EP1084000B1 - Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication - Google Patents
Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication Download PDFInfo
- Publication number
- EP1084000B1 EP1084000B1 EP99922247A EP99922247A EP1084000B1 EP 1084000 B1 EP1084000 B1 EP 1084000B1 EP 99922247 A EP99922247 A EP 99922247A EP 99922247 A EP99922247 A EP 99922247A EP 1084000 B1 EP1084000 B1 EP 1084000B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- film
- acoustic
- piezoelectric
- elementary
- probe according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000523 sample Substances 0.000 title claims description 42
- 239000002131 composite material Substances 0.000 title claims description 30
- 238000000034 method Methods 0.000 title claims description 8
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 238000005520 cutting process Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000011368 organic material Substances 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 238000002604 ultrasonography Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 25
- 230000006978 adaptation Effects 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 5
- 230000002457 bidirectional effect Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 241000287107 Passer Species 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009830 intercalation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000009659 non-destructive testing Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/0629—Square array
Definitions
- the field of the invention is that of acoustic transducers can be used in particular in medical or underwater imaging, or in non-destructive testing.
- an acoustic probe comprises a set of piezoelectric transducers connected to an electrode device control via an interconnection network.
- These piezoelectric transducers emit waves acoustic which after reflection in a given environment, provide information concerning said environment.
- probes are composed of many piezoelectric elements which can be excited independently.
- the method of making such probes has been described by the plaintiff in several documents especially for one-dimensional probes in the European patent 0 190 948 or for two-dimensional probes in the French patent FR-A-2 702 309.
- This method consists in cutting an assembly made up of acoustic adaptation blades, a piezoelectric ceramic blade, an electrical circuit comprising metal tracks generally located on the surface of an acoustic support known by the Anglo-Saxon term of "Backing”.
- the cutting thus makes it possible to define transducers that can be excited independently. Indeed, each transducer is connected to an electrical circuit track (polyimide film with metallized tracks or tracks cut from a metal sheet) to allow electrical excitation.
- the elementary transducers are subcut into several piezoelectric sub-elements, thus mechanically separated but connected at the same electrical point.
- the sub-cuts are obtained by cutting beyond the metal tracks as illustrated in Figure 1 which shows a view in section of an example of a unidirectional phased array probe.
- a backing 1 supports an electrical circuit 2 with conductive tracks pi1, elementary transducers ti1, comprising themselves ti1k sub-elements.
- the width of the pi1 tracks is of the order of 100 ⁇ m, which limits the number of sub-elements Piezoelectric.
- the cut tracks are fragile and support poor electrical and mechanical stress.
- the piezoelectric elements also include acoustic adaptation elements with different impedance L1i1k and L2i1k, the L2i1k elements that can be metallized on the underside to allow a mass recovery.
- Mass recovery can also be achieved by intercalating between the L2i1k blade and the ceramic a metallic thin film or using, in the case of one-dimensional probes, L1i1k and L2i1k slides smaller dimensions than ceramic making it accessible the ground electrode on the ends of the ceramic. In this last case, the mass is recovered by welding or sticking a metallic film on the "exposed" ends of the ceramic.
- the present invention offers an acoustic probe comprising a film of composite material driver.
- the invention relates to an acoustic probe comprising elementary piezoelectric transducers and a circuit electric with metal tracks, so as to connect to the at least one metal track to at least one elementary transducer, each elementary transducer consisting of piezoelectric sub-elements mechanically separated and connected to the same track, characterized in that it further comprises a film of conductive composite material located between the electrical circuit and the elementary transducers, the sub-elements piezoelectric of the same elementary transducer being mechanically separated by interstices extending into said movie.
- the electrical circuit of the acoustic probe according to the invention is affixed to a backing of impedance adjusted to serve acoustic support.
- the film of conductive composite material can include an organic material of epoxy resin type, which can in particular be charged with conductive metal particles of the type silver, copper, nickel.
- the steps of cutting and sub-cutting can be done with a saw diamond in one step.
- the acoustic probe according to the invention includes Tij piezoelectric elementary transducers, connected by means of a film of composite material conducting to tracks metal located on the surface of an electrical circuit located on a backing.
- These adaptation blades can be of the polymer type loaded with mineral particles whose proportions are adjusted to obtain the desired acoustic properties.
- these blades are put in shape by molding or machining then assembled by gluing on one of the faces of piezoelectric transducers.
- each elementary piezoelectric transducer must be connected on one side to ground and on the other side to a positive contact (also called hot spot).
- a positive contact also called hot spot.
- the mass is located towards the medium of propagation, i.e. that it must be on the side of the acoustic adaptation elements.
- the ground electrode can be a metallic layer, its position may depend on the nature of the probe, i.e. if it is a probe unidirectional or bidirectional.
- the film of conductive composite material can be composed a mixture of epoxy resin and metallic particles (silver, copper, nickel ...) with a charge rate between 50% and 80%, by volume depending on the desired acoustic properties.
- the film did not influence on the acoustic properties of the probe because its impedance is close to that of the backing and its thickness (of the order of 20 to 100 ⁇ m) remains weak compared to the ultrasonic wavelength generated by the material piezoelectric.
- the acoustic adaptation blades are bonded to the surface of the layer of piezoelectric material using a epoxy type glue for example.
- the lower acoustic adaptation blade can be metallized with level of its underside so as to ensure a recovery of mass in periphery of the probe.
- the assembly of the backing comprising the electrical circuit, of the film conductive composite and the piezoelectric material layer can typically be identical to that previously cited in the case of a unidirectional probe.
- a ground plan in this type of probe we can proceed as in the process described by the applicant in the French patent application published under No. 2,756,447, or in integrating a ground plane between the transducer elements and the blades acoustic adaptation.
- the backing / conductive composite film / piezoelectric layer assembly after having carried out the backing / conductive composite film / piezoelectric layer assembly, cuts and sub-cuts to define the elements Tij and Tijk using a diamond saw along two perpendicular axes.
- the assembly thus formed is covered by a ground electrode conductive M, affixed then glued, it can typically be a sheet metallic or metallized polymer film.
- this cutting operation can be carried out by laser.
- the laser used can be, for example, an infrared laser of the CO 2 type or a UV laser of the Excimer type or of the tripled or quadrupled YAG type.
Description
- les interstices définissant les sous-éléments piézoélectriques s'arrêtant dans le film de matériau conducteur, les pistes du circuit électrique ne sont plus « sous-découpées » et donc fragilisées;
- le film de matériau composite conducteur permet de relier électriquement les éléments piézoélectriques et le circuit électrique sans passer par des vias comme décrits notamment dans le brevet français FR-A-2 702 309 ;
- le film de matériau composite conducteur pouvant avoir une dilatation thermique intermédiaire entre celle du matériau piézoélectrique et celle du matériau constitutif du « backing », permet d'absorber les déformations dues aux contraintes thermiques de l'assemblage réalisé de manière classique, à haute température ;
- les pistes du circuit électrique n'ont plus à être dimensionnées en fonction du nombre de sous-éléments piézoélectriques que l'on veut obtenir, car les interstices s'arrêtent dans le film de matériau composite conducteur.
- l'assemblage d'au moins, une couche de matériau piézoélectrique, un film de matériau composite conducteur et un circuit électrique comportant des pistes métalliques ;
- la découpe de la couche de matériau piézoélectrique et du film de matériau à composite conducteur de manière à définir des transducteurs piézoélectriques élémentaires séparés électriquement ;
- la sous-découpe des transducteurs élémentaires et d'une partie du film de matériau composite de manière à définir des sous-éléments piézoélectriques séparés mécaniquement et connectés électriquement.
- la figure 1 illustre une coupe d'un exemple de sonde acoustique unidirectionnelle selon l'art connu ;
- la figure 2 illustre une première variante de l'invention concernant une sonde unidimensionnelle ;
- la figure 3 illustre une seconde variante de l'invention concernant une sonde bidirectionnelle.
Claims (12)
- Sonde acoustique comprenant des transducteurs piézoélectriques élémentaires (Tij) et un circuit électrique (2) comportant des pistes métalliques (Pij), de manière à connecter au moins une piste métallique à au moins un transducteur élémentaire, chaque transducteur élémentaire étant constitué de sous-éléments piézoélectriques (Tijk) séparés mécaniquement et reliés à une même piste, caractérisée en ce qu'elle comprend en outre, un film de matériau composite conducteur (3) situé entre le circuit électrique (2) et les transducteurs élémentaires, les sous-éléments piézoélectriques (Tijk) d'un même transducteur élémentaire (Tij) étant séparés mécaniquement par des interstices se prolongeant jusque dans ledit film.
- Sonde acoustique selon la revendication 1, caractérisée en ce qu'elle comprend un support acoustique dénommé « backing » (1), le film de matériau composite (3) possédant des propriétés acoustiques voisines de celles du backing.
- Sonde acoustique selon l'une des revendications 1 ou 2, caractérisée en ce que le film de matériau composite (3) comprend des particules conductrices dont la taille est très inférieure à la longueur d'onde ultrasonore générée par la sonde.
- Sonde acoustique selon l'une des revendications 1 à 3, caractérisée en ce que le film composite conducteur (3) est un film de matériau organique de type résine époxy ou polyimide comportant des particules conductrices.
- Sonde acoustique selon la revendication 4, caractérisée en ce que les particules conductrices sont des particules de métal de type argent, cuivre, nickel.
- Sonde acoustique selon l'une des revendications 1 à 5, caractérisée en ce que le film de matériau composite (3) comporte un taux de charges conductrices compris entre 50 % et 80 % en volume.
- Sonde acoustique selon l'une des revendications 1 à 6, caractérisée en ce que l'épaisseur du film de matériau composite est de l'ordre de plusieurs dizaines de microns.
- Sonde acoustique selon l'une des revendications 1 à 7, caractérisée en ce que les transducteurs élémentaires (Tij) sont séparés électriquement par des interstices se prolongeant jusque dans le circuit électrique.
- Procédé de fabrication d'une sonde acoustique selon l'une des revendications 1 à 7, caractérisé en ce qu'il comprend en outre les étapes suivantes :l'assemblage d'au moins, une lame de matériau piézoélectrique, un film de matériau composite conducteur (3) et un circuit électrique (2) comportant des pistes métalliques ;la découpe de la lame de matériau piézoélectrique et du film de matériau composite conducteur (3) de manière à définir des transducteurs piézoélectriques élémentaires (Tij) séparés électriquement ;la sous-découpe des transducteurs élémentaires (Tij) et d'une partie du film de matériau composite de manière à définir des sous-éléments piézoélectriques (Tijk), séparés mécaniquement et connectés électriquement.
- Procédé de fabrication d'une sonde acoustique selon la revendication 9, caractérisé en ce que les étapes de découpe et de sous-découpe sont effectuées avec une scie diamantée.
- Procédé de fabrication d'une sonde acoustique selon l'une des revendications 9 ou 10, caractérisé en ce que les étapes de découpe et de sous-découpe sont effectuées simultanément.
- Procédé de fabrication selon l'une des revendications 9 à 10, caractérisé en ce que le circuit électrique (2) est situé à la surface d'un support acoustique, la découpe pour définir les transducteurs piézoélectriques élémentaires étant effectuée jusque dans ledit support acoustique.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9807094 | 1998-06-05 | ||
FR9807094A FR2779575B1 (fr) | 1998-06-05 | 1998-06-05 | Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication |
PCT/FR1999/001284 WO1999064169A1 (fr) | 1998-06-05 | 1999-06-01 | Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1084000A1 EP1084000A1 (fr) | 2001-03-21 |
EP1084000B1 true EP1084000B1 (fr) | 2004-10-13 |
Family
ID=9527060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99922247A Expired - Lifetime EP1084000B1 (fr) | 1998-06-05 | 1999-06-01 | Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication |
Country Status (7)
Country | Link |
---|---|
US (1) | US6522051B1 (fr) |
EP (1) | EP1084000B1 (fr) |
JP (1) | JP4288002B2 (fr) |
KR (1) | KR100577036B1 (fr) |
CN (1) | CN1217749C (fr) |
FR (1) | FR2779575B1 (fr) |
WO (1) | WO1999064169A1 (fr) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2810907B1 (fr) * | 2000-06-30 | 2002-10-31 | Thomson Csf | Procede de fabrication d'une sonde acoustique multielements utilisant une nouvelle methode de realisation de la masse electrique |
FR2818170B1 (fr) * | 2000-12-19 | 2003-03-07 | Thomson Csf | Procede de fabrication d'une sonde acoustique multielements utilisant un film polymere metallise et ablate comme plan de masse |
US20050167188A1 (en) * | 2001-02-15 | 2005-08-04 | Integral Technologies, Inc. | Low cost acoustical structures manufactured from conductive loaded resin-based materials |
US20050167189A1 (en) * | 2001-02-15 | 2005-08-04 | Integral Technologies, Inc. | Low cost acoustical structures manufactured from conductive loaded resin-based materials |
KR100394876B1 (ko) * | 2001-06-05 | 2003-08-19 | 주식회사 나노위즈 | 초음파 탐촉자 제조방법 |
US20070046149A1 (en) * | 2005-08-23 | 2007-03-01 | Zipparo Michael J | Ultrasound probe transducer assembly and production method |
WO2009055767A2 (fr) * | 2007-10-26 | 2009-04-30 | Trs Technologies, Inc. | Réseaux de transducteurs à ultrasons piézoélectriques microusinés |
US20090183350A1 (en) * | 2008-01-17 | 2009-07-23 | Wetsco, Inc. | Method for Ultrasound Probe Repair |
DE102008055116A1 (de) * | 2008-12-23 | 2010-07-01 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Ultraschallwandlers |
JP6102622B2 (ja) * | 2013-08-07 | 2017-03-29 | コニカミノルタ株式会社 | 超音波探触子 |
US10265729B2 (en) * | 2015-02-06 | 2019-04-23 | Olympus Scientific Solutions Americas Inc. | Phased array ultrasonic transducers with solderless stack bonding assembly |
JP5923205B1 (ja) * | 2015-07-07 | 2016-05-24 | 日立アロカメディカル株式会社 | 超音波探触子 |
CN105170435B (zh) * | 2015-09-23 | 2017-12-22 | 深圳先进技术研究院 | 高频超声换能器及其制备方法 |
US10843228B2 (en) | 2016-01-19 | 2020-11-24 | Sound Technology Inc. | Ultrasound transducer array interconnect |
CN106984516A (zh) * | 2017-05-31 | 2017-07-28 | 陈江龙 | 一种用于检测的接触式超声换能器及其制备方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
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IT1162336B (it) * | 1979-06-22 | 1987-03-25 | Consiglio Nazionale Ricerche | Procedimento per la realizzazione di trasduttori ultraacustici a cortina di linee o a matrice di punti e trasduttori ottenuti |
US4384228A (en) * | 1980-12-18 | 1983-05-17 | Hewlett-Packard Company | Acousto-electric transducer |
JPS6077600A (ja) * | 1983-10-05 | 1985-05-02 | Kureha Chem Ind Co Ltd | アレイ型超音波探触子の製造方法 |
EP0176030B1 (fr) * | 1984-09-26 | 1992-04-29 | TERUMO KABUSHIKI KAISHA trading as TERUMO CORPORATION | Transducteur ultrasonore et procédé de sa fabrication |
FR2605139A1 (fr) | 1986-10-10 | 1988-04-15 | Europ Composants Electron | Condensateur du type a film de polymere et a stabilite en temperature elevee |
US5167231A (en) * | 1986-12-24 | 1992-12-01 | Kabushiki Kaisha Toshiba | Ultrasonic probe |
FR2627008B1 (fr) | 1988-02-05 | 1990-06-08 | Europ Composants Electron | Procede d'impregnation de condensateurs electrolytiques par des sels de tetracyanoquinodimethane |
FR2666173A1 (fr) | 1990-08-21 | 1992-02-28 | Thomson Csf | Structure hybride d'interconnexion de circuits integres et procede de fabrication. |
FR2670021B1 (fr) | 1990-12-04 | 1994-03-04 | Thomson Csf | Procede de realisation de microlentilles pour applications optiques. |
FR2685080B1 (fr) | 1991-12-17 | 1995-09-01 | Thomson Csf | Capteur mecanique comprenant un film de polymere. |
US5744898A (en) * | 1992-05-14 | 1998-04-28 | Duke University | Ultrasound transducer array with transmitter/receiver integrated circuitry |
US5311095A (en) * | 1992-05-14 | 1994-05-10 | Duke University | Ultrasonic transducer array |
FR2701602B1 (fr) | 1993-02-12 | 1995-03-31 | Thomson Csf | Détecteur thermique comprenant un isolant thermique en polymère expansé. |
FR2702309B1 (fr) | 1993-03-05 | 1995-04-07 | Thomson Csf | Procédé de fabrication d'une sonde acoustique multiéléments, notamment d'une sonde d'échographie. |
US5457863A (en) * | 1993-03-22 | 1995-10-17 | General Electric Company | Method of making a two dimensional ultrasonic transducer array |
US5559388A (en) * | 1995-03-03 | 1996-09-24 | General Electric Company | High density interconnect for an ultrasonic phased array and method for making |
FR2740933B1 (fr) | 1995-11-03 | 1997-11-28 | Thomson Csf | Sonde acoustique et procede de realisation |
FR2745973B1 (fr) | 1996-03-08 | 1998-04-03 | Thomson Csf | Memoire de masse et procede de fabrication de memoire de masse |
US5732706A (en) * | 1996-03-22 | 1998-03-31 | Lockheed Martin Ir Imaging Systems, Inc. | Ultrasonic array with attenuating electrical interconnects |
FR2756447B1 (fr) * | 1996-11-26 | 1999-02-05 | Thomson Csf | Sonde acoustique multielements comprenant une electrode de masse commune |
-
1998
- 1998-06-05 FR FR9807094A patent/FR2779575B1/fr not_active Expired - Fee Related
-
1999
- 1999-06-01 JP JP2000553223A patent/JP4288002B2/ja not_active Expired - Fee Related
- 1999-06-01 KR KR1020007013515A patent/KR100577036B1/ko not_active IP Right Cessation
- 1999-06-01 CN CN998070041A patent/CN1217749C/zh not_active Expired - Fee Related
- 1999-06-01 WO PCT/FR1999/001284 patent/WO1999064169A1/fr active IP Right Grant
- 1999-06-01 EP EP99922247A patent/EP1084000B1/fr not_active Expired - Lifetime
- 1999-06-01 US US09/701,560 patent/US6522051B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1304340A (zh) | 2001-07-18 |
CN1217749C (zh) | 2005-09-07 |
EP1084000A1 (fr) | 2001-03-21 |
JP4288002B2 (ja) | 2009-07-01 |
JP2002517310A (ja) | 2002-06-18 |
FR2779575A1 (fr) | 1999-12-10 |
KR100577036B1 (ko) | 2006-05-08 |
KR20010043944A (ko) | 2001-05-25 |
FR2779575B1 (fr) | 2003-05-30 |
WO1999064169A1 (fr) | 1999-12-16 |
US6522051B1 (en) | 2003-02-18 |
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