EP0828262A1 - Method of soldering lead wires to ceramic components - Google Patents

Method of soldering lead wires to ceramic components Download PDF

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Publication number
EP0828262A1
EP0828262A1 EP97114226A EP97114226A EP0828262A1 EP 0828262 A1 EP0828262 A1 EP 0828262A1 EP 97114226 A EP97114226 A EP 97114226A EP 97114226 A EP97114226 A EP 97114226A EP 0828262 A1 EP0828262 A1 EP 0828262A1
Authority
EP
European Patent Office
Prior art keywords
solder
tape
wire
soldering
ceramic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97114226A
Other languages
German (de)
French (fr)
Inventor
Oliver Ing. Strallhofer
Ewald Dipl.-Ing. Lampl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Siemens Matsushita Components GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Matsushita Components GmbH and Co KG filed Critical Siemens Matsushita Components GmbH and Co KG
Publication of EP0828262A1 publication Critical patent/EP0828262A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered

Definitions

  • the invention relates to a method for soldering connecting wires of ceramic components.
  • soldering of connecting wires to ceramic components for example, wired PTC resistors (PTC thermistors) for example by a solder application with a solder paste dosage or by feeding tube solder.
  • PTC thermistors wired PTC resistors
  • the object of the present invention is a method for Specify soldering of connecting wires to ceramic components, that can be of high quality and rational and that by means of a homogeneous heating of the soldering process involved components (solder, ceramic, connecting wire) feasible is.
  • This object is achieved in that before a soldering tape provided with a flux the connecting wire to be soldered is applied.
  • the application can be done by means of a mechanical bending process be performed.
  • the invention is based on the following embodiment explained in more detail.
  • a connecting wire 1 is shown on the with the aid of a device 2 movable in the direction of the arrow Solder tape 3 is to be applied.
  • FIG. 2 shows how the device is used 2 the solder tape 3 is bent around the connecting wire 1. With help a counterpart 4 movable in the direction of the arrow Solder strip 3 mechanically attached to the connecting wire.
  • solder tape filled with flux 3 on the connecting wire 1 By applying the solder tape filled with flux 3 on the connecting wire 1 to be soldered on the one hand exactly definable amount of solder due to a corresponding solder band width reached or thickness, while on the other hand an exact Position of the solder is done by appropriate arrangement.
  • the process is distinguished from the previous processes compared to the invention by low material costs the previously used solder paste and is also a homogeneous heating compared to a solder feed by tube solder possible.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The method involves soldering connector wires to ceramic components. Before soldering, a solder tape (3) provided with a flux agent, is applied to the wire (1) to be soldered. The solder band (3) is preferably attached to the wire (1) using a device (2,4) by means of a mechanical bending process. The solder tape (3) is preferably mechanically fastened to the connection wire (1) using a movable device (2) in which the tape (3) and then the wire (1) are laid, and a counter component (4) which moves relative to the device (2) to bend the tape (3).

Description

Die Erfindung betrifft ein Verfahren zum Anlöten von Anschlußdrähten an keramische Bauelemente.The invention relates to a method for soldering connecting wires of ceramic components.

Das Anlöten von Anschlußdrähten an keramische Bauelemente, zum Beispiel bedrahtete PTC-Widerstände (Kaltleiter), geschieht beispielsweise durch einen Lotauftrag mit einer Lotpastendosierung oder durch Zuführen von Röhrenlot. Eine homogene Erwärmung der Komponenten ist bei diesen Verfahren nicht gewährleistet.The soldering of connecting wires to ceramic components, for example, wired PTC resistors (PTC thermistors) for example by a solder application with a solder paste dosage or by feeding tube solder. A homogeneous The heating of the components is not possible with these processes guaranteed.

Aufgabe der vorliegenden Erfindung ist es ein Verfahren zum Einlöten von Anschlußdrähten an keramische Bauelemente anzugeben, das qualitativ hochwertig und rationell erfolgen kann und das mittels einer homogenen Erwärmung der am Lotprozeß beteiligten Komponenten (Lot, Keramik, Anschlußdraht) durchführbar ist.The object of the present invention is a method for Specify soldering of connecting wires to ceramic components, that can be of high quality and rational and that by means of a homogeneous heating of the soldering process involved components (solder, ceramic, connecting wire) feasible is.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß vor dem Anlöten ein mit einem Flußmittel versehenes Lötband auf den zu verlötenden Anschlußdraht aufgebracht wird.This object is achieved in that before a soldering tape provided with a flux the connecting wire to be soldered is applied.

Das Aufbringen kann mittels eines mechanischen Biegevorganges durchgeführt werden.The application can be done by means of a mechanical bending process be performed.

Die Erfindung wird anhand des folgenden Ausführungsbeispieles näher erläutert.The invention is based on the following embodiment explained in more detail.

In der dazugehörenden Zeichnung zeigen

Figur 1
ein Anschlußdraht mit Lotband vor dem Aufbringen und
Figur 2
ein auf den Anschlußdraht aufgebrachtes Lotband.
Show in the accompanying drawing
Figure 1
a connecting wire with solder tape before applying and
Figure 2
a solder tape applied to the lead wire.

In der Figur 1 ist ein Anschlußdraht 1 dargestellt, auf den mit Hilfe einer in Pfeilrichtung bewegbaren Vorrichtung 2 ein Lotband 3 aufgebracht werden soll.In the figure 1, a connecting wire 1 is shown on the with the aid of a device 2 movable in the direction of the arrow Solder tape 3 is to be applied.

In der Figur 2 ist dargestellt, wie mit Hilfe der Vorrichtung 2 das Lotband 3 um den Anschlußdraht 1 gebogen ist. Mit Hilfe eines in Pfeilrichtung bewegbaren Gegenstückes 4 wird das Lotband 3 am Anschlußdraht mechanisch befestigt.FIG. 2 shows how the device is used 2 the solder tape 3 is bent around the connecting wire 1. With help a counterpart 4 movable in the direction of the arrow Solder strip 3 mechanically attached to the connecting wire.

Durch die Aufbringung des mit Flußmittel gefüllten Lotbandes 3 auf den zu verlötenden Anschlußdraht 1 wird einerseits eine exakt definierbare Lotmenge durch eine entsprechende Lotbandbreite bzw. -dicke erreicht, während andererseits eine exakte Position des Lots durch entsprechende Anordnung erfolgt.By applying the solder tape filled with flux 3 on the connecting wire 1 to be soldered on the one hand exactly definable amount of solder due to a corresponding solder band width reached or thickness, while on the other hand an exact Position of the solder is done by appropriate arrangement.

Ein separater Auftrag von Flußmittel ist nicht notwendig, da sich das Flußmittel innerhalb des Lotbandes (3) befindet.A separate application of flux is not necessary because the flux is inside the solder tape (3).

Gegenüber den bisherigen Verfahren zeichnet sich das Verfahren nach der Erfindung durch niedrige Materialkosten gegenüber der bisher verwendeten Lotpaste aus und ferner ist eine homogene Erwärmung gegenüber einer Lotzufuhr durch Röhrenlot möglich.The process is distinguished from the previous processes compared to the invention by low material costs the previously used solder paste and is also a homogeneous heating compared to a solder feed by tube solder possible.

Claims (2)

Verfahren zum Anlöten von Anschlußdrähten an keramische Bauelemente,
dadurch gekennzeichnet,
daß vor dem Anlöten ein mit einem Flußmittel versehenes Lotband (3) auf den zu verlötenden Anschlußdraht (1) aufgebracht wird.Process for soldering connecting wires to ceramic components,
characterized,
that a soldering tape (3) provided with a flux is applied to the connecting wire (1) to be soldered before soldering. Verfahren nach Anspruch 1,
dadurch gekennzeichnet,
daß das Lotband (3) unter Verwendung einer Vorrichtung (2, 4) mittels eines mechanischen Biegevorgangs aufgebracht wird.Method according to claim 1,
characterized,
that the solder tape (3) is applied using a device (2, 4) by means of a mechanical bending process.
EP97114226A 1996-09-09 1997-08-18 Method of soldering lead wires to ceramic components Withdrawn EP0828262A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19636577 1996-09-09
DE1996136577 DE19636577C1 (en) 1996-09-09 1996-09-09 Process for soldering connecting wires to ceramic components

Publications (1)

Publication Number Publication Date
EP0828262A1 true EP0828262A1 (en) 1998-03-11

Family

ID=7805055

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97114226A Withdrawn EP0828262A1 (en) 1996-09-09 1997-08-18 Method of soldering lead wires to ceramic components

Country Status (3)

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EP (1) EP0828262A1 (en)
BR (1) BR9704670A (en)
DE (1) DE19636577C1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014005494A1 (en) 2014-03-19 2015-09-24 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Method and device for uniform coating of a metallic or metallized industrial hose

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61124024A (en) * 1984-11-21 1986-06-11 Hitachi Ltd Manufacture of magnetron
JPS62106652A (en) * 1985-11-05 1987-05-18 Fujikura Ltd Lead pin
US4915286A (en) * 1988-07-13 1990-04-10 Compagnie Europeenne De Composants Electroniques Lcc Method for the soldering of external connection wires to an electronic component

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3915546A (en) * 1971-06-15 1975-10-28 Amp Inc Selectively applied flowable solder apparatus, product and method of fabrication
NL7411079A (en) * 1974-08-20 1976-02-24 Philips Nv ELECTRICAL CAPACITOR WITH SUPPLIES CONNECTED TO THE COVERINGS.
DE3125711A1 (en) * 1981-06-30 1983-01-20 Siemens AG, 1000 Berlin und 8000 München Method for connecting power supply wires to metal layers which are located on an electrical component
DE8506668U1 (en) * 1985-03-07 1986-04-10 Siemens AG, 1000 Berlin und 8000 München Electrical resistance with a negative temperature coefficient of the resistance value

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61124024A (en) * 1984-11-21 1986-06-11 Hitachi Ltd Manufacture of magnetron
JPS62106652A (en) * 1985-11-05 1987-05-18 Fujikura Ltd Lead pin
US4915286A (en) * 1988-07-13 1990-04-10 Compagnie Europeenne De Composants Electroniques Lcc Method for the soldering of external connection wires to an electronic component

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 010, no. 313 (E - 448) 24 October 1986 (1986-10-24) *
PATENT ABSTRACTS OF JAPAN vol. 011, no. 314 (E - 549) 13 October 1987 (1987-10-13) *

Also Published As

Publication number Publication date
DE19636577C1 (en) 1998-04-09
BR9704670A (en) 1999-03-30

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