EP0784105B1 - Placage direct d'une plaque d'orifice sur un support - Google Patents
Placage direct d'une plaque d'orifice sur un support Download PDFInfo
- Publication number
- EP0784105B1 EP0784105B1 EP19960309171 EP96309171A EP0784105B1 EP 0784105 B1 EP0784105 B1 EP 0784105B1 EP 19960309171 EP19960309171 EP 19960309171 EP 96309171 A EP96309171 A EP 96309171A EP 0784105 B1 EP0784105 B1 EP 0784105B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- orifice plate
- mandrel
- holder
- fabricating
- peg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title description 8
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 5
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 description 24
- 239000004593 Epoxy Substances 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 229910052759 nickel Inorganic materials 0.000 description 6
- 239000003989 dielectric material Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1625—Manufacturing processes electroforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/08—Perforated or foraminous objects, e.g. sieves
Definitions
- the present invention relates to continuous ink jet printers and, more particularly, to improved construction for the orifice plate.
- Ink jet printing systems are known in which a print head defines one or more rows of orifices which receive an electrically conductive recording fluid, such as for instance a water base ink, from a pressurized fluid supply manifold and eject the fluid in rows of parallel streams.
- Printers using such print heads accomplish graphic reproduction by selectively charging and deflecting the drops in each of the streams and depositing at least some of the drops on a print receiving medium, while others of the drops strike a drop catcher device.
- the print head includes a manifold, defining a fluid receiving reservoir, to which is bonded a relatively thin orifice plate, defining the rows of orifices.
- the orifice plate is made of electroplated nickel or beryllium-copper electroplated with nickel.
- the orifice plate is somewhat flexible.
- an orifice plate is bonded to a holder, such as a droplet generator body, by first electroplating the orifice plate on a mandrel and then removing the orifice plate from the mandrel. The orifice plate is then typically bonded onto the orifice plate holder by using an epoxy. Of course, it is also possible, by using the right kind of mandrel, to epoxy bond the orifice plate to a holder or droplet generator while the orifice plate is still on the mandrel.
- a method of fabricating an orifice plate for an ink jet printer comprising the steps of:
- the direct orifice plate plating method according to the present invention wherein the orifice plate is bonded directly from the mandrel onto the holder, by means of plating seeks to meet the above-mentioned need.
- the present invention provides an orifice plate wherein the plate is bonded directly from the mandrel onto a holder or droplet generator. This provides the advantage of eliminating the use of epoxy on the flexible orifice plate. Acoustic energy will be transferred more uniformly through a stiffer orifice plate holder/epoxy/ fluid manifold structure than the orifice plate/epoxy/fluid manifold structure. The epoxy can be eliminated if the orifice plate is directly plated to the fluid manifold.
- the present invention provides such an orifice plate wherein the bonding is accomplished by means of plating. This provides the advantage of allowing for the orifice plate to be a mechanically stiffer structure.
- the peg is desirably a photoresist peg.
- the orifice plate is made by electroplating metal onto a mandrel.
- a mandrel can be defined as a form which when electroplated gives a metal part with the desired features.
- the features are formed by having areas on the mandrel which do not electroplate. This is accomplished by having areas on the mandrel which are made of a dielectric material.
- the dielectric material can be material put on top of a conductive material such as photoresist.
- Another method of mandrel construction is to coat a dielectric material with a conductive surface. The dielectric areas are then obtained by etching through the conductive surface down to the dielectric, such as are described in U.S. Patent No. 4,773,971; and European patent application No. 95307490.3 (EP-A-0713929)
- Either style of mandrel can be used to directly plate orifice plates onto a holder, in accordance with the present invention.
- the type of mandrel with a dielectric on a conductive surface shall be used to demonstrate the method of directly plating an orifice plate onto a holder.
- the mandrel is then placed into a metal electroplating bath, e.g. nickel or nickel alloy.
- Metal is then electroplated onto the mandrel where only areas devoid of the dielectric material accept the electroplated nickel.
- the orifice plate can then be removed from the mandrel. This process is described in U.S. Pat. No. 4,184,925.
- orifice plate 10 is bonded to manifold 12, with suitable bonding means such as epoxy 14, at the periphery of the orifice plate. This bridges and closes the manifold opening leading to fluid reservoir 16. As a consequence, orifices in the orifice plate 10 are in direct fluid communication with the reservoir 16. As fluid is applied under pressure to the fluid receiving reservoir, it flows through fluid channel 18, to orifices of the orifice plate 10, and emerges from each orifice as a fluid filament. The fluid filament then breaks at its tip into a succession of fluid drops. The length of the filament can be controlled by the amount of stimulation amplitude applied to the filament from piezoelectric crystals 20 attached to the fluid manifold 12. It is desirable to have all the filament lengths along the array to be the same. This is called synchronous breakoff.
- a method of bonding an orifice plate onto a holder for an ink jet printer uses direct plating.
- an orifice plate holder 22 is aligned to a mandrel 24 and the two parts are kept in very close proximity, preferably in intimate contact, and at the same electrical potential.
- the holder and the mandrel are then placed at cathodic polarity.
- the orifice is formed as the electroplated metal grows on the conductive portion of the mandrel and around a photoresist peg 26. If necessary, metal can be deposited thick enough to go over part of the top of the peg.
- plating material such as electroplated nickel 28 is applied to the combined holder and mandrel.
- the holder 22 and the mandrel 24 will then grow together, forming a single orifice plate directly bonded to the holder.
- the mandrel can then be removed by peeling, if the adhesion of the plated material is less on the mandrel than the holder, or by etching the mandrel away, as is illustrated in Fig. 4.
- FIG. 5 there is illustrated a cross sectional view of an orifice plate 30 manufactured in accordance with the present invention, directly plated onto fluid manifold 12.
- an anode may be axially located at location 32, down the interior of the fluid manifold cavity.
- An electrolyte is pumped through the fluid manifold cavity during the plating process to assure that the concentration of metal ions being plated is uniform throughout the length of the fluid manifold cavity. If the concentration of metal ions is not uniform, then the orifice plate will not be uniform in thickness along the array, resulting in a variation in the diameter of the orifices along the array.
- the present invention is useful in the field of ink jet printing, and has the advantage of eliminating the use of epoxy on the flexible orifice plate. Acoustic energy will be transferred more uniformly through a stiffer orifice plate holder/epoxy/fluid manifold structure than the orifice plate/epoxy/fluid manifold structure. It is a further advantage of the present invention that it allows for the orifice plate to be a mechanically stiffer structure. Being a mechanically stiffer structure will greatly reduce the out-of-flatness in the plane of the array and the nonstraightness of the orifices along the array. Also the mechanically stiffer structure will transfer acoustic energy more uniformly along the array which will improve the uniformity of the breakoff lengths of the filaments along the array.
Claims (7)
- Procédé de fabrication d'une plaque à orifice pour une imprimante à jet d'encre, comprenant les étapes suivantes :la prévision d'un mandrin (24) possédant une cheville (26) montée dessus ;l'alignement d'un support (22) sur le mandrin (24) ;le placement du mandrin (24) et du support (22) sur une polarité de cathode ;l'application d'un métal de galvanoplastie sur le mandrin (24) et le support (22) de façon à développer le métal de galvanoplastie sur le mandrin (24) autour de la cheville (26) pour amener le mandrin et le support à former une plaque à un seul orifice directement liée au support.
- Procédé de fabrication d'une plaque à orifice selon la revendication 1, comprenant, de plus, une étape de maintien du mandrin (24) et du support (22) en contact intime.
- Procédé de fabrication d'une plaque à orifice selon la revendication 1, comprenant, de plus, une étape de maintien du mandrin (24) et du support (22) à un potentiel électrique égal.
- Procédé de fabrication d'une plaque à orifice selon la revendication 1, comprenant, de plus, une étape d'enlèvement du mandrin (24) de la plaque d'orifice (28).
- Procédé de fabrication d'une plaque à orifice selon la revendication 4, selon lequel l'étape d'enlèvement du mandrin (24) de la plaque d'orifice (28) comprend une étape de pelage du mandrin (24) de la plaque d'orifice (28).
- Procédé de fabrication d'une plaque à orifice selon la revendication 4, selon lequel l'étape d'enlèvement du mandrin (24) de la plaque d'orifice (28) comprend une étape de gravure chimique du mandrin (24) de la plaque d'orifice (28).
- Procédé de fabrication d'une plaque à orifice selon la revendication 1, selon lequel la cheville est une cheville photorésistante.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57725195A | 1995-12-22 | 1995-12-22 | |
US577251 | 1995-12-22 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0784105A2 EP0784105A2 (fr) | 1997-07-16 |
EP0784105A3 EP0784105A3 (fr) | 1997-10-01 |
EP0784105B1 true EP0784105B1 (fr) | 2001-10-17 |
Family
ID=24307919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19960309171 Expired - Lifetime EP0784105B1 (fr) | 1995-12-22 | 1996-12-16 | Placage direct d'une plaque d'orifice sur un support |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0784105B1 (fr) |
JP (1) | JPH09216369A (fr) |
CA (1) | CA2193157A1 (fr) |
DE (1) | DE69616008T2 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1286172A (zh) * | 1999-08-25 | 2001-03-07 | 美商·惠普公司 | 制造薄膜喷墨打印头的方法 |
US7377618B2 (en) * | 2005-02-18 | 2008-05-27 | Hewlett-Packard Development Company, L.P. | High resolution inkjet printer |
US7942997B2 (en) | 2008-04-08 | 2011-05-17 | Hewlett-Packard Development Company, L.P. | High resolution inkjet printer |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4184925A (en) | 1977-12-19 | 1980-01-22 | The Mead Corporation | Solid metal orifice plate for a jet drop recorder |
US4374707A (en) * | 1981-03-19 | 1983-02-22 | Xerox Corporation | Orifice plate for ink jet printing machines |
US4773971A (en) | 1986-10-30 | 1988-09-27 | Hewlett-Packard Company | Thin film mandrel |
US4971665A (en) * | 1989-12-18 | 1990-11-20 | Eastman Kodak Company | Method of fabricating orifice plates with reusable mandrel |
-
1996
- 1996-12-16 EP EP19960309171 patent/EP0784105B1/fr not_active Expired - Lifetime
- 1996-12-16 DE DE1996616008 patent/DE69616008T2/de not_active Expired - Lifetime
- 1996-12-17 CA CA 2193157 patent/CA2193157A1/fr not_active Abandoned
- 1996-12-24 JP JP34394396A patent/JPH09216369A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE69616008D1 (de) | 2001-11-22 |
DE69616008T2 (de) | 2002-05-29 |
JPH09216369A (ja) | 1997-08-19 |
EP0784105A3 (fr) | 1997-10-01 |
EP0784105A2 (fr) | 1997-07-16 |
CA2193157A1 (fr) | 1997-06-23 |
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