FI964115A - Elektroninen komponentti ja sen valmistusmenetelmä - Google Patents
Elektroninen komponentti ja sen valmistusmenetelmä Download PDFInfo
- Publication number
- FI964115A FI964115A FI964115A FI964115A FI964115A FI 964115 A FI964115 A FI 964115A FI 964115 A FI964115 A FI 964115A FI 964115 A FI964115 A FI 964115A FI 964115 A FI964115 A FI 964115A
- Authority
- FI
- Finland
- Prior art keywords
- manufacturing
- electronic component
- electronic
- component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/8388—Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4413529A DE4413529C2 (de) | 1994-04-15 | 1994-04-15 | Verfahren zur Herstellung elektronischer Oberflächenwellenbauelemente sowie ein nach dem Verfahren hergestelltes elektronisches Bauelement |
PCT/DE1995/000511 WO1995028739A1 (de) | 1994-04-15 | 1995-04-13 | Elektronisches bauelement und verfahren zu seiner herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
FI964115A0 FI964115A0 (fi) | 1996-10-14 |
FI964115A true FI964115A (fi) | 1996-12-13 |
Family
ID=6515837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI964115A FI964115A (fi) | 1994-04-15 | 1996-10-14 | Elektroninen komponentti ja sen valmistusmenetelmä |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0755573A1 (fi) |
AU (1) | AU2254195A (fi) |
DE (1) | DE4413529C2 (fi) |
FI (1) | FI964115A (fi) |
NO (1) | NO964367L (fi) |
WO (1) | WO1995028739A1 (fi) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6180261B1 (en) | 1997-10-21 | 2001-01-30 | Nitto Denko Corporation | Low thermal expansion circuit board and multilayer wiring circuit board |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US515942A (en) * | 1894-03-06 | scates | ||
EP0051165A1 (en) * | 1980-11-03 | 1982-05-12 | BURROUGHS CORPORATION (a Michigan corporation) | Repairable IC package with thermoplastic chip attach |
US4346124A (en) * | 1981-05-04 | 1982-08-24 | Laurier Associates, Inc. | Method of applying an adhesive to a circuit chip |
CA1222071A (en) * | 1984-01-30 | 1987-05-19 | Joseph A. Aurichio | Conductive die attach tape |
US4624724A (en) * | 1985-01-17 | 1986-11-25 | General Electric Company | Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base |
US4908086A (en) * | 1985-06-24 | 1990-03-13 | National Semiconductor Corporation | Low-cost semiconductor device package process |
DE3907261C2 (de) * | 1989-03-07 | 2001-04-05 | Nematel Dr Rudolf Eidenschink | Klebstoff |
US5212115A (en) * | 1991-03-04 | 1993-05-18 | Motorola, Inc. | Method for microelectronic device packaging employing capacitively coupled connections |
-
1994
- 1994-04-15 DE DE4413529A patent/DE4413529C2/de not_active Expired - Fee Related
-
1995
- 1995-04-13 AU AU22541/95A patent/AU2254195A/en not_active Abandoned
- 1995-04-13 WO PCT/DE1995/000511 patent/WO1995028739A1/de not_active Application Discontinuation
- 1995-04-13 EP EP95915782A patent/EP0755573A1/de not_active Withdrawn
-
1996
- 1996-10-14 NO NO964367A patent/NO964367L/no unknown
- 1996-10-14 FI FI964115A patent/FI964115A/fi not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
NO964367D0 (no) | 1996-10-14 |
FI964115A0 (fi) | 1996-10-14 |
WO1995028739A1 (de) | 1995-10-26 |
DE4413529A1 (de) | 1995-10-19 |
NO964367L (no) | 1996-10-14 |
EP0755573A1 (de) | 1997-01-29 |
DE4413529C2 (de) | 1996-07-25 |
AU2254195A (en) | 1995-11-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR960015789A (ko) | 전자부품과 그 제조방법 | |
DE69718693D1 (de) | Elektronisches Bauteil und Herstellungsverfahren | |
DE69840246D1 (de) | Elektronisches Bauteil und Herstellungsverfahren | |
EP0689245A3 (en) | Electronic component, its arrangement and manufacturing method | |
KR960705068A (ko) | 복합재와 그의 제조방법 | |
KR960012578A (ko) | 표시 장치 및 그 제조 방법 | |
KR950034612A (ko) | 반도체 구조물 및 그 제조 방법 | |
DE69530221D1 (de) | Anordnungen von optoelektronischen bauelementen und herstellungsverfahren | |
EP0821374A4 (en) | ELECTRONIC PARTS AND THEIR MANUFACTURING METHOD | |
DE69416363D1 (de) | Abbildendes festkörperbauteil und herstellungsverfahren dafür | |
KR960008149A (ko) | 유체봉입식엔진마운트 및 그 제조방법 | |
FI941951A0 (fi) | Sirutyyppinen piirikomponentti ja menetelmä sen valmistamiseksi | |
KR960012601A (ko) | 원-직선편파변환기 및 그의 제조방법 | |
SG38877A1 (en) | Composite electronic component and method of manufacturing the same | |
KR960013620A (ko) | 성형 방법 및 성형 장치 | |
KR970006950A (ko) | 소결함유 축받이 및 그 제조방법 | |
DE69941874D1 (de) | Optielektronisches bauelement und herstellungsverfahren | |
KR960013145A (ko) | 광어셈블리 및 그것의 제조방법 | |
KR970004986A (ko) | 돌출전극 부속 전자부품의 제조장치 및 제조방법 | |
FI942014A0 (fi) | Rakenneosa ja sen valmistusmenetelmä | |
KR960009144A (ko) | 리드프레임과 그 제조방법 | |
KR930701839A (ko) | 피에조전기 부품장착 포일 및 그 제조방법 | |
DE69626166D1 (de) | Oszillatorschaltung und -verfahren | |
DE69536130D1 (de) | Halbleiterbauelement und dessen Herstellungsverfahren | |
FI921936A0 (fi) | Menetelmä elementtirakenteen valmistamiseksi ja elementtirakenne |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD | Application lapsed |