there by means of S-shaped contact pieces which are suspended at both ends on thin, parallel holding straps. At least one of these straps is designed as an elastomeric, resilient part. If the ends of the pins of the semiconductor component to be tested are pressed onto the ends of the contact pieces that protrude beyond the top of the receiving part, they can therefore spring downward within the slots of the receiving part until the lower end of the contact pieces on the corresponding connecting lines the DUT circuit board lies on and the electrical connection is thereby established.
  • the invention is therefore based on the object to provide an electrical connection device according to the preamble of claim 1, which has improved electrical properties, increases the reliability of contacting and enables longer test frequencies with a denser construction of the contact pieces.
  • the spring device is provided between the connecting lines and the movable contact pieces and has electrically conductive passage elements which are in pressure contact at one end with the connecting lines and at the other end with the contact pieces. Furthermore, the contact pieces are designed as pressure levers for the spring device which are pivoted at the end.
  • the contact pieces themselves no longer come into contact with the corresponding connecting lines of the DUT circuit board.
  • Much more The electrical connection takes place via the electrically conductive spring device, ie via the electrically conductive and bendable passage elements which are provided within the spring device.
  • This spring device rests on the connection lines of the DUT circuit board, so that at least one electrically conductive passage element is in contact with a corresponding connection line.
  • the contact pieces rest on the opposite side of the spring device, in such a way that at least one electrically conductive passage element is connected to a contact piece.
  • the contact pieces at their free end which protrudes upward beyond the slotted receiving part, are pressed downward by placing the pins of the semiconductor component, the contact piece at this end swivels downward about its end pivot axis, the The spring device is compressed at this point and the electrically conductive passage element arranged there is pressed firmly both onto the connecting line underneath and onto the contact piece.
  • contact pieces no longer rub on the connecting lines of the DUT circuit board, but only a static pressure contact with the spring device is present. Remote ner the assembly of the contact pieces can be carried out in a very simple manner and defective contact pieces can optionally also be replaced individually.
  • Another advantage is that the spring action can be changed largely independently of the arrangement of the passage elements, for example by changing the width of the spring device only to one side.
  • the spring device advantageously consists of a silicone strip, in which a multiplicity of electrically conductive passage elements are embedded in a row and at a predetermined distance from one another.
  • the silicone fulfills both the holding and the insulating function for the electrically conductive passage elements.
  • a simple assignment of a contact piece to a specific connecting line can be achieved by an embodiment in which the through elements extend perpendicularly through the plastic strip.
  • the contact pieces have a bearing leg, which is covered at least essentially upwards, ie towards the surface of the connecting device facing the component, by a cover plate which is detachably attached to the slotted receiving part and serves as an upper stop part and bearing part for the bearing legs.
  • the underside of the cover plate can be provided with a groove in the shape of a circular arc, in which the convex arcuate sections of the contact pieces slide. are stored.
  • a corresponding round bead can also be provided, in which case the contact pieces have correspondingly shaped, concave circular arc sections at the bearing end, which are supported on the round bead.
  • FIG. 1 a perspective, partially broken-open partial view of a first embodiment of the connecting device according to the invention
  • FIG. 2 shows a longitudinal section through the connecting device from FIG. 1 along the main plane of a contact piece in the non-pressed position
  • FIG. 3 shows a longitudinal section corresponding to FIG. 2, the contact piece being shown in the depressed position
  • FIG. 4 a perspective view of the contact piece of FIGS. 1 to 3 in isolation
  • FIG. 5 an embodiment variant of the contact piece from FIG. 4,
  • FIG. 6 shows a perspective, shortened representation of the spring device from FIG. 1, FIG.
  • FIG. 7 shows a longitudinal section through the Federeinrich ⁇ device of Fig. 6,
  • Figure 8 is a perspective view of a second embodiment of the connecting device according to the invention.
  • FIG. 1 shows a section of an electrical connection device 1 in the form of a contact base, which is placed on a DUT circuit board 2.
  • a small part of a semiconductor component 3 with electrical connections in the form of pins 4 can be seen, which are brought into a prescribed relative position with respect to the electrical connection device 1 for testing the semiconductor component 3.
  • connecting lines 5 which consist of a plurality of flat conductor tracks arranged next to one another in a row. These connecting lines 5, which are insulated from one another in a known manner, are in a manner not shown with a test machine, also not shown, for checking the electrical properties of the Semiconductor component 3 in electrical connection.
  • the electrical connection device 1 essentially consists of a plate-shaped receiving part 6, in which a plurality of continuous, vertical slots 7 are provided.
  • the slots 7 are all of the same size and are arranged in a row parallel to one another in the section shown in FIG. 1.
  • the slots 7 serve for the movable reception and guidance of electrically conductive contact pieces 8 and keep them at a mutual lateral distance which corresponds to the distance between the pins 4.
  • the slots 7 are arranged such that when the receiving part 6 is placed on the printed circuit board 2 they are located above the connecting lines 5, a slot 7 being aligned with a connecting line 5 in each case.
  • the length of the slots 7 is dimensioned such that they extend in the longitudinal direction beyond the front and rear ends of the connecting lines 5.
  • the slots 7 and thus the contact pieces 8 inserted into these slots 7 are partially covered at the top by a cover plate 9.
  • This cover plate 9 is inserted into a corresponding depression 10 provided on the upper side of the receiving part 6, so that the upper side of the cover plate 9 lies in one plane with the remaining upper side of the receiving part 6.
  • the cover plate 9 and thus the depression 10 extend in the longitudinal direction of the slots 7 from the outside over a little more than half the length of the slots 7, while the remaining part of the slots 7 not covered by the cover plate 9 is open at the top and bottom is.
  • the cover plate 9 is screwed by means of screws 11 with a beschrie more detail later ⁇ surrounded clamping piece 12, which is below the cover plate 9 is located on the underside of the receiving part 6.
  • a recess 13 is provided in the area above the connecting lines 5 and extends across all the slots 7.
  • a spring device in the form of a silicone strip 14 is inserted, which is shown in more detail in FIGS. 6 and 7.
  • the silicone strip 14 consists of a resilient silicone body 15 which is rectangular in cross section and in which a multiplicity of continuous, electrically conductive passage elements 16 are embedded.
  • the passage elements 16 consist of fine wires which are arranged parallel to one another along the silicone body in a row and at a very small distance from one another.
  • the passage elements 16 protrude slightly from the top and bottom of the silicone body 15, i.e. the length of the passage elements 16 is slightly greater than the height of the silicone body 15.
  • the silicone body 15 serves on the one hand for holding and on the other hand for mutual insulation of the passage elements 16. Furthermore, the distance between the passage elements 16 is dimensioned such that that when the silicone strip 14 is placed on the connecting lines 5, at least one electrically conductive passage element 16 is in contact with one connecting line 5 each.
  • the silicone strip 14 lies on one side against a corresponding side wall of the recess 13 and is pressed from its opposite side by the clamping piece 12 against this side wall.
  • the clamping piece 12 lies in a recess 17, which is also located on the underside of the receiving part 6, adjoins the recess 13 laterally and runs parallel to the latter.
  • the clamping piece 12 serves on the one hand to fix the silicon strip 14 in the recess 13 and on the other hand to transmit the contacting forces of the contact pieces 8 to the slotted receiving part 6. This is done by connecting the clamping piece 12 to the cover plate 9 via the screws 11, a horizontal section 18 of the slotted receiving part 6 being clamped between these parts.
  • the clamping piece 12 offers a simple fixing possibility for the silicone strip 14 and also makes it possible to use silicone strips 14 of different widths, in which case only clamping pieces 12 of different widths have to be used.
  • FIGS. 1 to 4 pass the clock Kon ⁇ 8 pieces of thin flat platelets with chen wesentli in L-shape.
  • the contact pieces 8 have an essentially straight, somewhat longer bearing leg 19 and a somewhat shorter, upwardly projecting leg 20.
  • the leg 20 is located in the mounted state of the contact pieces to ⁇ 8 in continuous, not from the cover plate 9 covered part of the slots 7 and is upwards over the surface of the receiving part 6, so that the pins 4 on the upper edge region of the leg
  • the bearing leg 19 has at the opposite end of the contact piece 8 an end section 21 with an arcuate outer contour, the diameter of the end section 21 being greater than the height of the rest of the bearing leg 19.
  • each contact piece 8 is pivotally mounted in the region of the arcuate end section 21 within the receiving part 6.
  • the contact pieces 8 with this end section 21 lie in a groove 22 with a corresponding circular cross-section, which is provided on the underside of the cover plate 9.
  • the contact pieces 8 pivot downward about their circular-arc-shaped end section 21, the silicone strip 14 being pressed together.
  • the electrically conductive passage elements 16 are pressed downwards onto the connecting lines 5 and upwards against the contact pieces 8, so that a secure electrical connection between the contact piece 8 and the connecting line 5 is created.
  • the contact pieces 8 thus act as a single-sided swivel and pressure lever.
  • the upward force occurring during this pivoting movement in the region of the groove 22 is, as already stated, transmitted via the screws 11 and the clamping piece 12 to the slotted receiving part 6.
  • the clamping piece 12 is designed somewhat lower than the silicone strip 14.
  • FIG. 8 An alternative embodiment of a contact piece 8 'can be seen in FIG.
  • the main difference between this contact piece 8 'and the contact piece 8 shown in FIGS. 1 to 4 is that the end section of the bearing leg 19 which causes the pivot bearing is not convexly curved, but rather a concave circular arc cutout 23, ie one Has recess with a concavely curved surface.
  • These contact pieces 8 ' may in a not shown alternative execution ⁇ form an electrically connecting means are used, wherein on the underside of the cover plate 9 no groove 22, but instead a protruding bead corresponding arcuate outer surface provided is.
  • the contact piece 8 ' has the advantage over the contact piece 8 of a smaller area, as a result of which the series inductance, coupling inductance and coupling capacitance can be further reduced.
  • the receiving part 6 ′ extends to the side lying in the rear in FIG. 8 only to the end of the slots 7, while the area behind it is exposed above the DUT circuit board 2. This has the advantage that any dirt that may be present can easily fall out of the slots 7 to the rear, which could otherwise impair the smooth movement of the contact pieces 8 within the slots 7. Otherwise, this connection device is constructed in the same way as that of FIG. 1.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Dans un connecteur électrique pour raccorder des bornes électriques (4) d'un composant (3), notamment d'un composant semi-conducteur, à des câbles de raccordement (5) correspondants, notamment sur une carte de circuits imprimés (2), se trouve un système à ressort (14) comportant des éléments traversants (16) électroconducteurs entre les câbles de raccordement (5) et les contacts mobiles (8). Une extrémité de ces éléments traversants (16) est connectée sous pression aux câbles de raccordement (5), l'autre extrémité étant connectée aux contacts (8). Ces derniers se présentent sous la forme d'un levier de pression destiné au système à ressort (14) et monté pivotant à l'extrémité.
EP97922966A 1996-05-09 1997-05-06 Connecteur electrique Withdrawn EP0858726A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE1996118717 DE19618717C1 (de) 1996-05-09 1996-05-09 Elektrische Verbindungseinrichtung
DE19618717 1996-05-09
PCT/EP1997/002289 WO1997043886A1 (fr) 1996-05-09 1997-05-06 Connecteur electrique

Publications (1)

Publication Number Publication Date
EP0858726A1 true EP0858726A1 (fr) 1998-08-19

Family

ID=7793864

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97922966A Withdrawn EP0858726A1 (fr) 1996-05-09 1997-05-06 Connecteur electrique

Country Status (3)

Country Link
EP (1) EP0858726A1 (fr)
DE (1) DE19618717C1 (fr)
WO (1) WO1997043886A1 (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
DE10024165A1 (de) * 2000-05-17 2001-11-29 Vishay Semiconductor Gmbh Kontaktiersystem
DE10042224C2 (de) * 2000-08-28 2003-09-25 Infineon Technologies Ag Modultestsockel für Prüfadapter
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. Wafersonde
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
JP2007517231A (ja) 2003-12-24 2007-06-28 カスケード マイクロテック インコーポレイテッド アクティブ・ウェハプローブ
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
KR20070058522A (ko) 2004-09-13 2007-06-08 캐스케이드 마이크로테크 인코포레이티드 양측 프루빙 구조
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test

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JPS568081U (fr) * 1979-06-29 1981-01-23
FR2495846A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de connexion electrique a haute densite de contacts
JPH03297083A (ja) * 1990-04-13 1991-12-27 Texas Instr Japan Ltd ソケット
US5388996A (en) * 1991-01-09 1995-02-14 Johnson; David A. Electrical interconnect contact system
US5069629A (en) * 1991-01-09 1991-12-03 Johnson David A Electrical interconnect contact system
US5207584A (en) * 1991-01-09 1993-05-04 Johnson David A Electrical interconnect contact system
US5594355A (en) * 1994-07-19 1997-01-14 Delta Design, Inc. Electrical contactor apparatus for testing integrated circuit devices
US5609489A (en) * 1994-12-21 1997-03-11 Hewlett-Packard Company Socket for contacting an electronic circuit during testing

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Title
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Also Published As

Publication number Publication date
WO1997043886A1 (fr) 1997-11-20
DE19618717C1 (de) 1998-01-15

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