DE19636577C1 - Process for soldering connecting wires to ceramic components - Google Patents

Process for soldering connecting wires to ceramic components

Info

Publication number
DE19636577C1
DE19636577C1 DE1996136577 DE19636577A DE19636577C1 DE 19636577 C1 DE19636577 C1 DE 19636577C1 DE 1996136577 DE1996136577 DE 1996136577 DE 19636577 A DE19636577 A DE 19636577A DE 19636577 C1 DE19636577 C1 DE 19636577C1
Authority
DE
Germany
Prior art keywords
solder
ceramic components
soldering
connecting wires
soldering connecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1996136577
Other languages
German (de)
Inventor
Oliver Strallhofer
Ewald Lampl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Siemens Matsushita Components GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Matsushita Components GmbH and Co KG filed Critical Siemens Matsushita Components GmbH and Co KG
Priority to DE1996136577 priority Critical patent/DE19636577C1/en
Priority to EP97114226A priority patent/EP0828262A1/en
Priority to BR9704670A priority patent/BR9704670A/en
Application granted granted Critical
Publication of DE19636577C1 publication Critical patent/DE19636577C1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

Die Erfindung betrifft ein Verfahren zum Anlöten von An­ schlußdrähten an keramische Bauelemente, bei dem vor dem An­ löten ein Lotband auf den zu verlötenden Anschlußdraht auf­ gebracht wird.The invention relates to a method for soldering on connecting wires to ceramic components, in which before solder a solder tape onto the connecting wire to be soldered brought.

Das Anlöten von Anschlußdrähten an keramische Bauelemente, zum Beispiel bedrahtete PTC-Widerstände (Kaltleiter), ge­ schieht beispielsweise durch einen Lotauftrag mit einer Lot­ pastendosierung oder durch Zuführen von Röhrenlot. Eine homo­ gene Erwarmung der Komponenten ist bei diesen Verfahren nicht gewährleistet.The soldering of connecting wires to ceramic components, for example wired PTC resistors (PTC thermistors), ge for example, by placing a lot with a lot paste dosing or by feeding tube solder. A homo The components are not genetically heated in these processes guaranteed.

Ein Verfahren der eingangs genannten Art ist aus DE-GM 75 25 064 bekannt.A method of the type mentioned is over DE-GM 75 25 064 known.

Weiterhin ist es aus der DE 31 25 711 A1 bekannt, einen Lötdraht zu verwenden, der ein Flußmittel enthält.Furthermore, it is known from DE 31 25 711 A1, a To use solder wire that contains a flux.

Die DE 85 06 668 U1 beschreibt ein Verfahren zum Anlöten von Anschlußdrähten an keramische Bauelemente (NTC-Wider­ stände).DE 85 06 668 U1 describes a method for soldering of connecting wires to ceramic components (NTC-Wider stands).

Schließlich ist es aus US 39 15 546 bekannt, vorab ein Lot­ band auf Anschlußdrähte aufzubringen.Finally, it is known from US 39 15 546, in advance a solder tape on connecting wires.

Aufgabe der vorliegenden Erfindung ist es, ein Verfahren zum Anlöten von Anschlußdrähten an keramische Bauelemente anzu­ geben, das qualitativ hochwertig und rationell erfolgen kann und das mittels einer homogenen Erwärmung der am Lotprozeß beteiligten Komponenten (Lot, Keramik, Anschlußdraht) durch­ führbar ist. The object of the present invention is to provide a method for Soldering connection wires to ceramic components give, which can be of high quality and rational and that by means of a homogeneous heating of the soldering process involved components (solder, ceramic, connecting wire) through is feasible.  

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß das Lotband mit einem Flußmittel versehen wird, und daß das Lot­ band unter Verwendung einer Vorrichtung mittels eines mecha­ nischen Biegevorgangs aufgebracht wird.This object is achieved in that the Solder tape is provided with a flux, and that the solder tape using a device by means of a mecha African bending process is applied.

Die Erfindung wird anhand des folgenden Ausführungsbeispieles näher erläutert.The invention is based on the following embodiment explained in more detail.

In der dazugehörenden Zeichnung zeigenShow in the accompanying drawing

Fig. 1 ein Anschlußdraht mit Lotband vor dem Aufbringen und Fig. 1 is a connecting wire with solder tape before applying and

Fig. 2 ein auf den Anschlußdraht aufgebrachtes Lotband. Fig. 2 is a solder tape applied to the lead wire.

In der Fig. 1 ist ein Anschlußdraht 1 dargestellt, auf den mit Hilfe einer in Pfeilrichtung bewegbaren Vorrichtung 2 ein Lotband 3 aufgebracht werden soll.In FIG. 1, a lead wire 1 is shown to which by means of a movable device in the direction of arrow 2, a solder strip 3 is to be applied.

In der Fig. 2 ist dargestellt, wie mit Hilfe der Vorrichtung 2 das Lotband 3 um den Anschlußdraht 1 gebogen ist. Mit Hilfe eines in Pfeilrichtung bewegbaren Gegenstückes 4 wird das Lotband 3 am Anschlußdraht mechanisch befestigt.In FIG. 2 is shown how the solder strip 3 is bent around the lead wire 1 by means of the device 2. With the aid of a counterpart 4 which can be moved in the direction of the arrow, the soldering tape 3 is mechanically attached to the connecting wire.

Durch die Aufbringung des mit Flußmittel gefüllten Lotbandes 3 auf den zu verlötenden Anschlußdraht 1 wird einerseits eine exakt definierbare Lotmenge durch eine entsprechende Lotband­ breite bzw. -dicke erreicht, während andererseits eine exakte Position des Lots durch entsprechende Anordnung erfolgt.By the application of the filled flux solder ribbon 3 to be soldered lead wire 1 is an exactly defined amount of solder on the one hand thickness achieved by a corresponding solder strip width and, while on the other hand, an exact position of the solder is carried out by a suitable arrangement.

Ein separater Auftrag von Flußmittel ist nicht notwendig, da sich das Flußmittel innerhalb des Lotbandes (3) befindet.A separate application of flux is not necessary because the flux is within the solder tape ( 3 ).

Gegenüber den bisherigen Verfahren zeichnet sich das Verfah­ ren nach der Erfindung durch niedrige Materialkosten gegen­ über der bisher verwendeten Lotpaste aus und ferner ist eine homogene Erwärmung gegenüber einer Lotzufuhr durch Röhrenlot möglich.The procedure is distinguished from the previous procedures ren according to the invention by low material costs over the previously used solder paste and is also a homogeneous heating compared to a solder feed by tube solder possible.

Claims (1)

Verfahren zum Anlöten von Anschlußdrähten an keramische Bauelemente, bei dem vor dem Anlöten ein Lotband (3) auf den zu verlötenden Anschlußdraht (1) aufgebracht wird, dadurch gekennzeichnet, daß das Lotband (3) mit einem Flußmittel versehen wird, und daß das Lotband (3) unter Verwendung einer Vorrichtung (2, 4) mittels eines mechanischen Biegevorgangs aufgebracht wird.A method of soldering of lead wires to ceramic components, is applied in which, prior to soldering a solder strip (3) to be soldered lead wire (1), characterized in that the solder strip (3) is provided with a flux, and that the solder strip ( 3 ) is applied using a device ( 2 , 4 ) by means of a mechanical bending process.
DE1996136577 1996-09-09 1996-09-09 Process for soldering connecting wires to ceramic components Expired - Fee Related DE19636577C1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE1996136577 DE19636577C1 (en) 1996-09-09 1996-09-09 Process for soldering connecting wires to ceramic components
EP97114226A EP0828262A1 (en) 1996-09-09 1997-08-18 Method of soldering lead wires to ceramic components
BR9704670A BR9704670A (en) 1996-09-09 1997-09-09 Process for welding connecting wires in ceramic construction elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1996136577 DE19636577C1 (en) 1996-09-09 1996-09-09 Process for soldering connecting wires to ceramic components

Publications (1)

Publication Number Publication Date
DE19636577C1 true DE19636577C1 (en) 1998-04-09

Family

ID=7805055

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1996136577 Expired - Fee Related DE19636577C1 (en) 1996-09-09 1996-09-09 Process for soldering connecting wires to ceramic components

Country Status (3)

Country Link
EP (1) EP0828262A1 (en)
BR (1) BR9704670A (en)
DE (1) DE19636577C1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014005494A1 (en) 2014-03-19 2015-09-24 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Method and device for uniform coating of a metallic or metallized industrial hose

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3915546A (en) * 1971-06-15 1975-10-28 Amp Inc Selectively applied flowable solder apparatus, product and method of fabrication
DE7525064U (en) * 1974-08-20 1976-02-12 N.V. Philips' Gloeilampenfabrieken, Eindhoven (Niederlande) ELECTRIC CAPACITOR WITH CONNECTORS ATTACHED TO THE FASTENING
DE3125711A1 (en) * 1981-06-30 1983-01-20 Siemens AG, 1000 Berlin und 8000 München Method for connecting power supply wires to metal layers which are located on an electrical component
DE8506668U1 (en) * 1985-03-07 1986-04-10 Siemens AG, 1000 Berlin und 8000 München Electrical resistance with a negative temperature coefficient of the resistance value

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61124024A (en) * 1984-11-21 1986-06-11 Hitachi Ltd Manufacture of magnetron
JPS62106652A (en) * 1985-11-05 1987-05-18 Fujikura Ltd Lead pin
FR2634319B1 (en) * 1988-07-13 1990-09-07 Europ Composants Electron METHOD FOR WELDING EXTERNAL CONNECTION WIRES TO AN ELECTRONIC COMPONENT

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3915546A (en) * 1971-06-15 1975-10-28 Amp Inc Selectively applied flowable solder apparatus, product and method of fabrication
DE7525064U (en) * 1974-08-20 1976-02-12 N.V. Philips' Gloeilampenfabrieken, Eindhoven (Niederlande) ELECTRIC CAPACITOR WITH CONNECTORS ATTACHED TO THE FASTENING
DE3125711A1 (en) * 1981-06-30 1983-01-20 Siemens AG, 1000 Berlin und 8000 München Method for connecting power supply wires to metal layers which are located on an electrical component
DE8506668U1 (en) * 1985-03-07 1986-04-10 Siemens AG, 1000 Berlin und 8000 München Electrical resistance with a negative temperature coefficient of the resistance value

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014005494A1 (en) 2014-03-19 2015-09-24 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Method and device for uniform coating of a metallic or metallized industrial hose
CN106102987A (en) * 2014-03-19 2016-11-09 Few汽车电器厂有限责任两合公司 Method and apparatus for coating uniform to metal or metallized fabric flexible pipe

Also Published As

Publication number Publication date
EP0828262A1 (en) 1998-03-11
BR9704670A (en) 1999-03-30

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Legal Events

Date Code Title Description
8100 Publication of the examined application without publication of unexamined application
D1 Grant (no unexamined application published) patent law 81
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: EPCOS AG, 81541 MUENCHEN, DE

8339 Ceased/non-payment of the annual fee