EP0522542B1 - Verfahren zur Herstellung von nahtlosen Drahtschlaufen - Google Patents

Verfahren zur Herstellung von nahtlosen Drahtschlaufen Download PDF

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Publication number
EP0522542B1
EP0522542B1 EP92111614A EP92111614A EP0522542B1 EP 0522542 B1 EP0522542 B1 EP 0522542B1 EP 92111614 A EP92111614 A EP 92111614A EP 92111614 A EP92111614 A EP 92111614A EP 0522542 B1 EP0522542 B1 EP 0522542B1
Authority
EP
European Patent Office
Prior art keywords
ring
cutting
wire
loop
rolling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP92111614A
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German (de)
English (en)
French (fr)
Other versions
EP0522542A1 (de
Inventor
Dieter Dr. Seifert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wacker-Siltronic Gesellschaft fur Halbleitermater
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Publication of EP0522542A1 publication Critical patent/EP0522542A1/de
Application granted granted Critical
Publication of EP0522542B1 publication Critical patent/EP0522542B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B5/00—Extending closed shapes of metal bands by rolling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S76/00—Metal tools and implements, making
    • Y10S76/12—Diamond tools

Definitions

  • the invention relates to a method for producing a cutting tool for wire saws with wire loops, which have constant strength and high shape precision over their entire circumference.
  • brittle hard workpieces for example rods or blocks made of semiconductor materials such as silicon or of compound semiconductor materials such as gallium arsenide, are sawn into thin disks.
  • the slices (wafers) with thicknesses of 0.1 mm to 1 mm serve as the starting product for the production of various electronic components or for the production of solar cells.
  • a low cut loss, a high geometric quality of the sawn off discs combined with high sawing rates are the most important requirements to be met for an economical sawing process.
  • Hole, wire and band saws are the most commonly used sawing machines when it comes to cutting brittle hard workpieces with high precision. So far, internal hole saws have been used in particular to saw bars made of silicon single crystals into wafers. However, the saw blades of the hole saws can no longer follow the unbroken trend towards single crystals with ever larger diameters - the technology has now mastered the pulling of crystals with diameters of 300 mm in the required quality. Larger saw blades can only be stabilized by increasing the thickness so that discs with the required geometric quality are obtained. With the inevitably wider cutting edges, higher cutting losses have to be accepted. In particular, if the lost material is complex, high-quality semiconductor material, the cost-effectiveness of wafer production is severely impaired. Another disadvantage of the sawing process arises from the effort for the design of the machine and the cutting tool, which increases with the workpiece diameter.
  • Wire and band saws with fixed abrasive grain form an alternative to hole saws, especially for workpieces with large diameters.
  • Wire saws with loose lapping grain can also be used for smaller workpieces, in which the wire is wound several times over deflection rollers, so that a large number of wafers can be produced at the same time.
  • Band saw blades for sawing hard-brittle material are usually provided with cutting plates along one edge or continuously with a cutting surface from which the fixed cutting grains of diamond or boron nitride protrude. The tapes are on their ends welded into ribbon loops. Such belt loops are guided in a circle over deflection rollers. The workpiece is fed against the cutting edge perpendicular to the direction of movement of the belt.
  • the circulating speeds of wire or belt loops with fixed cutting grains reach considerable values, depending on the material.
  • hard brittle calf conductor material such as silicon
  • these are preferably between 20 m / s and 120 m / s.
  • the loops must be tensioned with a high tensile force so that the lateral deflection of the saw blade remains within a tolerance range of a few ⁇ m due to the influence of the sawing forces.
  • the loop material has to be extremely resistant to bending.
  • Particularly suitable materials for saw bands and wires are steels and special alloys due to their high tensile strength and elasticity limits.
  • the weak points of wire and tape loops form the seams at which the wire or tape ends have been welded or soldered into loops.
  • the lower strength of the seam must be taken into account by adjusting the tape tension. If, as in the case of silicon processing, the cutting tools can only be cut with the required quality when there is a high tensile load, the strip cross-sections and wire diameter must be increased accordingly.
  • seam tensions arise, which additionally impair the flatness and the concentricity of the belt loop and impair the precision of the cuts.
  • Patent application WO-A-87/02286 relates to an endless saw band and its manufacture.
  • the object of the invention was to provide a method for producing a cutting tool for wire saws with heavy-duty wire loops, which have as constant a strength as possible over their entire circumference.
  • steel materials in the form of strips or plates can be formed into very thin, dimensionally accurate strips or foils.
  • the rolling work is usually divided into several rolling stands, which the material passes through one after the other.
  • Cold rolling in particular when processing materials by rolling without the addition of heat, results in a special hardening of the material in addition to the deformation. This effect is used in technology, among other things, for the production of high-strength spring steel strips.
  • Steel strips manufactured using this process have tensile strengths of up to 2200 N / mm2. Special alloys can reach even higher values.
  • the method according to the invention makes cutting tools for wire saws with seamless wire loops accessible which have these favorable material properties.
  • a rollable exit ring is first manufactured and then cold-rolled in a rolling device to form a thin band loop.
  • the band loop is divided into wire loops. These are then provided with a cutting surface.
  • FIG. 1 a) -d) is schematically the progress of the treatment of a blank for Rollable output ring shown.
  • FIG. 2 shows a schematic embodiment of a possible embodiment for a cold rolling mill in which the metal ring is expanded to form a seamless strip loop.
  • the blanks are manufactured from basic bodies by machining or non-cutting measures. Rings which are separated from seamless metal tubes, separated from metal plates or produced from perforated cylindrical base bodies are particularly suitable. Of course you can also pour the blanks. Under certain circumstances, it is advisable to first widen the inner ring diameter using the hot rolling process or by forging.
  • the choice of material is independent of the weldability and basically expandable to all rollable materials. Steels that are also used to manufacture springs and other materials that achieve high strength after rolling have proven to be particularly advantageous.
  • the geometry of the belt loop to be produced is largely predetermined.
  • the ring circumference of the starting ring is increased and the jacket thickness is reduced accordingly.
  • the blank must be reworked into an exit ring with a jacket thickness of approximately 0.48 mm.
  • the inner diameter of the annular blank (1) is first expanded, for example by grinding, to a cylindrical seat (2) to a width greater than the desired belt loop width.
  • this ring part is separated from the rest and, as shown in Fig. 1 c), mounted on a precisely fitting mandrel (3).
  • mandrel it is also possible to insert the mandrel first and then remove the remnant.
  • the rollable exit ring (4) with the calculated wall thickness results.
  • This stage is indicated in Fig. 1 d).
  • the diameter of the exit ring can be freely selected within wide limits.
  • the ring width essentially depends on how many wire loops the band loop is to be divided into. However, it must be ensured that very wide rings can still be rolled precisely.
  • Output rings with a width of 5 mm to 400 mm are processed with particular advantage. As shown above, the remaining dimensions for the exit ring are based on the circumference and the strip thickness of the strip loop to be produced.
  • exit rings with diameters of 50 mm to 500 mm, which are rolled out to a belt loop circumference of preferably 1 m to 6 m.
  • the thickness of the rolled loops is preferably 0.01 mm to 1.5 mm.
  • the extension of the exit ring to the belt loop takes place in a cold rolling device.
  • the rolling out can, however, be interrupted by heat treatment steps in order to counteract excessive embrittlement.
  • Cold strip rolling mills are known for the production of thin metal foils or metal strips and have been described, for example, in "THE TECHNICAL KNOWLEDGE OF THE ENGINEER", Volume I / 2, VEB subuchverlag für, 204-206 (1965).
  • the rolling device (according to FIG. 2) is particularly suitable for the production of belt loops.
  • FIG. 2 shows the exit ring 4 and the widening band loop 5 in the rolling device.
  • the roller arrangement in the machine frame 6 is shown in the form customary in rolling technology. The rolling process and the associated work hardening of the workpiece takes place between two opposing thin work rolls 7a, 7b, generally made of smooth, hardened steel.
  • auxiliary rollers 8a, 8b with a larger diameter rest on the work rolls 7a, 7b. They are partially driven and transfer the movement to the adjacent rollers.
  • the work roll 7b located in the interior of the belt loop is supported with the aid of auxiliary rolls 8b through the belt loop onto support rolls 9 mounted in the frame 6.
  • the outer work roll 7a is preferably surrounded by a total of five auxiliary rolls 8a. Two of them are touching the work roll, the remaining three form a further layer of surrounding rolls.
  • the infeed of the work rolls is preferably possible by changing the position of the outer support rolls 9.
  • These rollers with an even larger diameter also limit the deflection of the thinner rollers when the rolling forces are transferred to the workpiece.
  • the support rollers belonging to the upper work roll are expediently used for the infeed.
  • the support rollers of the lower work roller are arranged in the form shown as a Y rotated by 180 ° specifically for processing the belt loop.
  • the use of multiple layers of support Rolling makes it possible to use work rolls with small diameters, for example of 4 mm, so that even high-strength materials can be rolled.
  • roller arrangements are also possible.
  • the rolling forces are supported outwards over the returning part of the belt loop onto the rigid machine frame 6, as is shown by way of example in FIG. 2. This enables a particularly high level of accuracy to be achieved when rolling the belt loop.
  • tape guide rollers that adapt to the widening circumference of the workpiece are not shown in FIG. 2. Nevertheless, such roles are useful on a large scale, especially in the production of tape loops. Likewise, conventional bearings and support devices for securing the positional stability of the roller arrangement and devices for lubricating the strip known from rolling technology are missing in the illustration.
  • the rolled-out band loop is optionally subjected to some post-treatment measures known in the art. In particular, it can be hardened, tempered and straightened.
  • the rolled-out band loop is brought to the same width over its entire circumference and divided.
  • it is preferably mounted on a set of rollers, advantageously formed from 2 to 3 rollers, tensioned and ground on the edges.
  • the belt loop is then closed, for example by cutting Wires divided.
  • the belt loop expediently runs around the roller set while the rotating saw edge of the cutting tool is guided against it.
  • Multi-blade saws with narrow saw blade spacing are particularly suitable as cutting tools.
  • a large number of high-strength wire loops are produced from a seamless band loop.
  • the separation steps required are carried out in such a way that a harp is formed from wires with the spacing required for the cutting process.
  • the rollers of the roller set are provided with guide grooves for receiving the wires. When the tape loop is cut, the tensioned wires slide automatically into these guide grooves.
  • a cutting surface is applied to the outer wire circumference of the wire loops.
  • the cutting surface is preferably deposited electrochemically, the wire side to be covered being immersed in the deposition bath.
  • the assignment takes place with wire loops already installed on the reel set. By covering the wire areas not to be covered when coating with the diamond coating, it is ensured that the coating is only applied to the cut side of the wires.
  • the finished cutting tool can then immediately be used together with the roller set in the sawing machine without a large number of wire loops having to be placed individually on the rollers of the machine. Worn pads can be renewed and the cutting tools can be reused. If necessary, the wire loops can also be produced from the belt loop and the cutting covering can be applied to the roller set already in the sawing machine.
  • the wire loops of the cutting tool produced by the method according to the invention are characterized by a particular strength, so that even brittle hard material, such as silicon, can be cut precisely with a very small sawing gap and correspondingly low cutting loss.
  • the manufacturing process avoids complex measures and allows the cutting tool to be easily installed and removed from the sawing machine.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP92111614A 1991-07-12 1992-07-09 Verfahren zur Herstellung von nahtlosen Drahtschlaufen Expired - Lifetime EP0522542B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4123095 1991-07-12
DE4123095A DE4123095A1 (de) 1991-07-12 1991-07-12 Verfahren und vorrichtung zur herstellung von nahtlosen band- und drahtschlaufen, und deren verwendung als trennwerkzeuge in band- und drahtsaegen

Publications (2)

Publication Number Publication Date
EP0522542A1 EP0522542A1 (de) 1993-01-13
EP0522542B1 true EP0522542B1 (de) 1995-09-27

Family

ID=6435988

Family Applications (1)

Application Number Title Priority Date Filing Date
EP92111614A Expired - Lifetime EP0522542B1 (de) 1991-07-12 1992-07-09 Verfahren zur Herstellung von nahtlosen Drahtschlaufen

Country Status (7)

Country Link
US (1) US5287774A (enrdf_load_stackoverflow)
EP (1) EP0522542B1 (enrdf_load_stackoverflow)
JP (1) JPH05192816A (enrdf_load_stackoverflow)
KR (1) KR950015116B1 (enrdf_load_stackoverflow)
DE (2) DE4123095A1 (enrdf_load_stackoverflow)
FI (1) FI923185A7 (enrdf_load_stackoverflow)
TW (1) TW235931B (enrdf_load_stackoverflow)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19510625A1 (de) * 1995-03-23 1996-09-26 Wacker Siltronic Halbleitermat Drahtsäge und Verfahren zum Abtrennen von Scheiben von einem Werkstück
DE19519460A1 (de) * 1995-05-26 1996-11-28 Wacker Siltronic Halbleitermat Drahtsäge und Verfahren zum Abtrennen von Scheiben von einem Werkstück
DE10122628B4 (de) * 2001-05-10 2007-10-11 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück
JP4991229B2 (ja) * 2006-09-22 2012-08-01 信越半導体株式会社 切断方法およびエピタキシャルウエーハの製造方法
DE102009038941B4 (de) 2009-08-26 2013-03-21 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
DE102009051008B4 (de) * 2009-10-28 2013-05-23 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
DE102010005904B4 (de) 2010-01-27 2012-11-22 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
DE102010013520B4 (de) 2010-03-31 2013-02-07 Siltronic Ag Verfahren zur beidseitigen Politur einer Halbleiterscheibe
DE102010014874A1 (de) 2010-04-14 2011-10-20 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
DE102011008400B4 (de) 2011-01-12 2014-07-10 Siltronic Ag Verfahren zur Kühlung eines Werkstückes aus Halbleitermaterial beim Drahtsägen
DE102011005512A1 (de) 2011-03-14 2012-01-19 Siltronic Ag Verfahren zur beidseitigen Politur einer Halbleiterscheibe
DE102011082366B3 (de) * 2011-09-08 2013-02-28 Siltronic Ag Einlagiges Wickeln von Sägedraht mit fest gebundenem Schneidkorn für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück
DE102012221904B4 (de) 2012-11-29 2018-05-30 Siltronic Ag Verfahren zur Wiederaufnahme des Drahtsägeprozesses eines Werkstückes nach einer unplanmäßigen Unterbrechung
US10252357B2 (en) 2012-12-04 2019-04-09 Meyer Burger Ag Wire management system
DE102013219900B3 (de) * 2013-10-01 2015-02-26 Siltronic Ag Verfahren zum Rillieren der Drahtführungsrollen für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück
DE102013223344B3 (de) * 2013-11-15 2015-05-07 Siltronic Ag Verfahren zum Zersägen eines temperierten Werkstückes mit einer Drahtsäge
DE102013225104B4 (de) 2013-12-06 2019-11-28 Siltronic Ag Verfahren zum Abtrennen von Scheiben von einem Werkstück mittels einer Drahtsäge
DE102015204275B3 (de) * 2015-03-10 2016-05-12 Siltronic Ag Verfahren zur Wiederaufnahme eines Drahttrennläppvorgangs mit strukturiertem Sägedraht nach Unterbrechung
DE102016222899A1 (de) 2016-11-21 2018-05-24 Siltronic Ag Vorrichtung und Verfahren zum Zersägen eines Werkstückes mit einer Drahtsäge
DE102016224640B4 (de) 2016-12-09 2024-03-28 Siltronic Ag Verfahren zum Zersägen eines Werkstückes mit einer Drahtsäge
JP6578412B1 (ja) * 2018-06-08 2019-09-18 株式会社アマダホールディングス 環状帯鋸刃の製造方法及び製造装置
CN110695270B (zh) * 2019-09-20 2020-09-29 太原科技大学 一种立式小辊径工作辊辗环装置

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DE372377C (de) * 1920-10-01 1923-03-27 Siegfried Gumpel Verfahren zur Herstellung endloser Saegebaender ohne Naht
US2029751A (en) * 1933-06-07 1936-02-04 Jr James L Adams Metal rolling mill
NL169428C (nl) * 1977-06-28 1983-11-16 Volvo Car Bv Trekwalsinrichting voor het uitwalsen van eindloze metalen banden.
GB2055643B (en) * 1979-08-13 1982-11-24 Gersan Ets Method of and apparatus for manufacturing a saw blade of a band saw
US4568617A (en) * 1983-08-08 1986-02-04 Wilkes Donald F Thin bands and method and apparatus for production thereof
JPS60158902A (ja) * 1984-01-30 1985-08-20 Amada Co Ltd バンドソ−マシンにおける極薄肉のエンドレスバンドの製造方法
SE446380B (sv) * 1984-04-18 1986-09-08 Bror Elofson Sett att tillverka bandsagblad utan skarv
JPS61132206A (ja) * 1984-11-30 1986-06-19 Aisin Warner Ltd 金属製無端バンドの圧延装置
JPS61284317A (ja) * 1985-06-07 1986-12-15 Sanwa Daiyamondo Kogyo Kk 硬質物切断用無端帯鋸
SE453222B (sv) * 1985-08-15 1988-01-18 Tri Innovations Ab Vermebehandlingsugn
JPS6348603A (ja) * 1986-08-15 1988-03-01 Hitachi Ltd 光磁気デイスク装置用電磁コイル
JPH0311841A (ja) * 1989-06-09 1991-01-21 Nec Corp ローカルエリアネットワーク
JP4089620B2 (ja) * 2004-01-15 2008-05-28 株式会社デンソー 車両制御システム

Also Published As

Publication number Publication date
US5287774A (en) 1994-02-22
FI923185L (fi) 1993-01-13
EP0522542A1 (de) 1993-01-13
KR950015116B1 (ko) 1995-12-22
TW235931B (enrdf_load_stackoverflow) 1994-12-11
FI923185A7 (fi) 1993-01-13
DE59203806D1 (de) 1995-11-02
FI923185A0 (fi) 1992-07-10
DE4123095A1 (de) 1993-01-14
JPH05192816A (ja) 1993-08-03

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