EP0755573A1 - Composant electronique et son procede de fabrication - Google Patents

Composant electronique et son procede de fabrication

Info

Publication number
EP0755573A1
EP0755573A1 EP95915782A EP95915782A EP0755573A1 EP 0755573 A1 EP0755573 A1 EP 0755573A1 EP 95915782 A EP95915782 A EP 95915782A EP 95915782 A EP95915782 A EP 95915782A EP 0755573 A1 EP0755573 A1 EP 0755573A1
Authority
EP
European Patent Office
Prior art keywords
component
housing
melt adhesive
electronic component
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP95915782A
Other languages
German (de)
English (en)
Inventor
Wilfried Laun
Peter Radvan
Christian HÄLSIG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TELE FILTER tft GmbH
Original Assignee
TELE FILTER tft GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TELE FILTER tft GmbH filed Critical TELE FILTER tft GmbH
Publication of EP0755573A1 publication Critical patent/EP0755573A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/8388—Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • the invention relates to an electronic component and a method for its production.
  • the component according to the invention can be used in particular in information and communication technology.
  • An essential part of the components used in modern electrical engineering and electronics consists of a suitable housing in which one component chip or also several component chips are arranged.
  • the housing is both the carrier of the chip, is used for handling during further processing, contacting, mechanical protection of the chip and, if necessary, fulfills further functions such as component cooling or electrical or electromagnetic shielding.
  • the component chip is attached to the housing or also to carrier strips by means of an adhesive connection, with fast and self-curing adhesive systems being preferred for reasons of effectiveness. After the adhesive has hardened, the component is fed to the further machining processes provided in accordance with the respective technological sequence and, after the machining has been completed, closed with a cap or a lid.
  • a disadvantage of this solution is that the mechanical stresses which arise from the further machining processes and the closure of the component in the component chip and / or between the component chip and the housing cannot be reduced or compensated for only incompletely.
  • the disadvantageous consequences of this are inadequate limit values, poor reproducibility of the parameters, higher reject rate and ultimately higher production costs.
  • the invention is therefore based on the object of providing a component and a method for its production, the component being able to be produced simply and effectively, having very good and reproducible technical parameters and the method being able to be integrated into the technological component manufacturing process without problems.
  • hotmelt adhesives are particularly suitable whose softening temperature is higher than 85 ° C. and whose processing temperature is between 120 ° C. and 240 ° C.
  • the softening temperature is approximately 140 ° C. and the processing temperature is between 180 ° C. and 210 ° C.
  • the viscosity of the melt should have a value which makes it possible for the adhesive to drip.
  • Hot melt adhesives based on ethylene-ethyl acrylate copolymers (EEA), ethylene-vinyl acetate copolymers (EVA), polyamides (PA), polyesters (PES), polyisobutylenes (PIB) and polyvinyl butyrates (PVB) can be used particularly advantageously according to the invention.
  • the electronic components are produced in a simple and cost-effective manner by applying a defined amount of hot-melt adhesive to the connection point provided between the component chip and the housing and subsequently positioning and pressing on the component chip.
  • the component prefabricated in this way is subsequently cooled and another Subjected to machining. After completion of the processing and closure of the housing of the component, the entire electronic component is heated again at least to the softening point, so that the hot melt adhesive softens again and solidifies again when it cools down.
  • the process steps can be easily integrated into the component manufacturing process.
  • An additional advantage of the invention results from the fact that the application site and application amount of the liquid adhesive are very precisely defined. This is achieved by using nozzles, the temperature of the nozzles being substantially higher than the temperature of the liquid adhesive in the storage tank.
  • FIG. 1 The basic structure of an electronic component manufactured according to the invention is shown in FIG. 1.
  • the electronic component consists of a housing and a component chip (1), wherein between the
  • a layer (3) of hot melt adhesive is arranged on the inside (2a) of the housing base (2).
  • the housing consists in the present
  • Embodiment made of a multilayer ceramic but housings made of metal or plastic can also be used.
  • Embodiment is a SAW filter made of ST quartz, with the housing (2) is connected purely mechanically via the layer (3) of hot melt adhesive.
  • the electrical contact points (5) of the component chip (1) are arranged on the upper side (lb) of the component chip (1).
  • the connection to the bond points (6) on the housing base (2) is realized by means of bond wires (4).
  • the hotmelt adhesive which is available in bars or as granules, is melted in a tank, which is filled to a third.
  • the device is designed with regard to heating temperature and delivery pressure in such a way that optimum working conditions exist when the liquid adhesive is applied.
  • the adhesive in the tank is heated to a temperature of 140 ° C.
  • the delivery pressure in the tank is 0.1 bar.
  • the housings are provided in a suitable magazine or on a carrier strip unit for dropping the adhesive.
  • the outlet nozzle for the hot melt adhesive is heated to 220 ° C. by means of a nozzle heater. Once the metered amount of adhesive has been applied to the housing, the component chip is attached.
  • Magazine or carrier are fed to a temperature-controlled hot plate, so that the glue point is brought to the required processing temperature.
  • the chip is positioned and pressed exactly by a device.
  • the component is then cooled and fed to the further work steps for processing and finally closed by a corresponding housing cap or a cover.
  • the mechanical stresses caused by the processing and by the closure of the electronic component, which would lead to impairment of the component, are compensated for by the fact that, after the processing, the component is again heated to approx. 150 ° C. in the closed state, so that the hot melt adhesive softens again and solidifies again upon subsequent cooling.
  • the adhesive is not provided in liquid form, but has been processed into a film before the processing process.
  • This thin film is on a suitable base material and is separated from this base material shortly before processing.
  • the necessary amount of adhesive is separated from the film and placed in the location of the housing on which the component chip is to be mounted. After heating the film in the housing, the adhesive is liquefied and the component chip can be inserted and processed as in the previous exemplary embodiment.

Landscapes

  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

L'invention concerne un composant électronique et son procédé de fabrication. Le composant électronique comprend une microplaquette et un boîtier. Une couche (3) d'adhésif thermofusible est appliquée entre la face inférieure (1a) de la microplaquette (1) et la face intérieure (2a) du fond (2) du boîtier. Afin de produire ce composant, on applique une quantité définie d'adhésif thermofusible sur le point de liaison entre la microplaquette et le boîtier, on positionne la microplaquette sur ledit adhésif et on lui applique une pression. Le composant ainsi préfabriqué est refroidi et soumis au traitement suivant. Une fois le traitement du composant achevé et son boîtier fermé, le composant tout entier est à nouveau chauffé, de sorte que l'adhésif thermofusible se ramollit à nouveau, puis se solidifie encore une fois pendant son refroidissement ultérieur. On réduit ainsi les tensions mécaniques dans la microplaquette ou entre la microplaquette et le boîtier.
EP95915782A 1994-04-15 1995-04-13 Composant electronique et son procede de fabrication Withdrawn EP0755573A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4413529A DE4413529C2 (de) 1994-04-15 1994-04-15 Verfahren zur Herstellung elektronischer Oberflächenwellenbauelemente sowie ein nach dem Verfahren hergestelltes elektronisches Bauelement
DE4413529 1994-04-15
PCT/DE1995/000511 WO1995028739A1 (fr) 1994-04-15 1995-04-13 Composant electronique et son procede de fabrication

Publications (1)

Publication Number Publication Date
EP0755573A1 true EP0755573A1 (fr) 1997-01-29

Family

ID=6515837

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95915782A Withdrawn EP0755573A1 (fr) 1994-04-15 1995-04-13 Composant electronique et son procede de fabrication

Country Status (6)

Country Link
EP (1) EP0755573A1 (fr)
AU (1) AU2254195A (fr)
DE (1) DE4413529C2 (fr)
FI (1) FI964115A (fr)
NO (1) NO964367D0 (fr)
WO (1) WO1995028739A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180261B1 (en) 1997-10-21 2001-01-30 Nitto Denko Corporation Low thermal expansion circuit board and multilayer wiring circuit board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US515942A (en) * 1894-03-06 scates
EP0051165A1 (fr) * 1980-11-03 1982-05-12 BURROUGHS CORPORATION (a Michigan corporation) Boîtier réparable à circuits intégrés fixés par un produit thermoplastique
US4346124A (en) * 1981-05-04 1982-08-24 Laurier Associates, Inc. Method of applying an adhesive to a circuit chip
CA1222071A (fr) * 1984-01-30 1987-05-19 Joseph A. Aurichio Ruban conducteur avec adhesif de retention pour pouces d'electronique
US4624724A (en) * 1985-01-17 1986-11-25 General Electric Company Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base
US4908086A (en) * 1985-06-24 1990-03-13 National Semiconductor Corporation Low-cost semiconductor device package process
DE3907261C2 (de) * 1989-03-07 2001-04-05 Nematel Dr Rudolf Eidenschink Klebstoff
US5212115A (en) * 1991-03-04 1993-05-18 Motorola, Inc. Method for microelectronic device packaging employing capacitively coupled connections

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9528739A1 *

Also Published As

Publication number Publication date
FI964115A (fi) 1996-12-13
FI964115A0 (fi) 1996-10-14
AU2254195A (en) 1995-11-10
WO1995028739A1 (fr) 1995-10-26
DE4413529A1 (de) 1995-10-19
DE4413529C2 (de) 1996-07-25
NO964367L (no) 1996-10-14
NO964367D0 (no) 1996-10-14

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