EP0508265A2 - Procédé d'activation des surfaces de substrats en vue d'une métallisation par voie chimique - Google Patents
Procédé d'activation des surfaces de substrats en vue d'une métallisation par voie chimique Download PDFInfo
- Publication number
- EP0508265A2 EP0508265A2 EP92105453A EP92105453A EP0508265A2 EP 0508265 A2 EP0508265 A2 EP 0508265A2 EP 92105453 A EP92105453 A EP 92105453A EP 92105453 A EP92105453 A EP 92105453A EP 0508265 A2 EP0508265 A2 EP 0508265A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- weight
- parts
- gew
- activator
- palladium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003213 activating effect Effects 0.000 title claims abstract 4
- 238000000034 method Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 title claims description 9
- 238000005868 electrolysis reaction Methods 0.000 title 1
- 239000000203 mixture Substances 0.000 claims abstract description 64
- 239000012190 activator Substances 0.000 claims abstract description 39
- 239000006185 dispersion Substances 0.000 claims abstract description 32
- 239000004814 polyurethane Substances 0.000 claims abstract description 24
- 229920002635 polyurethane Polymers 0.000 claims abstract description 24
- 229920000642 polymer Polymers 0.000 claims abstract description 18
- 239000002904 solvent Substances 0.000 claims abstract description 17
- 238000001465 metallisation Methods 0.000 claims abstract description 12
- 239000000945 filler Substances 0.000 claims abstract description 10
- 238000009472 formulation Methods 0.000 claims description 52
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 44
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 22
- 229910052763 palladium Inorganic materials 0.000 claims description 12
- -1 ether ester Chemical class 0.000 claims description 11
- 229910000510 noble metal Inorganic materials 0.000 claims description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 5
- 150000002736 metal compounds Chemical class 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 229920001228 polyisocyanate Chemical group 0.000 claims description 4
- 239000005056 polyisocyanate Chemical group 0.000 claims description 4
- 150000002576 ketones Chemical class 0.000 claims description 3
- 150000002941 palladium compounds Chemical class 0.000 claims description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 3
- 238000009835 boiling Methods 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- 125000003158 alcohol group Chemical group 0.000 claims 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 229920003023 plastic Polymers 0.000 abstract description 4
- 239000004033 plastic Substances 0.000 abstract description 4
- 125000002524 organometallic group Chemical group 0.000 abstract description 3
- 238000012216 screening Methods 0.000 abstract 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- 239000007921 spray Substances 0.000 description 19
- 229910002019 Aerosil® 380 Inorganic materials 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 238000003756 stirring Methods 0.000 description 13
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 12
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 9
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 8
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- WXNOJTUTEXAZLD-UHFFFAOYSA-L benzonitrile;dichloropalladium Chemical compound Cl[Pd]Cl.N#CC1=CC=CC=C1.N#CC1=CC=CC=C1 WXNOJTUTEXAZLD-UHFFFAOYSA-L 0.000 description 7
- 239000000725 suspension Substances 0.000 description 7
- 230000001427 coherent effect Effects 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229920000515 polycarbonate Polymers 0.000 description 5
- 239000004417 polycarbonate Substances 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 4
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 150000004760 silicates Chemical class 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- UKSZBOKPHAQOMP-SVLSSHOZSA-N (1e,4e)-1,5-diphenylpenta-1,4-dien-3-one;palladium Chemical compound [Pd].C=1C=CC=CC=1\C=C\C(=O)\C=C\C1=CC=CC=C1.C=1C=CC=CC=1\C=C\C(=O)\C=C\C1=CC=CC=C1 UKSZBOKPHAQOMP-SVLSSHOZSA-N 0.000 description 1
- QFMZQPDHXULLKC-UHFFFAOYSA-N 1,2-bis(diphenylphosphino)ethane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CCP(C=1C=CC=CC=1)C1=CC=CC=C1 QFMZQPDHXULLKC-UHFFFAOYSA-N 0.000 description 1
- OZXIZRZFGJZWBF-UHFFFAOYSA-N 1,3,5-trimethyl-2-(2,4,6-trimethylphenoxy)benzene Chemical compound CC1=CC(C)=CC(C)=C1OC1=C(C)C=C(C)C=C1C OZXIZRZFGJZWBF-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- JHHZQADGLDKIPM-AATRIKPKSA-N 3-Hepten-2-one Chemical compound CCC\C=C\C(C)=O JHHZQADGLDKIPM-AATRIKPKSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 239000004805 Cyclohexane-1,2-dicarboxylic acid Substances 0.000 description 1
- 229910020427 K2PtCl4 Inorganic materials 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 235000012216 bentonite Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical class B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 235000019241 carbon black Nutrition 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 1
- GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 description 1
- 239000002734 clay mineral Substances 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 150000003983 crown ethers Chemical class 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical group CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229960004592 isopropanol Drugs 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- SHOJXDKTYKFBRD-UHFFFAOYSA-N mesityl oxide Natural products CC(C)=CC(C)=O SHOJXDKTYKFBRD-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920001291 polyvinyl halide Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 229910002093 potassium tetrachloropalladate(II) Inorganic materials 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- XWGJFPHUCFXLBL-UHFFFAOYSA-M rongalite Chemical compound [Na+].OCS([O-])=O XWGJFPHUCFXLBL-UHFFFAOYSA-M 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid group Chemical class S(O)(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 150000004764 thiosulfuric acid derivatives Chemical class 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- JHHZQADGLDKIPM-UHFFFAOYSA-N trans-hept-3-en-2-one Natural products CCCC=CC(C)=O JHHZQADGLDKIPM-UHFFFAOYSA-N 0.000 description 1
- 210000003934 vacuole Anatomy 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Definitions
- metal layers which adhere well to plastic surfaces can be produced without the disadvantages mentioned, if they are treated without a prior pickling with an activator formulation based on organic noble metal compounds, fillers, a solvent and an aqueous dispersion of a polyurethane polymer as a binder.
- the formulations are characterized in that they contain an aqueous dispersion of a polyurethane polymer.
- Preferred spray activator formulations contain 0.05 to 1.5 parts by weight of component a) and 10 to 20 parts by weight of component b).
- Suitable activators in the formulations according to the invention are organometallic compounds of the 1st and 8th subgroups of the periodic table (in particular Pd, Pt, Au, Ag), as are described, for example, in EP-A 34 485, 81 438, 131 198.
- Organometallic complex compounds of palladium with olefins (dienes), with ⁇ , ⁇ -unsaturated carbonyl compounds, with crown ethers and with nitriles are particularly suitable.
- Bisacetonitrile palladium dichloride, butadiene palladium dichloride, 4-cyclohexane-1,2-dicarboxylic acid anhydride palladium dichloride, mesityl oxide palladium dichloride, 3-hepten-2-one palladium chloride and 5-methyl-3-hexane-2-one palladium chloride are very particularly suitable.
- mixtures of these compounds can also be used.
- the activators or the mixtures thereof are introduced into the aqueous dispersion in accordance with the process according to the invention. This is generally done by mixing the ingredients.
- the incorporation of the formulation components can also be carried out in separate steps.
- the activator can first be in a solvent of the overall formulation, e.g. pre-dissolve or disperse in ethanol and then filler, e.g. Add Aerosil®.
- the activator is reduced to the metallic form by adding formalin or complexed by means of complexing agents and introduced into the aqueous dispersion of the binder. This is done by stirring or dispersing.
- complexing agents e.g. Chlorides, thiosulfates, rhodanides, cyanides, ammonia or amines are used.
- complex compounds are Pd (NH3) 2Cl2, Pd (NH3) 4Cl2, Pd (NH3) 4 (NO3) 2, K2PdCl4, K2Pd (CN) 4, [NH4] 2PdCl6, [NH4) 2PdCl4, Pt (NH3) 4Cl2, K2PtCl4, KAg (CN) 2, KAg (S2O3), KAu (CN) 2, NaAuCl4.
- Zero-valent complex compounds such as palladium (O) tetrakis (triphenylphosphine), bis [bis- (1,2-diphenylphosphino) ethane] palladium (O) or bis (dibenzylidene acetone) palladium (O) are also suitable.
- Pd, Ag, Au, Pt on activated carbon, on aluminum oxide, on calcium carbonate, on barium carbonate, on activated aluminum oxide and palladium black platinum black may be mentioned as colloidal noble metal systems which can also serve as activators.
- Auxiliaries known from printing or coating technology such as pigments, disperse silicas, carbon blacks, silicates, oxides, rheological additives and clay minerals, are suitable as fillers.
- Silicates bentonites, talc and chalk are preferred.
- the amount of filler can vary in the range from 0.5 to 3 parts by weight, based on the mass of the formulation.
- further constituents such as surfactants, leveling agents, defoamers, dyes and metal dyes, can also be mixed in at low concentrations of up to 10% by weight, preferably up to 2% by weight.
- Suitable solvents in the formulations according to the invention are substances known in printing or coating technology, such as ketones, for example methyl ethyl ketone, cyclohexanone, esters, for example butyl acetate, diacctate of phthalate, butyl glycolate, glycol ethers, for example ethylene glycol monomethyl ether, diglyme, propylene glycol monomethyl ether acetate; Alcohols such as ethanol, n-propanol, iso-propanol, n-butanol, iso-butanol; Diacetone alcohol. Mixtures of these solvents and their blends with other solvents can of course also be used.
- ketones for example methyl ethyl ketone, cyclohexanone
- esters for example butyl acetate, diacctate of phthalate, butyl glycolate, glycol ethers, for example ethylene glycol monomethyl ether, diglyme, propylene glycol monomethyl ether
- the solvents used only serve to dissolve the organic Pd compound and, if necessary, can be removed by evaporation after the noble metal activator has been reduced.
- the grain size of the metallic noble metal produced can be influenced during the reduction by the use of solvents.
- the binders of the aqueous dispersion according to the invention with a polymer content of 10-60, preferably 20-55, particularly preferably 30-50% by weight are known from polyurethane chemistry. They are produced, for example, by reacting polyesters and / or polyethers with aromatic or aliphatic polyisocyanates (Angew. Chemie 82 (1970), 53-63; DE-OS 23 14 512; DE-OS 23 14 513; DE-OS 26 51 506 ).
- polyurethanes which do not contain any free isocyanate groups, optionally blocked isocyanate groups and / or anionic groups, e.g. Contain SO3 groups.
- Linear, aliphatic polyurethanes such as those made, for example, from hexanediol, neopentyl glycol and polyisocyanates, have proven particularly suitable.
- the formulations may contain surfactants, leveling agents and / or dyes
- Surfaces can be activated for the purpose of adhesive chemical metallization, preferably by spraying on the formulations according to the invention by means of processes known from the paint industry.
- spraying on the formulations can be replaced by dipping, brushing and rolling up.
- Suitable substrates for the process according to the invention are paper, enamel, ceramics, polyethylene, polypropylene, epoxy resins, polyesters, polycarbonates, polyamides, polyimides, polyhydantoins, ABS plastics, silicones, polyvinyl halides and polyvinylidene fluoride in the form of films, sheets, papers and nonwovens.
- Substrates such as are used as housings in the electronics industry are particularly preferred, e.g. ABS and polycarbonate plastics or their blends, polyphenylene sulfide, polybutylene terephthalate and their blends and polypropylene oxide.
- the solvents are removed. This is done by drying or tempering at substrate-specific temperatures, for example between room temperature and 240 ° C under normal pressure, increased pressure or vacuum. The drying time can be varied.
- the surfaces treated in this way then only have to be activated by reduction in the case of the complexed activator, e.g. through reducing agents such as formaldehyde, hypophosphites, rongalite and boranes.
- reducing agents such as formaldehyde, hypophosphites, rongalite and boranes.
- One form of the process is therefore that the reduction, e.g. in the case of the complexed activators, is carried out in the metallization bath with the reducing agent of the electroless metallization. This applies to suitable nickel and copper baths.
- a preferred form of the method consists in using formulations in which the activator is already in active form by reduction.
- the surfaces treated with the formulations according to the invention can be metallized directly without current.
- the metallization baths that are suitable for this are known in the art of electroless metallization.
- the formulations according to the invention are particularly suitable for the partial activation of geometrically complicated surfaces, in particular for the production of molded bodies metallized on one or both sides or of housing parts metallized on the inside for the electronics industry for the purpose of electromagnetic shielding.
- This method can of course also be used to produce structured metal surfaces using a suitable mask.
- the spray activator formulation thus produced was sprayed on an injection-molded test plate (molded parts) using an air-assisted spray gun (4 bar).
- the spraying distance was approx. 40 cm; the nozzle cross section was 1.5 mm; the air metering (2-6 bar) could be varied.
- a blend of ABS polymer (acrylonitrile-butadiene-styrene copolymer) and a polycarbonate of 4,4'-dihydroxydiphenyl-2,2-propane and carbonic acid was used as the test plate substrate.
- the plate was annealed at 70 ° C for 1 h, metallized in a metal bath at 23 ° C for 4 h in a commercially available formalin-containing copper bath and then annealed at 70 ° C for 1 h. A coherent metal layer was obtained.
- the spray activator formulation was prepared and the process carried out as in Example 1, except that 2 parts by weight of bis (benzonitrile) palladium (II) dichloride were used in the spray activator formulation.
- the formulation was sprayed using an air-assisted spray gun on an injection-molded test plate made of a polycarbonate composed of 4,4'-dihydroxydiphenyl-2,2-propane and carbonic acid, the plate was annealed at 100 ° C. for 1 hour, after the plate had cooled in a metal bath Metallized at 23 ° C for 2 h. The mixture was then heated at 100 ° C for 1 h. A coherent metal layer was obtained.
- the spray activator formulation was prepared and carried out as in Example 1, except that 0.7 ml of formalin was used.
- the formulation was sprayed by means of a spray gun with air support on an injection-molded test plate (molded part) made of an ABS polymer (acrylonitrile-butadiene-styrene copolymer), the air metering was adjusted to 4 bar.
- the plate was annealed at 70 ° C for 1 h, after cooling the plate to room temperature in a metal bath at 23 ° C for 4.5 h. A coherent metal layer was obtained.
- Example 1 The same 40% aqueous dispersion of a polyurethane as in Example 1 was used.
- the formulation was prepared by pre-dissolving the palladium compound in 200 ml of ethanol. The mixture was then diluted with 200 ml of water, and 15 g of Aerosil® 380 (380 m 2 / g according to BET) were stirred or dispersed in this preliminary solution. Then 1.4 ml of fresh aqueous formalin was added with stirring using a syringe.
- the suspension was diluted with 300 ml of water and then heated to about 80 ° C.-100 ° C. with continued stirring until ethanol was completely removed. Losses of evaporated water were compensated for by refilling.
- the suspension was mixed with the 40% strength aqueous dispersion of the polyurethane with stirring.
- the spray activator formulation thus produced was sprayed on an injection-molded test plate (molded parts) using an air-assisted spray gun (4 bar).
- the spraying distance was approx. 40 cm; the nozzle cross section was 1.5 mm; the air metering (2-6 bar) could be varied.
- ABS polymer acrylonitrile-butadiene-styrene copolymer
- polycarbonate 4,4'-dihydroxydiphenyl-2,2-propane and carbonic acid
- the plate was dried at room temperature for 24 hours, metallized in a metal bath at 23 ° C. for 3 hours in a commercially available formalin-containing copper bath and then annealed at 70 ° C. for 1 hour. A coherent metal layer was obtained.
- Adhesive strength according to DIN 53494 25 N / 25 mm.
- Example 1 The same 40% aqueous dispersion of a polyurethane as in Example 1 was used.
- the formulation is prepared as in Example 4.
- the formulation was sprayed using an air-assisted spray gun on an injection-molded test plate made of 4,4'-dihydroxydiphenyl-2,2-propane and carbonic acid, the plate was dried after drying at room temperature for 24 hours, in a metal bath at 23 ° C 1 , Metallized for 5 hours in a commercially available formalin-containing copper bath and then annealed at 100 ° C. for 1 hour. A coherent metal layer was obtained.
- Example 1 The same 40% aqueous dispersion of a polyurethane as in Example 1 was used.
- the formulation was prepared by pre-dissolving the palladium compound in 200 ml of ethanol, then diluting with 200 ml of water and stirring or dispersing 15 g of Aerosil® 380 (380 m 2 / g by BET) in this preliminary solution. Then 0.7 ml of fresh aqueous formalin was added with stirring using a metering device (syringe).
- the suspension was diluted with 300 ml of water and then heated to about 80 ° C.-100 ° C. with continued stirring until ethanol was completely removed. Losses of evaporated water were compensated for by adding water.
- the suspension was mixed with the 40% strength aqueous dispersion of the polyurethane with stirring.
- the spray activator formulation thus produced was sprayed on an injection-molded test plate (molded parts) using an air-assisted spray gun (4 bar).
- the spraying distance was approx. 40 cm; the nozzle cross-section was 1.5 mm; the air metering (2-6 bar) could be varied.
- ABS polymer was used as the test plate substrate.
- the plate was dried at room temperature for 24 hours, metallized at 23 ° C. for 3 hours in a commercially available formalin-containing copper bath and then annealed at 70 ° C. for 1 hour. A coherent metal layer was obtained.
- Adhesive strength according to DIN 53494 28 N / 25 mm.
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Chemically Coating (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Polyurethanes Or Polyureas (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4111817A DE4111817A1 (de) | 1991-04-11 | 1991-04-11 | Formulierung zum aktivieren von substratoberflaechen fuer deren stromlose metallisierung |
DE4111817 | 1991-04-11 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0508265A2 true EP0508265A2 (fr) | 1992-10-14 |
EP0508265A3 EP0508265A3 (fr) | 1994-03-09 |
EP0508265B1 EP0508265B1 (fr) | 2000-01-12 |
Family
ID=6429353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP92105453A Expired - Lifetime EP0508265B1 (fr) | 1991-04-11 | 1992-03-30 | Procédé d'activation des surfaces de substrats en vue d'une métallisation par voie chimique |
Country Status (7)
Country | Link |
---|---|
US (1) | US5296020A (fr) |
EP (1) | EP0508265B1 (fr) |
JP (1) | JP2515463B2 (fr) |
AT (1) | ATE188750T1 (fr) |
CA (1) | CA2065605C (fr) |
DE (2) | DE4111817A1 (fr) |
ES (1) | ES2141712T3 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0633298A1 (fr) * | 1993-06-15 | 1995-01-11 | Bayer Ag | Mélange de poudres pour la métallisation de substrats |
EP1942207A1 (fr) * | 2006-12-08 | 2008-07-09 | Atotech Deutschland Gmbh | Solution de prétraitement et procédé de formation d'une couche d'un métal de revêtement sur un substrat doté d'une surface en plastique |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5674606A (en) * | 1995-04-06 | 1997-10-07 | Parker-Hannifin Corporation | Electrically conductive flame retardant materials and methods of manufacture |
DE19812880A1 (de) | 1998-03-24 | 1999-09-30 | Bayer Ag | Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung |
US20040031404A1 (en) * | 2002-08-19 | 2004-02-19 | John Dixon | Seamless embossing shim |
JP2010138475A (ja) * | 2008-12-15 | 2010-06-24 | Fujifilm Corp | めっき用触媒液、めっき方法、金属膜を有する積層体の製造方法 |
EP2835446A1 (fr) * | 2013-08-08 | 2015-02-11 | FRANZ Oberflächentechnik GmbH & Co KG | Procédé de métallisation avec couche de protection |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2635457A1 (de) * | 1976-08-04 | 1978-02-09 | Schering Ag | Katalytischer lack zur herstellung von gedruckten schaltungen |
EP0327057A1 (fr) * | 1988-02-01 | 1989-08-09 | TEXMET S.p.A. | Procédé pour métalliser les matériaux fibreux |
EP0256395B1 (fr) * | 1986-08-12 | 1992-07-01 | Bayer Ag | Procédé pour améliorer l'adhérence des couches de métaux déposées par voie chimique sur des surfaces en matière plastique |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3930109A (en) * | 1971-03-09 | 1975-12-30 | Hoechst Ag | Process for the manufacture of metallized shaped bodies of macromolecular material |
-
1991
- 1991-04-11 DE DE4111817A patent/DE4111817A1/de not_active Withdrawn
-
1992
- 1992-03-30 AT AT92105453T patent/ATE188750T1/de not_active IP Right Cessation
- 1992-03-30 DE DE59209793T patent/DE59209793D1/de not_active Expired - Fee Related
- 1992-03-30 EP EP92105453A patent/EP0508265B1/fr not_active Expired - Lifetime
- 1992-03-30 ES ES92105453T patent/ES2141712T3/es not_active Expired - Lifetime
- 1992-04-06 JP JP4112339A patent/JP2515463B2/ja not_active Expired - Fee Related
- 1992-04-07 US US07/864,782 patent/US5296020A/en not_active Expired - Lifetime
- 1992-04-08 CA CA002065605A patent/CA2065605C/fr not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2635457A1 (de) * | 1976-08-04 | 1978-02-09 | Schering Ag | Katalytischer lack zur herstellung von gedruckten schaltungen |
EP0256395B1 (fr) * | 1986-08-12 | 1992-07-01 | Bayer Ag | Procédé pour améliorer l'adhérence des couches de métaux déposées par voie chimique sur des surfaces en matière plastique |
EP0327057A1 (fr) * | 1988-02-01 | 1989-08-09 | TEXMET S.p.A. | Procédé pour métalliser les matériaux fibreux |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0633298A1 (fr) * | 1993-06-15 | 1995-01-11 | Bayer Ag | Mélange de poudres pour la métallisation de substrats |
US5487964A (en) * | 1993-06-15 | 1996-01-30 | Bayer Aktiengesellschaft | Powder mixtures for metallization of substrate surfaces |
EP1942207A1 (fr) * | 2006-12-08 | 2008-07-09 | Atotech Deutschland Gmbh | Solution de prétraitement et procédé de formation d'une couche d'un métal de revêtement sur un substrat doté d'une surface en plastique |
Also Published As
Publication number | Publication date |
---|---|
DE59209793D1 (de) | 2000-02-17 |
ATE188750T1 (de) | 2000-01-15 |
CA2065605C (fr) | 2002-03-26 |
US5296020A (en) | 1994-03-22 |
EP0508265A3 (fr) | 1994-03-09 |
JPH05125550A (ja) | 1993-05-21 |
JP2515463B2 (ja) | 1996-07-10 |
ES2141712T3 (es) | 2000-04-01 |
CA2065605A1 (fr) | 1992-10-12 |
DE4111817A1 (de) | 1992-10-15 |
EP0508265B1 (fr) | 2000-01-12 |
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