EP0702094B1 - Verwendung einer aushärtbaren Kupferlegierung - Google Patents
Verwendung einer aushärtbaren Kupferlegierung Download PDFInfo
- Publication number
- EP0702094B1 EP0702094B1 EP95110134A EP95110134A EP0702094B1 EP 0702094 B1 EP0702094 B1 EP 0702094B1 EP 95110134 A EP95110134 A EP 95110134A EP 95110134 A EP95110134 A EP 95110134A EP 0702094 B1 EP0702094 B1 EP 0702094B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- nickel
- copper alloy
- mold
- zirconium
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 10
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 15
- 229910052796 boron Inorganic materials 0.000 claims abstract description 8
- 238000009749 continuous casting Methods 0.000 claims abstract description 8
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 7
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 6
- 239000012535 impurity Substances 0.000 claims abstract description 6
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 32
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000011777 magnesium Substances 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims 2
- 229910001338 liquidmetal Inorganic materials 0.000 claims 1
- 238000005266 casting Methods 0.000 abstract description 9
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 5
- 229910052791 calcium Inorganic materials 0.000 abstract description 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- 238000003756 stirring Methods 0.000 description 12
- 229910045601 alloy Inorganic materials 0.000 description 10
- 239000000956 alloy Substances 0.000 description 10
- 229910001093 Zr alloy Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 239000011572 manganese Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910019580 Cr Zr Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- 238000009661 fatigue test Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/04—Continuous casting of metals, i.e. casting in indefinite lengths into open-ended moulds
- B22D11/059—Mould materials or platings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/12—Accessories for subsequent treating or working cast stock in situ
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
Definitions
- the invention relates to the use of a curable Copper alloy as a material with specifically adjustable electrical conductivity for the production of Continuous casting molds in which molten Metal through the action of electromagnetic forces is stirred.
- the molten metal is melted during the casting process Stirring device under the influence of an electrical rotating field brought transversely to the strand withdrawal direction and through the emerging induction currents in a circular motion offset, which is essentially concentric to the longitudinal axis of the strand runs.
- the result is a homogeneous casting structure, that meets particularly high quality standards.
- Stirring devices usually below the mold, so that the remaining molten metal solidified in the partially Strand can be stirred just below the mold. But around the solidification structure also in the outer solidifying first It is to be able to influence edge areas of the strand favorable, the stirring device either at the level of the mold or to accommodate in the mold itself.
- the mold materials used in the continuous casting of steel usually have high mechanical strength at the same time a high thermal conductivity to ensure optimal Ensure heat dissipation and cooling performance.
- the one with it associated high maximum casting speed increases the Profitability of continuous steel casting.
- the high electrical Conductivity leads to an undesirably high shielding effect of the mold material in relation to the Stirring generated magnetic field. This weakening of the magnetic field results in a lower depth effect of the Stirring effects.
- the stirring effect can be increased by Amperage are increased, which, however, the necessary technical effort increases disproportionately. Overall, an optimal stirring effect with a high Mold materials with thermal conductivity are not reachable.
- the known mold materials with lower thermal conductivity thus represent no economical alternative to the highly conductive mold materials, such as copper-chrome-zirconium alloys, for use in Casting plants with electromagnetic stirring device.
- Continuous casting molds made of a copper-chrome-zirconium alloy with a Addition of up to 5% of at least one element from the group aluminum, Iron, silicon, nickel, tin, zinc and manganese are from JP-A-58 107 460 known.
- JP-A-58 212 839 is a high temperature resistant copper-chrome-zirconium alloy with 0.05 to 0.8% aluminum and other strength enhancers Additives described for the manufacture of continuous casting molds can be used.
- the object of the present invention is a curable copper material for use in casting plants with an electromagnetic stirring device to provide, which causes a low field loss and which continues has favorable strength and elongation at break properties.
- the solution to this problem is to use a curable Copper alloy made of 0.1 to 2.0% nickel, 0.3 to 1.3% chromium, 0.1 to 0.5% Zirconium, 0.005 to 0.05% of at least one element from the phosphorus, Group comprising magnesium and boron, optionally up to 0.2% titanium, up to to 0.4% iron and up to 0.8% manganese, the rest copper including production-related Impurities as a material with specifically adjustable electrical Conductivity for the manufacture of continuous casting molds in which molten metal stirred by the action of electromagnetic forces becomes.
- the alloy to be used according to the invention preferably contains 0.4 to 1.6% nickel, 0.6 to 0.8% chromium, 0.15 to 0.25% zirconium, at least one Element from the group 0.005 to 0.02% boron, 0.005 to 0.05% magnesium and 0.005 to 0.03% phosphorus, balance copper including unavoidable Impurities.
- the boron additive can be in the melt, for example, as calcium boride be added.
- the copper alloy according to the invention is surprisingly distinguished through a particularly advantageous combination of mechanical and physical Properties. With an electrical below 80% IACS Conductivity, this copper alloy also meets the essential requirement low field damping of a made from this alloy Mold wall.
- the alloy add up to 0.2% titanium and / or 0.4% iron.
- a low titanium content forms nickel and with the components present in the alloy Iron intermetallic compounds that increase strength.
- composition of eight sample alloys is given in Table 1 in% by weight.
- X denotes the total content of the individual elements boron, magnesium and / or phosphorus, which are added up to a total of 0.05% as deoxidizing agents. Higher levels can also be used to increase the strength of the alloy.
- Leg. Ni Cr Zr X Ti Fe Al Mn Cu 1 0.20 0.70 0.18 0.015 rest 2nd 0.38 0.65 0.16 0.016 rest 4th 0.81 0.68 0.16 0.014 rest 5 0.81 0.66 0.17 0.014 0.10 0.22 rest 6 1.25 0.70 0.15 0.015 rest 7 1.60 0.66 0.18 0.016 rest 8th 1.68 0.72 0.17 0.016 rest 9 2.0 0.73 0.16 0.013 rest
- Copper alloys with different nickel contents of 0.2 to 2%, about 0.7% chromium, 0.16 to 0.2% zirconium, up to 0.02% boron, magnesium and / or phosphorus, the rest of copper including manufacturing-related impurities were initially melted, cast into rolled ingots and then hot rolled at 950 ° C in several passes with a total degree of forming of 65%. After solution annealing at 1 030 ° C for at least one hour and subsequent quenching in water, the rolled plates were cured at 475 ° C for at least 4 hours. After final machining, the mold plates each had the property values summarized in Table 2, depending on the nickel content (0.2 to 2% nickel).
- the first-mentioned property value is assigned to the copper alloy with 0.2% nickel content to be used according to the invention.
- Yield strength at 350 ° C 270 to 290 N / mm 2 Elongation at break at 350 ° C 22 to 10%
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Continuous Casting (AREA)
- Conductive Materials (AREA)
- Dental Preparations (AREA)
- Adornments (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Laminated Bodies (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
- Colloid Chemistry (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4427939 | 1994-08-06 | ||
DE4427939A DE4427939A1 (de) | 1994-08-06 | 1994-08-06 | Verwendung einer aushärtbaren Kupferlegierung |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0702094A1 EP0702094A1 (de) | 1996-03-20 |
EP0702094B1 true EP0702094B1 (de) | 1999-10-27 |
Family
ID=6525121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP95110134A Expired - Lifetime EP0702094B1 (de) | 1994-08-06 | 1995-06-29 | Verwendung einer aushärtbaren Kupferlegierung |
Country Status (12)
Country | Link |
---|---|
US (1) | US6565681B1 (ja) |
EP (1) | EP0702094B1 (ja) |
JP (1) | JPH08104928A (ja) |
KR (1) | KR100374051B1 (ja) |
CN (1) | CN1058532C (ja) |
AT (1) | ATE186076T1 (ja) |
DE (2) | DE4427939A1 (ja) |
ES (1) | ES2139780T3 (ja) |
FI (1) | FI112669B (ja) |
PL (1) | PL177973B1 (ja) |
RU (1) | RU2160648C2 (ja) |
ZA (1) | ZA956181B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19840094C2 (de) * | 1998-09-03 | 2002-09-19 | Waermetechnik Heimsoth Gmbh & | Anwendung von Kupferlegierungen für Kühlpreßplatten in Einrichtungen für die Wärmebehandlung von Stahlteilen |
DE10032627A1 (de) * | 2000-07-07 | 2002-01-17 | Km Europa Metal Ag | Verwendung einer Kupfer-Nickel-Legierung |
DE10306819A1 (de) * | 2003-02-19 | 2004-09-02 | Sms Demag Ag | Kupferlegierung und Verwendung einer solchen Legierung für Giessformen |
JP3731600B2 (ja) | 2003-09-19 | 2006-01-05 | 住友金属工業株式会社 | 銅合金およびその製造方法 |
DE102008015096A1 (de) * | 2008-03-19 | 2009-09-24 | Kme Germany Ag & Co. Kg | Verfahren zur Herstellung von Gießformteilen sowie nach dem Verfahren hergestellte Gießformteile |
KR101364542B1 (ko) * | 2011-08-11 | 2014-02-18 | 주식회사 풍산 | 연속주조 몰드용 동합금재 및 이의 제조 방법 |
CN102392154B (zh) * | 2011-11-25 | 2014-04-02 | 汕头华兴冶金设备股份有限公司 | 一种高强高导铜合金材料 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3109438A1 (de) * | 1981-03-12 | 1982-09-30 | Kabel- und Metallwerke Gutehoffnungshütte AG, 3000 Hannover | "verfahren zur herstellung von rohrfoermigen, geraden oder gekruemmten stranggiesskokillen mit parallelen oder konischen innenkonturen aus aushaertbaren kupferlegierungen" |
JPS58107460A (ja) * | 1981-12-21 | 1983-06-27 | Chuetsu Gokin Chuko Kk | 析出硬化型連続鋳造用鋳型材料 |
US4421570A (en) | 1982-03-12 | 1983-12-20 | Kabel Und Metallwerke Gutehoffnungshutte Ag | Making molds for continuous casting |
JPS58212839A (ja) * | 1982-06-03 | 1983-12-10 | Mitsubishi Metal Corp | 連続鋳造鋳型用Cu合金 |
US4749548A (en) * | 1985-09-13 | 1988-06-07 | Mitsubishi Kinzoku Kabushiki Kaisha | Copper alloy lead material for use in semiconductor device |
JP2632818B2 (ja) * | 1986-11-14 | 1997-07-23 | 三菱マテリアル株式会社 | 耐熱疲労性にすぐれた高強度銅合金 |
JPS63303020A (ja) * | 1987-06-03 | 1988-12-09 | Nippon Mining Co Ltd | 摺動材料用銅合金 |
JPH01188642A (ja) * | 1988-01-22 | 1989-07-27 | Kobe Steel Ltd | 電磁撹拌器を内蔵する連続鋳造用鋳型材料 |
EP0464151A4 (en) * | 1989-03-20 | 1992-07-01 | Olin Corporation | In-mold electromagnetic stirring of molten metal during casting |
JPH03191034A (ja) * | 1989-12-21 | 1991-08-21 | Nippon Mining Co Ltd | 酸化膜密着性に優れた半導体機器のリード材用銅合金 |
JP2738130B2 (ja) * | 1990-05-25 | 1998-04-08 | 三菱マテリアル株式会社 | 高冷却能を有する高強度Cu合金製連続鋳造鋳型材およびその製造法 |
JPH04210438A (ja) * | 1990-12-13 | 1992-07-31 | Mitsubishi Materials Corp | 高強度Cu 合金製連続鋳造鋳型材 |
DE4142941A1 (de) | 1991-12-24 | 1993-07-01 | Kabelmetal Ag | Verwendung einer aushaertbaren kupferlegierung |
-
1994
- 1994-08-06 DE DE4427939A patent/DE4427939A1/de not_active Withdrawn
-
1995
- 1995-06-29 AT AT95110134T patent/ATE186076T1/de active
- 1995-06-29 DE DE59507131T patent/DE59507131D1/de not_active Expired - Lifetime
- 1995-06-29 EP EP95110134A patent/EP0702094B1/de not_active Expired - Lifetime
- 1995-06-29 ES ES95110134T patent/ES2139780T3/es not_active Expired - Lifetime
- 1995-07-05 KR KR1019950019576A patent/KR100374051B1/ko not_active IP Right Cessation
- 1995-07-24 RU RU95113726/02A patent/RU2160648C2/ru active
- 1995-07-25 ZA ZA956181A patent/ZA956181B/xx unknown
- 1995-07-31 PL PL95309841A patent/PL177973B1/pl unknown
- 1995-08-03 CN CN95108676A patent/CN1058532C/zh not_active Expired - Lifetime
- 1995-08-04 JP JP7200045A patent/JPH08104928A/ja active Pending
- 1995-08-04 FI FI953730A patent/FI112669B/fi not_active IP Right Cessation
-
1997
- 1997-07-28 US US08/901,820 patent/US6565681B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE186076T1 (de) | 1999-11-15 |
DE59507131D1 (de) | 1999-12-02 |
KR960007802A (ko) | 1996-03-22 |
ZA956181B (en) | 1996-03-08 |
EP0702094A1 (de) | 1996-03-20 |
FI953730A0 (fi) | 1995-08-04 |
FI953730A (fi) | 1996-02-07 |
US6565681B1 (en) | 2003-05-20 |
KR100374051B1 (ko) | 2003-05-09 |
DE4427939A1 (de) | 1996-02-08 |
ES2139780T3 (es) | 2000-02-16 |
PL309841A1 (en) | 1996-02-19 |
PL177973B1 (pl) | 2000-02-29 |
FI112669B (fi) | 2003-12-31 |
RU2160648C2 (ru) | 2000-12-20 |
CN1122837A (zh) | 1996-05-22 |
JPH08104928A (ja) | 1996-04-23 |
CN1058532C (zh) | 2000-11-15 |
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