EP1084000A1 - Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication - Google Patents
Sonde acoustique multielements comprenant un film composite conducteur et procede de fabricationInfo
- Publication number
- EP1084000A1 EP1084000A1 EP99922247A EP99922247A EP1084000A1 EP 1084000 A1 EP1084000 A1 EP 1084000A1 EP 99922247 A EP99922247 A EP 99922247A EP 99922247 A EP99922247 A EP 99922247A EP 1084000 A1 EP1084000 A1 EP 1084000A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- film
- acoustic
- elementary
- piezoelectric
- composite material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 45
- 239000002131 composite material Substances 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims description 6
- 239000011248 coating agent Substances 0.000 title abstract 3
- 238000000576 coating method Methods 0.000 title abstract 3
- 238000005520 cutting process Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000002923 metal particle Substances 0.000 claims description 2
- 239000011368 organic material Substances 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 4
- 230000006978 adaptation Effects 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 5
- 230000002457 bidirectional effect Effects 0.000 description 4
- 238000011084 recovery Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000009659 non-destructive testing Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/0629—Square array
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9807094 | 1998-06-05 | ||
FR9807094A FR2779575B1 (fr) | 1998-06-05 | 1998-06-05 | Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication |
PCT/FR1999/001284 WO1999064169A1 (fr) | 1998-06-05 | 1999-06-01 | Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1084000A1 true EP1084000A1 (fr) | 2001-03-21 |
EP1084000B1 EP1084000B1 (fr) | 2004-10-13 |
Family
ID=9527060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99922247A Expired - Lifetime EP1084000B1 (fr) | 1998-06-05 | 1999-06-01 | Sonde acoustique multielements comprenant un film composite conducteur et procede de fabrication |
Country Status (7)
Country | Link |
---|---|
US (1) | US6522051B1 (fr) |
EP (1) | EP1084000B1 (fr) |
JP (1) | JP4288002B2 (fr) |
KR (1) | KR100577036B1 (fr) |
CN (1) | CN1217749C (fr) |
FR (1) | FR2779575B1 (fr) |
WO (1) | WO1999064169A1 (fr) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2810907B1 (fr) * | 2000-06-30 | 2002-10-31 | Thomson Csf | Procede de fabrication d'une sonde acoustique multielements utilisant une nouvelle methode de realisation de la masse electrique |
FR2818170B1 (fr) * | 2000-12-19 | 2003-03-07 | Thomson Csf | Procede de fabrication d'une sonde acoustique multielements utilisant un film polymere metallise et ablate comme plan de masse |
US20050167188A1 (en) * | 2001-02-15 | 2005-08-04 | Integral Technologies, Inc. | Low cost acoustical structures manufactured from conductive loaded resin-based materials |
US20050167189A1 (en) * | 2001-02-15 | 2005-08-04 | Integral Technologies, Inc. | Low cost acoustical structures manufactured from conductive loaded resin-based materials |
KR100394876B1 (ko) * | 2001-06-05 | 2003-08-19 | 주식회사 나노위즈 | 초음파 탐촉자 제조방법 |
US20070046149A1 (en) * | 2005-08-23 | 2007-03-01 | Zipparo Michael J | Ultrasound probe transducer assembly and production method |
WO2009055767A2 (fr) * | 2007-10-26 | 2009-04-30 | Trs Technologies, Inc. | Réseaux de transducteurs à ultrasons piézoélectriques microusinés |
US20090183350A1 (en) * | 2008-01-17 | 2009-07-23 | Wetsco, Inc. | Method for Ultrasound Probe Repair |
DE102008055116A1 (de) * | 2008-12-23 | 2010-07-01 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Ultraschallwandlers |
JP6102622B2 (ja) * | 2013-08-07 | 2017-03-29 | コニカミノルタ株式会社 | 超音波探触子 |
US10265729B2 (en) * | 2015-02-06 | 2019-04-23 | Olympus Scientific Solutions Americas Inc. | Phased array ultrasonic transducers with solderless stack bonding assembly |
JP5923205B1 (ja) * | 2015-07-07 | 2016-05-24 | 日立アロカメディカル株式会社 | 超音波探触子 |
CN105170435B (zh) * | 2015-09-23 | 2017-12-22 | 深圳先进技术研究院 | 高频超声换能器及其制备方法 |
US10843228B2 (en) | 2016-01-19 | 2020-11-24 | Sound Technology Inc. | Ultrasound transducer array interconnect |
CN106984516A (zh) * | 2017-05-31 | 2017-07-28 | 陈江龙 | 一种用于检测的接触式超声换能器及其制备方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1162336B (it) * | 1979-06-22 | 1987-03-25 | Consiglio Nazionale Ricerche | Procedimento per la realizzazione di trasduttori ultraacustici a cortina di linee o a matrice di punti e trasduttori ottenuti |
US4384228A (en) * | 1980-12-18 | 1983-05-17 | Hewlett-Packard Company | Acousto-electric transducer |
JPS6077600A (ja) * | 1983-10-05 | 1985-05-02 | Kureha Chem Ind Co Ltd | アレイ型超音波探触子の製造方法 |
EP0176030B1 (fr) * | 1984-09-26 | 1992-04-29 | TERUMO KABUSHIKI KAISHA trading as TERUMO CORPORATION | Transducteur ultrasonore et procédé de sa fabrication |
FR2605139A1 (fr) | 1986-10-10 | 1988-04-15 | Europ Composants Electron | Condensateur du type a film de polymere et a stabilite en temperature elevee |
US5167231A (en) * | 1986-12-24 | 1992-12-01 | Kabushiki Kaisha Toshiba | Ultrasonic probe |
FR2627008B1 (fr) | 1988-02-05 | 1990-06-08 | Europ Composants Electron | Procede d'impregnation de condensateurs electrolytiques par des sels de tetracyanoquinodimethane |
FR2666173A1 (fr) | 1990-08-21 | 1992-02-28 | Thomson Csf | Structure hybride d'interconnexion de circuits integres et procede de fabrication. |
FR2670021B1 (fr) | 1990-12-04 | 1994-03-04 | Thomson Csf | Procede de realisation de microlentilles pour applications optiques. |
FR2685080B1 (fr) | 1991-12-17 | 1995-09-01 | Thomson Csf | Capteur mecanique comprenant un film de polymere. |
US5744898A (en) * | 1992-05-14 | 1998-04-28 | Duke University | Ultrasound transducer array with transmitter/receiver integrated circuitry |
US5311095A (en) * | 1992-05-14 | 1994-05-10 | Duke University | Ultrasonic transducer array |
FR2701602B1 (fr) | 1993-02-12 | 1995-03-31 | Thomson Csf | Détecteur thermique comprenant un isolant thermique en polymère expansé. |
FR2702309B1 (fr) | 1993-03-05 | 1995-04-07 | Thomson Csf | Procédé de fabrication d'une sonde acoustique multiéléments, notamment d'une sonde d'échographie. |
US5457863A (en) * | 1993-03-22 | 1995-10-17 | General Electric Company | Method of making a two dimensional ultrasonic transducer array |
US5559388A (en) * | 1995-03-03 | 1996-09-24 | General Electric Company | High density interconnect for an ultrasonic phased array and method for making |
FR2740933B1 (fr) | 1995-11-03 | 1997-11-28 | Thomson Csf | Sonde acoustique et procede de realisation |
FR2745973B1 (fr) | 1996-03-08 | 1998-04-03 | Thomson Csf | Memoire de masse et procede de fabrication de memoire de masse |
US5732706A (en) * | 1996-03-22 | 1998-03-31 | Lockheed Martin Ir Imaging Systems, Inc. | Ultrasonic array with attenuating electrical interconnects |
FR2756447B1 (fr) * | 1996-11-26 | 1999-02-05 | Thomson Csf | Sonde acoustique multielements comprenant une electrode de masse commune |
-
1998
- 1998-06-05 FR FR9807094A patent/FR2779575B1/fr not_active Expired - Fee Related
-
1999
- 1999-06-01 JP JP2000553223A patent/JP4288002B2/ja not_active Expired - Fee Related
- 1999-06-01 KR KR1020007013515A patent/KR100577036B1/ko not_active IP Right Cessation
- 1999-06-01 CN CN998070041A patent/CN1217749C/zh not_active Expired - Fee Related
- 1999-06-01 WO PCT/FR1999/001284 patent/WO1999064169A1/fr active IP Right Grant
- 1999-06-01 EP EP99922247A patent/EP1084000B1/fr not_active Expired - Lifetime
- 1999-06-01 US US09/701,560 patent/US6522051B1/en not_active Expired - Lifetime
Non-Patent Citations (1)
Title |
---|
See references of WO9964169A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN1304340A (zh) | 2001-07-18 |
CN1217749C (zh) | 2005-09-07 |
JP4288002B2 (ja) | 2009-07-01 |
JP2002517310A (ja) | 2002-06-18 |
FR2779575A1 (fr) | 1999-12-10 |
EP1084000B1 (fr) | 2004-10-13 |
KR100577036B1 (ko) | 2006-05-08 |
KR20010043944A (ko) | 2001-05-25 |
FR2779575B1 (fr) | 2003-05-30 |
WO1999064169A1 (fr) | 1999-12-16 |
US6522051B1 (en) | 2003-02-18 |
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