EP0828262A1 - Procédé pour souder des fils de connexion à des composants céramiques - Google Patents

Procédé pour souder des fils de connexion à des composants céramiques Download PDF

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Publication number
EP0828262A1
EP0828262A1 EP97114226A EP97114226A EP0828262A1 EP 0828262 A1 EP0828262 A1 EP 0828262A1 EP 97114226 A EP97114226 A EP 97114226A EP 97114226 A EP97114226 A EP 97114226A EP 0828262 A1 EP0828262 A1 EP 0828262A1
Authority
EP
European Patent Office
Prior art keywords
solder
tape
wire
soldering
ceramic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97114226A
Other languages
German (de)
English (en)
Inventor
Oliver Ing. Strallhofer
Ewald Dipl.-Ing. Lampl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Siemens Matsushita Components GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Matsushita Components GmbH and Co KG filed Critical Siemens Matsushita Components GmbH and Co KG
Publication of EP0828262A1 publication Critical patent/EP0828262A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered

Definitions

  • the invention relates to a method for soldering connecting wires of ceramic components.
  • soldering of connecting wires to ceramic components for example, wired PTC resistors (PTC thermistors) for example by a solder application with a solder paste dosage or by feeding tube solder.
  • PTC thermistors wired PTC resistors
  • the object of the present invention is a method for Specify soldering of connecting wires to ceramic components, that can be of high quality and rational and that by means of a homogeneous heating of the soldering process involved components (solder, ceramic, connecting wire) feasible is.
  • This object is achieved in that before a soldering tape provided with a flux the connecting wire to be soldered is applied.
  • the application can be done by means of a mechanical bending process be performed.
  • the invention is based on the following embodiment explained in more detail.
  • a connecting wire 1 is shown on the with the aid of a device 2 movable in the direction of the arrow Solder tape 3 is to be applied.
  • FIG. 2 shows how the device is used 2 the solder tape 3 is bent around the connecting wire 1. With help a counterpart 4 movable in the direction of the arrow Solder strip 3 mechanically attached to the connecting wire.
  • solder tape filled with flux 3 on the connecting wire 1 By applying the solder tape filled with flux 3 on the connecting wire 1 to be soldered on the one hand exactly definable amount of solder due to a corresponding solder band width reached or thickness, while on the other hand an exact Position of the solder is done by appropriate arrangement.
  • the process is distinguished from the previous processes compared to the invention by low material costs the previously used solder paste and is also a homogeneous heating compared to a solder feed by tube solder possible.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
EP97114226A 1996-09-09 1997-08-18 Procédé pour souder des fils de connexion à des composants céramiques Withdrawn EP0828262A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1996136577 DE19636577C1 (de) 1996-09-09 1996-09-09 Verfahren zum Anlöten von Anschlußdrähten an keramische Bauelemente
DE19636577 1996-09-09

Publications (1)

Publication Number Publication Date
EP0828262A1 true EP0828262A1 (fr) 1998-03-11

Family

ID=7805055

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97114226A Withdrawn EP0828262A1 (fr) 1996-09-09 1997-08-18 Procédé pour souder des fils de connexion à des composants céramiques

Country Status (3)

Country Link
EP (1) EP0828262A1 (fr)
BR (1) BR9704670A (fr)
DE (1) DE19636577C1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014005494A1 (de) 2014-03-19 2015-09-24 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Verfahren und Vorrichtung zum gleichmäßigen Beschichten eines metallischen oder metallisierten Gewerbeschlauches

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61124024A (ja) * 1984-11-21 1986-06-11 Hitachi Ltd マグネトロンの製造方法
JPS62106652A (ja) * 1985-11-05 1987-05-18 Fujikura Ltd リ−ドピン
US4915286A (en) * 1988-07-13 1990-04-10 Compagnie Europeenne De Composants Electroniques Lcc Method for the soldering of external connection wires to an electronic component

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3915546A (en) * 1971-06-15 1975-10-28 Amp Inc Selectively applied flowable solder apparatus, product and method of fabrication
NL7411079A (nl) * 1974-08-20 1976-02-24 Philips Nv Elektrische condensator met aan de bekleedsels verbonden toevoerorganen.
DE3125711A1 (de) * 1981-06-30 1983-01-20 Siemens AG, 1000 Berlin und 8000 München Verfahren zum verbinden von stromzufuehrungsdraehten mit metallschichten, die sich auf einem elektrischen bauelement befinden
DE8506668U1 (de) * 1985-03-07 1986-04-10 Siemens AG, 1000 Berlin und 8000 München Elektrischer Widerstand mit negativem Temperaturkoeffizienten des Widerstandswertes

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61124024A (ja) * 1984-11-21 1986-06-11 Hitachi Ltd マグネトロンの製造方法
JPS62106652A (ja) * 1985-11-05 1987-05-18 Fujikura Ltd リ−ドピン
US4915286A (en) * 1988-07-13 1990-04-10 Compagnie Europeenne De Composants Electroniques Lcc Method for the soldering of external connection wires to an electronic component

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 010, no. 313 (E - 448) 24 October 1986 (1986-10-24) *
PATENT ABSTRACTS OF JAPAN vol. 011, no. 314 (E - 549) 13 October 1987 (1987-10-13) *

Also Published As

Publication number Publication date
BR9704670A (pt) 1999-03-30
DE19636577C1 (de) 1998-04-09

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