EP1084000B1 - Schalwandler aus mehreren elementen mit leitfähiger verbundschicht und verfahren zur herstellung - Google Patents

Schalwandler aus mehreren elementen mit leitfähiger verbundschicht und verfahren zur herstellung Download PDF

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Publication number
EP1084000B1
EP1084000B1 EP99922247A EP99922247A EP1084000B1 EP 1084000 B1 EP1084000 B1 EP 1084000B1 EP 99922247 A EP99922247 A EP 99922247A EP 99922247 A EP99922247 A EP 99922247A EP 1084000 B1 EP1084000 B1 EP 1084000B1
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EP
European Patent Office
Prior art keywords
film
acoustic
piezoelectric
elementary
probe according
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Expired - Lifetime
Application number
EP99922247A
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English (en)
French (fr)
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EP1084000A1 (de
Inventor
Ngoc-Tuan Thomson-CSF NGUYEN
Nicolas Thomson-CSF SERES
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Thales SA
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Thales SA
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/0629—Square array

Definitions

  • the field of the invention is that of acoustic transducers can be used in particular in medical or underwater imaging, or in non-destructive testing.
  • an acoustic probe comprises a set of piezoelectric transducers connected to an electrode device control via an interconnection network.
  • These piezoelectric transducers emit waves acoustic which after reflection in a given environment, provide information concerning said environment.
  • probes are composed of many piezoelectric elements which can be excited independently.
  • the method of making such probes has been described by the plaintiff in several documents especially for one-dimensional probes in the European patent 0 190 948 or for two-dimensional probes in the French patent FR-A-2 702 309.
  • This method consists in cutting an assembly made up of acoustic adaptation blades, a piezoelectric ceramic blade, an electrical circuit comprising metal tracks generally located on the surface of an acoustic support known by the Anglo-Saxon term of "Backing”.
  • the cutting thus makes it possible to define transducers that can be excited independently. Indeed, each transducer is connected to an electrical circuit track (polyimide film with metallized tracks or tracks cut from a metal sheet) to allow electrical excitation.
  • the elementary transducers are subcut into several piezoelectric sub-elements, thus mechanically separated but connected at the same electrical point.
  • the sub-cuts are obtained by cutting beyond the metal tracks as illustrated in Figure 1 which shows a view in section of an example of a unidirectional phased array probe.
  • a backing 1 supports an electrical circuit 2 with conductive tracks pi1, elementary transducers ti1, comprising themselves ti1k sub-elements.
  • the width of the pi1 tracks is of the order of 100 ⁇ m, which limits the number of sub-elements Piezoelectric.
  • the cut tracks are fragile and support poor electrical and mechanical stress.
  • the piezoelectric elements also include acoustic adaptation elements with different impedance L1i1k and L2i1k, the L2i1k elements that can be metallized on the underside to allow a mass recovery.
  • Mass recovery can also be achieved by intercalating between the L2i1k blade and the ceramic a metallic thin film or using, in the case of one-dimensional probes, L1i1k and L2i1k slides smaller dimensions than ceramic making it accessible the ground electrode on the ends of the ceramic. In this last case, the mass is recovered by welding or sticking a metallic film on the "exposed" ends of the ceramic.
  • the present invention offers an acoustic probe comprising a film of composite material driver.
  • the invention relates to an acoustic probe comprising elementary piezoelectric transducers and a circuit electric with metal tracks, so as to connect to the at least one metal track to at least one elementary transducer, each elementary transducer consisting of piezoelectric sub-elements mechanically separated and connected to the same track, characterized in that it further comprises a film of conductive composite material located between the electrical circuit and the elementary transducers, the sub-elements piezoelectric of the same elementary transducer being mechanically separated by interstices extending into said movie.
  • the electrical circuit of the acoustic probe according to the invention is affixed to a backing of impedance adjusted to serve acoustic support.
  • the film of conductive composite material can include an organic material of epoxy resin type, which can in particular be charged with conductive metal particles of the type silver, copper, nickel.
  • the steps of cutting and sub-cutting can be done with a saw diamond in one step.
  • the acoustic probe according to the invention includes Tij piezoelectric elementary transducers, connected by means of a film of composite material conducting to tracks metal located on the surface of an electrical circuit located on a backing.
  • These adaptation blades can be of the polymer type loaded with mineral particles whose proportions are adjusted to obtain the desired acoustic properties.
  • these blades are put in shape by molding or machining then assembled by gluing on one of the faces of piezoelectric transducers.
  • each elementary piezoelectric transducer must be connected on one side to ground and on the other side to a positive contact (also called hot spot).
  • a positive contact also called hot spot.
  • the mass is located towards the medium of propagation, i.e. that it must be on the side of the acoustic adaptation elements.
  • the ground electrode can be a metallic layer, its position may depend on the nature of the probe, i.e. if it is a probe unidirectional or bidirectional.
  • the film of conductive composite material can be composed a mixture of epoxy resin and metallic particles (silver, copper, nickel ...) with a charge rate between 50% and 80%, by volume depending on the desired acoustic properties.
  • the film did not influence on the acoustic properties of the probe because its impedance is close to that of the backing and its thickness (of the order of 20 to 100 ⁇ m) remains weak compared to the ultrasonic wavelength generated by the material piezoelectric.
  • the acoustic adaptation blades are bonded to the surface of the layer of piezoelectric material using a epoxy type glue for example.
  • the lower acoustic adaptation blade can be metallized with level of its underside so as to ensure a recovery of mass in periphery of the probe.
  • the assembly of the backing comprising the electrical circuit, of the film conductive composite and the piezoelectric material layer can typically be identical to that previously cited in the case of a unidirectional probe.
  • a ground plan in this type of probe we can proceed as in the process described by the applicant in the French patent application published under No. 2,756,447, or in integrating a ground plane between the transducer elements and the blades acoustic adaptation.
  • the backing / conductive composite film / piezoelectric layer assembly after having carried out the backing / conductive composite film / piezoelectric layer assembly, cuts and sub-cuts to define the elements Tij and Tijk using a diamond saw along two perpendicular axes.
  • the assembly thus formed is covered by a ground electrode conductive M, affixed then glued, it can typically be a sheet metallic or metallized polymer film.
  • this cutting operation can be carried out by laser.
  • the laser used can be, for example, an infrared laser of the CO 2 type or a UV laser of the Excimer type or of the tripled or quadrupled YAG type.

Claims (12)

  1. Akustische Sonde mit piezoelektrischen Elementarwandlern (Tij) und einer elektrischen Schaltung (2), die Metallbahnen (Pij) umfasst, so dass zumindest eine Metallbahn mit zumindest einem Elementarwandler verbunden ist, wobei jeder Elementarwandler aus piezoelektrischen Unterelementen (Tijk) besteht, die mechanisch getrennt sind und mit ein und derselben Bahn verbunden sind, dadurch gekennzeichnet, dass sie außerdem eine Verbundmaterialschicht (3) umfasst, die zwischen der elektrischen Schaltung (2) und den Elementarwandlern liegt, wobei die piezoelektrischen Unterelemente (Tijk) ein und desselben Elementarwandlers (Tij) durch Zwischenräume getrennt sind, die sich bis in die Schicht fortsetzen.
  2. Akustische Sonde nach Anspruch 1, dadurch gekennzeichnet, dass sie einen als "Backing" bezeichneten akustischen Träger (1) umfasst, wobei die Verbundmaterialschicht (3) akustische Eigenschaften nahe denjenigen des Backing aufweist.
  3. Akustische Sonde nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Verbundmaterialschicht (3) leitende Partikel enthält, deren Größe sehr viel kleiner als die durch die Sonde erzeugte Ultraschallwellenlänge ist.
  4. Akustische Sonde nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass die leitende Verbundschicht (3) eine Schicht aus einem organischen Material von der Art eines Epoxidharzes oder eines Polyimids ist, das leitende Partikel enthält.
  5. Akustische Sonde nach Anspruch 4, dadurch gekennzeichnet, dass die leitenden Partikel Metallpartikel des Typs Silber, Kupfer, Nickel sind.
  6. Akustische Sonde nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass die Verbundmaterialschicht (3) einen leitfähigen Mengenanteil umfasst, der zwischen 50 Volumen% und 80 Volumen% liegt.
  7. Akustische Sonde nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass die Dicke der Verbundmaterialschicht in der Größenordnung von mehreren zehn Mikrometern liegt.
  8. Akustische Sonde nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass die Elementarwandler (Tij) durch Zwischenräume elektrisch getrennt sind, die sich bis in die elektrische Schaltung fortsetzen.
  9. Verfahren zur Herstellung einer akustischen Sonde nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass es außerdem die folgenden Schritte umfasst:
    Zusammenfügung zumindest eines Plättchens aus piezoelektrischem Material, einer leitenden Verbundmaterialschicht (3) und einer elektrischen Schaltung (2), die Metallbahnen umfasst,
    das Schneiden des Plättchens aus piezoelektrischem Material und der leitenden Verbundmaterialschicht (3), um piezoelektrische Elementarwandler (Tij) abzugrenzen, die elektrisch getrennt sind,
    das Unter-Zerschneiden der Elementarwandler (Tij) und eines Teils der Verbundmaterialschicht, um piezoelektrische Unterelemente (Tijk) abzugrenzen, die mechanisch getrennt und elektrisch verbunden sind.
  10. Verfahren zur Herstellung eines Schallwandlers nach Anspruch 9, dadurch gekennzeichnet, dass die Schritte des Schneidens und Unter-Zerschneidens mit einer Diamantsäge ausgeführt werden.
  11. Verfahren zur Herstellung eines Schallwandlers nach Anspruch 9 oder 10, dadurch gekennzeichnet, dass die Schritte des Schneidens und Unter-Zerschneidens gleichzeitig ausgeführt werden.
  12. Herstellungsverfahren nach einem der Ansprüche 9 bis 10, dadurch gekennzeichnet, dass die elektrische Schaltung (2) an der Oberfläche eines akustischen Trägers liegt, wobei der Schnitt zur Abgrenzung der piezoelektrischen Elementarträger bis in den akustischen Träger erfolgt.
EP99922247A 1998-06-05 1999-06-01 Schalwandler aus mehreren elementen mit leitfähiger verbundschicht und verfahren zur herstellung Expired - Lifetime EP1084000B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9807094 1998-06-05
FR9807094A FR2779575B1 (fr) 1998-06-05 1998-06-05 Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication
PCT/FR1999/001284 WO1999064169A1 (fr) 1998-06-05 1999-06-01 Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication

Publications (2)

Publication Number Publication Date
EP1084000A1 EP1084000A1 (de) 2001-03-21
EP1084000B1 true EP1084000B1 (de) 2004-10-13

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EP99922247A Expired - Lifetime EP1084000B1 (de) 1998-06-05 1999-06-01 Schalwandler aus mehreren elementen mit leitfähiger verbundschicht und verfahren zur herstellung

Country Status (7)

Country Link
US (1) US6522051B1 (de)
EP (1) EP1084000B1 (de)
JP (1) JP4288002B2 (de)
KR (1) KR100577036B1 (de)
CN (1) CN1217749C (de)
FR (1) FR2779575B1 (de)
WO (1) WO1999064169A1 (de)

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FR2810907B1 (fr) * 2000-06-30 2002-10-31 Thomson Csf Procede de fabrication d'une sonde acoustique multielements utilisant une nouvelle methode de realisation de la masse electrique
FR2818170B1 (fr) * 2000-12-19 2003-03-07 Thomson Csf Procede de fabrication d'une sonde acoustique multielements utilisant un film polymere metallise et ablate comme plan de masse
US20050167188A1 (en) * 2001-02-15 2005-08-04 Integral Technologies, Inc. Low cost acoustical structures manufactured from conductive loaded resin-based materials
US20050167189A1 (en) * 2001-02-15 2005-08-04 Integral Technologies, Inc. Low cost acoustical structures manufactured from conductive loaded resin-based materials
KR100394876B1 (ko) * 2001-06-05 2003-08-19 주식회사 나노위즈 초음파 탐촉자 제조방법
US20070046149A1 (en) * 2005-08-23 2007-03-01 Zipparo Michael J Ultrasound probe transducer assembly and production method
WO2009055767A2 (en) * 2007-10-26 2009-04-30 Trs Technologies, Inc. Micromachined piezoelectric ultrasound transducer arrays
US20090183350A1 (en) * 2008-01-17 2009-07-23 Wetsco, Inc. Method for Ultrasound Probe Repair
DE102008055116A1 (de) * 2008-12-23 2010-07-01 Robert Bosch Gmbh Verfahren zur Herstellung eines Ultraschallwandlers
JP6102622B2 (ja) * 2013-08-07 2017-03-29 コニカミノルタ株式会社 超音波探触子
US10265729B2 (en) * 2015-02-06 2019-04-23 Olympus Scientific Solutions Americas Inc. Phased array ultrasonic transducers with solderless stack bonding assembly
JP5923205B1 (ja) * 2015-07-07 2016-05-24 日立アロカメディカル株式会社 超音波探触子
CN105170435B (zh) * 2015-09-23 2017-12-22 深圳先进技术研究院 高频超声换能器及其制备方法
US10843228B2 (en) 2016-01-19 2020-11-24 Sound Technology Inc. Ultrasound transducer array interconnect
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Also Published As

Publication number Publication date
CN1304340A (zh) 2001-07-18
CN1217749C (zh) 2005-09-07
EP1084000A1 (de) 2001-03-21
JP4288002B2 (ja) 2009-07-01
JP2002517310A (ja) 2002-06-18
FR2779575A1 (fr) 1999-12-10
KR100577036B1 (ko) 2006-05-08
KR20010043944A (ko) 2001-05-25
FR2779575B1 (fr) 2003-05-30
WO1999064169A1 (fr) 1999-12-16
US6522051B1 (en) 2003-02-18

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