EP0801595B1 - Schalwandler und verfahren zu dessen herstellung - Google Patents

Schalwandler und verfahren zu dessen herstellung Download PDF

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Publication number
EP0801595B1
EP0801595B1 EP96934953A EP96934953A EP0801595B1 EP 0801595 B1 EP0801595 B1 EP 0801595B1 EP 96934953 A EP96934953 A EP 96934953A EP 96934953 A EP96934953 A EP 96934953A EP 0801595 B1 EP0801595 B1 EP 0801595B1
Authority
EP
European Patent Office
Prior art keywords
acoustic probe
probe according
piezoelectric
acoustic
conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP96934953A
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English (en)
French (fr)
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EP0801595A1 (de
Inventor
Jean-Marc Bureau
François Bernard
Serge Calisti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
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Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of EP0801595A1 publication Critical patent/EP0801595A1/de
Application granted granted Critical
Publication of EP0801595B1 publication Critical patent/EP0801595B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/0629—Square array
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base

Definitions

  • the field of the invention is that of acoustic transducers can be used in particular in medical or underwater imaging.
  • an acoustic probe includes a set of piezoelectric transducers connected to a device control electronics via a network interconnection. These piezoelectric transducers emit waves acoustic which after reflection on a given medium provide information concerning said environment. Acoustic waves emitted not more towards the external environment to be analyzed, but in the opposite direction disrupt the response of the environment making interposition essential an acoustic wave absorbing medium between the transducers piezoelectric and the electronic device. The presence of this element intermediary makes the interconnection of all the transducers.
  • the dielectric substrates are flexible printed circuits. They can advantageously include components connected at the input to the N conductive lines and at the output at N S conductive lines, N S being less than N.
  • the pitch P ' N can advantageously be increasing along an axis D z perpendicular to the plane defined by the directions D x and D y .
  • the pitch P ′ M can also advantageously be increasing in said direction D z .
  • steps p N and p M can be equal.
  • the sound absorbing material can typically be a epoxy resin charged with particles having the effect of absorbing or scatter acoustic waves, such as tungsten particles, from silica, polymer or air bubbles.
  • the dielectric substrates can advantageously be printed circuits. These may in particular be flexible circuits produced at from polyimide films. These printed circuits can advantageously include components to reduce the number of connections to the control and signal processing device.
  • the conductive tracks can be produced from the depot a metal layer, followed by an etching step to define said tracks.
  • the acoustic probe according to the invention includes a transducer consisting of a matrix (linear or two-dimensional preferential) of piezoelectric sensors transferred to a matrix of interconnection pads opposite.
  • This matrix interconnection consists of ends of metal tracks emerging on one side of an interconnection network described below and named "backing". The opposite ends of the metal tracks are connected to an electronic control and analysis device.
  • the interconnection network can be implemented as follows:
  • M dielectric substrates are used, on which N conductive tracks have been produced along an axis D x .
  • Each substrate has a window locally leaving the conductive tracks bare.
  • All of the M substrates are aligned and stacked in a direction D y as illustrated in FIG. 1.
  • a stack of M dielectric substrates is thus obtained, said stack having a cavity comprising MxN conductive tracks.
  • This cavity is filled with a curable resin that is electrically insulating and has the desired acoustic attenuation properties.
  • the stack is cut along a plane P C perpendicular to the axis of the tracks, at the level of the preformed cavity as illustrated in FIG. 2, in order to produce a surface made up of MxN sections of tracks which are flush perpendicularly the resin.
  • the entire surface consisting of the MxN track sections is metallized.
  • a layer of piezoelectric material which may be of the PZT type, and possibly an acoustic adaptation layer of the quarter-wave plate type, is applied thereto. All of these layers and of the metallization are then cut for example by sawing so as to define the matrix of transducer pads T ij independent of each other. The cutting can be stopped on the surface of the resin and the control of this etching does not require extreme precision, making this process particularly interesting.
  • This type of process makes it possible, from a narrow section of conductive track, to align and define a conductive interconnection surface, as wide as the base of a piezoelectric transducer.
  • the interconnection network thus developed comprises two parts joined, one being based on sound absorbing material (part 1), the other being based on dielectric (part 2), the whole of the two parts including the conductive tracks.
  • the dielectric substrates can advantageously be flexible printed circuits comprising at one of their ends conductive tracks; an example of this type of printed circuit and illustrated in FIG. 3.
  • the pitch p ' N of the tracks and the no p ' M of stacking of the substrates can advantageously increase when one moves away from said end.
  • the pitch p ' N of the tracks of the printed circuits can easily be controlled by conventional photolithography and etching techniques.
  • the widening of the stacking pitch p ' M is directly controlled by the use of flexible circuits.
  • the configuration here proposed for backing allows both offset the connection of the matrix by a certain distance (thanks to sound absorbing material) and explode the geometry to allow the cable transfer (welding of coaxial cables at the rate of a cable by element).
  • the printed circuits used in the invention can advantageously be of the type illustrated in FIG. 6. It is a printed circuit on which N metallic input tracks are connected to a chip, with a greater number of entries than the number of outputs directed to the control and signal processing device.
  • components can be directly mounted on the printed circuit for example by wire wiring, TAB (Tape Automated Bonding) or flip-chip technology process perfectly controlled and reliable.
  • TAB Tunnel Automated Bonding
  • flip-chip technology perfectly controlled and reliable.
  • the number of contacts at the other end backing can be greatly reduced.
  • deposit is made of a conductive layer for example by vacuum metallization on which is deposited a blade of piezoelectric material of the PZT type, by collage.
  • the acoustic adaptation blades are glued in the same way.
  • the underside of the first blade is metallized, which allows bring the masses back to the edges of the matrix.
  • FIG. 7 illustrates these different process steps leading to obtaining MxN piezoelectric elements T ij , covered with L i quarter-wave plates.
  • part 1 of the interconnection network is shown, with regard to the part supporting the various transducers.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Claims (11)

  1. Schallsonde, mit einer Matrix aus M piezoelektrischen Meßwandlern in einer Richtung (Dx) und N piezoelektrischen Meßwandlern in einer zu (Dx) senkrechten Richtung (Dy), die auf der Oberfläche eines schallabsorbierenden Materials verteilt sind, und einem Verbindungsnetz, das die Schallmeßwandler mit einer elektronischen Steuer- und Signalverarbeitungsvorrichtung verbindet, dadurch gekennzeichnet, daß das Verbindungsnetz enthält:
    einen ersten Teil (1), in dem M × N Leiterbahnen einen mit den M × N piezoelektrischen Meßwandlern in Kontakt befindlichen Abschnitt besitzen und innerhalb des schallabsorbierenden Materials in der Richtung (Dx) mit einer Schrittweite (PN) und in der Richtung (Dy) mit einer Schrittweite (PM) verteilt sind;
    einen zweiten Teil (2), in dem die M × N Leiterbahnen auf M dielektrischen Substraten verteilt sind, die mit einer Schrittweite (P'M) beabstandet sind und jeweils N Bahnen, die mit einer Schrittweite (P'N) verteilt sind, aufweisen.
  2. Schallsonde nach Anspruch 1, dadurch gekennzeichnet, daß die M dielektrischen Substrate flexible gedruckte Schaltungen sind.
  3. Schallsonde nach einem der Ansprüche 1 oder 2, dadurch gekennzeichnet, daß die Schrittweite (P'N) längs einer Achse, die zu der durch die Richtungen (Dx) und (Dy) definierten Ebene senkrecht ist, zunimmt.
  4. Schallsonde nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die Schrittweite (P'M) längs einer Achse, die zu der durch die Richtungen (Dx) und (Dy) definierten Ebene senkrecht ist, zunimmt.
  5. Schallsonde nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß die M Substrate gedruckte Schaltungen sind.
  6. Schallsonde nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß die M Substrate Komponenten enthalten, die mit ihrem Eingang mit N Leitungen und mit ihrem Ausgang Ns Leitungen verbunden sind, wobei Ns kleiner als N ist.
  7. Schallsonde nach Anspruch 5, dadurch gekennzeichnet, daß die gedruckten Schaltungen flexible Polyimid-Folien sind.
  8. Schallsonde nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, daß das schallabsorbierende Material ein dotiertes Epoxidharz ist.
  9. Verfahren zur Herstellung einer Schallsonde, die eine Matrix aus M × N piezoelektrischen Elementen enthält, die auf der Oberfläche einer Schalldämpfungsschicht verteilt sind, wobei die Elemente mit einer elektronischen Steuer- und Signalverarbeiungsvorrichtung über ein Verbindungsnetz verbunden sind, dadurch gekennzeichnet, daß die Herstellung des Verbindungsnetzes die folgenden Schritte enthält:
    Herstellen von M dielektrischen Substraten, wovon auf jedem N Leiterbahnen und ein Fenster verwirklicht sind, das die Leiterbahnen lokal freilegt;
    Stapeln von M dielektrischen Substraten, was einen Hohlraum ergibt, der dem Stapel aus M Fenstern entspricht;
    Füllen des vorgeformten Hohlraums mit einem elektrisch isolierenden und schallabsorbierenden Material;
    Schneiden des Stapels aus M dielektrischen Substraten auf Höhe einer Ebene (PC), die sich in dem mit dem isolierenden, schallabsorbierenden Material gefüllten Hohlraum befindet.
  10. Verfahren zur Herstellung einer Schallsonde nach Anspruch 9, dadurch gekennzeichnet, daß die M dielektrischen Träger gedruckte Schaltungen sind.
  11. Verfahren zur Herstellung einer Schallsonde nach einem der Ansprüche 9 oder 10, dadurch gekennzeichnet, daß es enthält:
    Aufbringen einer leitenden Schicht auf der Oberfläche des Teils (1) des Verbindungsnetzes;
    Aufkleben einer Schicht aus piezoelektrischem Material;
    Schneiden der leitenden Schicht und der piezoelektrischen Schicht längs N-1 Richtungen Dy;
    Aufkleben eines Viertelwellenlängenplättchens auf die gesamte Oberfläche der in N Elemente geschnittenen piezoelektrischen Schicht;
    Schneiden der drei Dicken der leitenden Schicht, der piezoelektrischen Schicht bzw. des Viertelwellenlängenplättchens längs M-1 Richtungen (Dx).
EP96934953A 1995-11-03 1996-10-22 Schalwandler und verfahren zu dessen herstellung Expired - Lifetime EP0801595B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9512999A FR2740933B1 (fr) 1995-11-03 1995-11-03 Sonde acoustique et procede de realisation
FR9512999 1995-11-03
PCT/FR1996/001650 WO1997017145A1 (fr) 1995-11-03 1996-10-22 Sonde acoustique et procede de realisation

Publications (2)

Publication Number Publication Date
EP0801595A1 EP0801595A1 (de) 1997-10-22
EP0801595B1 true EP0801595B1 (de) 1999-08-18

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ID=9484205

Family Applications (1)

Application Number Title Priority Date Filing Date
EP96934953A Expired - Lifetime EP0801595B1 (de) 1995-11-03 1996-10-22 Schalwandler und verfahren zu dessen herstellung

Country Status (7)

Country Link
US (1) US6044533A (de)
EP (1) EP0801595B1 (de)
JP (1) JP3766978B2 (de)
KR (1) KR100414141B1 (de)
DE (1) DE69603829D1 (de)
FR (1) FR2740933B1 (de)
WO (1) WO1997017145A1 (de)

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Publication number Priority date Publication date Assignee Title
FR2756447B1 (fr) 1996-11-26 1999-02-05 Thomson Csf Sonde acoustique multielements comprenant une electrode de masse commune
FR2770932B1 (fr) 1997-11-07 2001-11-16 Thomson Csf Procede de fabrication d'une sonde acoustique
FR2779575B1 (fr) 1998-06-05 2003-05-30 Thomson Csf Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication
FR2789822B1 (fr) 1999-02-12 2001-06-08 Thomson Csf Dispositif a ondes de surface connecte a une embase avec un adhesif conducteur
FR2799883B1 (fr) 1999-10-15 2003-05-30 Thomson Csf Procede d'encapsulation de composants electroniques
JP4521126B2 (ja) * 2000-02-02 2010-08-11 株式会社東芝 二次元アレイ型超音波プローブ
US6467138B1 (en) 2000-05-24 2002-10-22 Vermon Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same
FR2810907B1 (fr) * 2000-06-30 2002-10-31 Thomson Csf Procede de fabrication d'une sonde acoustique multielements utilisant une nouvelle methode de realisation de la masse electrique
FR2818170B1 (fr) * 2000-12-19 2003-03-07 Thomson Csf Procede de fabrication d'une sonde acoustique multielements utilisant un film polymere metallise et ablate comme plan de masse
FR2819143B1 (fr) * 2000-12-28 2003-03-07 Thomson Csf Procede de realisation de plots de connexion sur un circuit imprime
JP4079658B2 (ja) * 2002-03-05 2008-04-23 株式会社リコー ２値化ウォブル信号を生成する回路、ライトクロック生成回路、２値化ウォブル信号を生成する方法、ライトクロック生成方法及び光ディスク装置
FR2837636B1 (fr) * 2002-03-19 2004-09-24 Thales Sa Dispositif a ondes acoustiques d'interface en tantalate de lithium
JP4222467B2 (ja) * 2002-04-18 2009-02-12 テイカ株式会社 コンポジット圧電体およびその製造方法
JP3856380B2 (ja) * 2002-04-26 2006-12-13 テイカ株式会社 コンポジット圧電振動子およびその製造方法
JP4503347B2 (ja) * 2004-04-28 2010-07-14 日本電波工業株式会社 超音波探触子の製造方法
CN101102853B (zh) * 2005-01-11 2010-12-08 皇家飞利浦电子股份有限公司 用于(多个)微束形成器的重分布互连和医学超声系统
JP4621530B2 (ja) * 2005-04-05 2011-01-26 株式会社東芝 超音波トランスデューサの製造方法及び超音波トランスデューサ
JP4532392B2 (ja) * 2005-11-14 2010-08-25 アロカ株式会社 超音波探触子及びそれに用いるバッキング
JP4351229B2 (ja) 2006-06-28 2009-10-28 ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー 超音波探触子の製造方法
US7687976B2 (en) * 2007-01-31 2010-03-30 General Electric Company Ultrasound imaging system
US7557489B2 (en) * 2007-07-10 2009-07-07 Siemens Medical Solutions Usa, Inc. Embedded circuits on an ultrasound transducer and method of manufacture
JP5243311B2 (ja) * 2009-03-09 2013-07-24 ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー フレキシブルプリント基板、超音波探触子および超音波探触子の製造方法
JP2012075555A (ja) * 2010-09-30 2012-04-19 Advantest Corp 変換器および測定装置
JP5923205B1 (ja) 2015-07-07 2016-05-24 日立アロカメディカル株式会社 超音波探触子
KR20180068586A (ko) * 2016-12-14 2018-06-22 삼성메디슨 주식회사 초음파 진단 장치용 프로브

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GB1530783A (en) * 1976-01-30 1978-11-01 Emi Ltd Ultra-sonic pickup device
EP0145429B1 (de) * 1983-12-08 1992-02-26 Kabushiki Kaisha Toshiba Gebogene lineare Ultraschallwandleranordnung
DE3623520A1 (de) * 1985-07-15 1987-01-22 Advanced Tech Lab Phasengesteuerter ultraschall-gruppenwandler
JP2847575B2 (ja) * 1990-10-30 1999-01-20 日本電波工業株式会社 超音波深触子
JP3040554B2 (ja) * 1991-10-08 2000-05-15 ジーイー横河メディカルシステム株式会社 超音波探触子
US5311095A (en) * 1992-05-14 1994-05-10 Duke University Ultrasonic transducer array
JP3138104B2 (ja) * 1993-03-17 2001-02-26 三洋電機株式会社 電子部品自動装着装置
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US5592730A (en) * 1994-07-29 1997-01-14 Hewlett-Packard Company Method for fabricating a Z-axis conductive backing layer for acoustic transducers using etched leadframes

Also Published As

Publication number Publication date
FR2740933A1 (fr) 1997-05-09
JPH10512680A (ja) 1998-12-02
EP0801595A1 (de) 1997-10-22
WO1997017145A1 (fr) 1997-05-15
DE69603829D1 (de) 1999-09-23
JP3766978B2 (ja) 2006-04-19
FR2740933B1 (fr) 1997-11-28
US6044533A (en) 2000-04-04
KR980700894A (ko) 1998-04-30
KR100414141B1 (ko) 2004-03-30

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