EP2835446A1 - Procédé de métallisation avec couche de protection - Google Patents

Procédé de métallisation avec couche de protection Download PDF

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Publication number
EP2835446A1
EP2835446A1 EP20130179697 EP13179697A EP2835446A1 EP 2835446 A1 EP2835446 A1 EP 2835446A1 EP 20130179697 EP20130179697 EP 20130179697 EP 13179697 A EP13179697 A EP 13179697A EP 2835446 A1 EP2835446 A1 EP 2835446A1
Authority
EP
European Patent Office
Prior art keywords
protective layer
component
layer
plastic
deposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20130179697
Other languages
German (de)
English (en)
Inventor
Wolf-Dieter Franz
Martin Franz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Franz Oberflaechentechnik GmbH and Co KG
Original Assignee
Franz Oberflaechentechnik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Franz Oberflaechentechnik GmbH and Co KG filed Critical Franz Oberflaechentechnik GmbH and Co KG
Priority to EP20130179697 priority Critical patent/EP2835446A1/fr
Publication of EP2835446A1 publication Critical patent/EP2835446A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1603Process or apparatus coating on selected surface areas
    • C23C18/1605Process or apparatus coating on selected surface areas by masking
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073Multistep pretreatment
    • C23C18/208Multistep pretreatment with use of metal first
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073Multistep pretreatment
    • C23C18/2086Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal

Definitions

  • the present invention relates to a method for metallizing a component surface.
  • Methods for metallizing component surfaces are used extensively.
  • An example to which the present invention is also preferably directed is the metallization of plastic components, in particular vehicle interior components. It may be z. B. act delusions or buttons in a car. Often, a metal surface is desired here for aesthetic reasons or to improve the cleaning properties or for other reasons.
  • the invention is based on the object of specifying in such a metallization a simple way to exclude a certain part of the surface of the metallization.
  • the surface (usually cleaned) is prepared for nucleation by sulfonation (optionally followed by a rinsing step), e.g. for a known seeding with palladium.
  • a protective layer that is non-metallic and non-conductive.
  • non-conductive denotes the absence of a metallic conductivity; It is about preventing a subsequent metallization in a preferred subsequent galvanic process.
  • a metal layer is then deposited by means of a chemical process, that is, without external current.
  • This metal layer may separate selectively, ie not on the protective layer, because there, as I said, there is no or no equivalent germination. Even if it deposits on the protective layer, it can later be removed with the protective layer.
  • Typical layer thicknesses are 0.1 to 1 ⁇ m.
  • Preferred examples are a chemical nickel layer and thereon e.g. a galvanic nickel layer and possibly a final chrome layer.
  • a treatment with palladium ions is preferred, ie in particular no seeding with colloidal palladium.
  • protective layer materials dissolve in the chemical metallization step or at the latest in the galvanic metallization step.
  • suitable cleaning steps can also be included. It has proven useful to deposit the protective layer using a printing process. Concretely, for example, an inkjet printer can be used become. The printer ink already forms a suitable protective layer.
  • the process according to the invention works particularly well on plastic components, preferably on those whose plastic has double bonds. These double bonds are good sites for sulfonation. For sulfonation is treated in gaseous sulfur trioxide, for example with oleum (fuming sulfuric acid).
  • a preferred group of materials are the polyaryl plastics.
  • Preferred field of application of the invention is the consideration of windows in the component, in particular for visible light, in special cases but also for infrared radiation. Then, e.g. a light signal or a light source for illumination or a sensor functioning with corresponding radiation use the corresponding translucent window.
  • the plastic may have a glass fiber portion for mechanical reinforcement and to improve the translucency (wherein translucency basically includes the transparency).
  • the glass fiber content is at least 50 percent by weight.
  • different material thicknesses are conceivable, from quite thin covered by the metallization and kept free through the window wall sections with a thickness in the tenth of a millimeter range up to a few millimeters.
  • a particular advantage lies in the fact that, especially with a glass fiber reinforcement, thick (and therefore stable) materials with thicknesses of more than 2 or even more than 3 mm are possible.
  • the plastic component coated in accordance with the invention may in particular also be a two-component injection-molded component in which one of the injection-molding operations has produced a transparent or generally translucent plastic window in a component which is otherwise designed according to criteria other than translucency. In the translucent area then a window according to the invention can be arranged.
  • the part of the surface covered by the protective layer can also form an opening in a planar metallization, that is to say an opening in an all-round and in comparison to the one Dimensions of the opening significantly larger area metal layer.
  • Such an opening can also serve for aesthetic design or leave a lying below the metal layer material for other reasons.
  • the application of the protective layer prior to seeding is also advantageous because the process can thus be carried out particularly simply.
  • the parts can be hung on a conventional galvanic rack and remain, so go through the various stages of the process (such as in the claims so numbered steps 3 to 5 and if necessary further) without further changing or remounting.
  • another frame is advantageous anyway, which is why a subsequent capping can hardly be avoided here.
  • the application of the protective layer according to the invention produces no significant additional expense.
  • the invention relates, as explained above, to a manufacturing method, but also to a finished vehicle interior component or another manufactured product, in whose production, inter alia, the inventive method has been applied, with a further processing is not excluded.
  • the invention also relates to the use of a sulfonated and partially covered with the protective layer according to claim 1 component for metallizing according to claim 1, that is, by seeding and subsequent chemical deposition.
  • the various features and retraction positions should also be disclosed for this purpose.
  • a switch or pushbutton for a motor vehicle interior is produced in a two-component injection molding process.
  • This component consists of glass fiber reinforced polyaryl plastic with a glass fiber content of 60 percent by weight and a translucent part.
  • This component to be coated is first cleaned and then sulfonated in gaseous sulfur trioxide for one minute. Basically, treatment times of between 10 seconds (preferably 20, 30, 40 or 50 seconds) and 10 minutes (preferably 9, 8, 7, 6 or 5 minutes) make sense for the sulfonation.
  • the sulfonated surface is first rinsed with water and then printed in the translucent portion with an ink jet printer, the ink jet printer, under the control of a computer, printing a particular symbol corresponding to the button actuated function in the vehicle, e.g. a seat heating symbol.
  • the printer ink stops processing and protects the underlying sub-surface from the next steps.
  • palladium ions are deposited on the surface and can be reduced in a subsequent reducing solution to metallic palladium nuclei.
  • the palladium nuclei can then deposit a nickel layer in a conventional chemical nickel deposition step. This is again reinforced with nickel in a second galvanic step. Subsequently, a so-called acidic copper layer can be electrodeposited and finally the component can be galvanically covered with a chromium layer.
  • the printer ink already dissolves during the chemical nickel step and at the latest at the galvanic nickel step. Since there is no metallic base in the surface part covered by the ink and no conductivity is given, the remaining metal layers do not separate there but remain a neatly defined window. Through this window, e.g. the light of an LED indicates the operating state of the switch, e.g. light up when the seat heating is switched on.
  • the component hangs with other type-like components in a stainless steel frame and is then transferred after printing in a PVC-coated electroplated rack. In this, it remains for the remainder of the process up to and including the chrome coating, so that the printing step insignificantly complicates the metallization process.
EP20130179697 2013-08-08 2013-08-08 Procédé de métallisation avec couche de protection Withdrawn EP2835446A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP20130179697 EP2835446A1 (fr) 2013-08-08 2013-08-08 Procédé de métallisation avec couche de protection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20130179697 EP2835446A1 (fr) 2013-08-08 2013-08-08 Procédé de métallisation avec couche de protection

Publications (1)

Publication Number Publication Date
EP2835446A1 true EP2835446A1 (fr) 2015-02-11

Family

ID=48948300

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20130179697 Withdrawn EP2835446A1 (fr) 2013-08-08 2013-08-08 Procédé de métallisation avec couche de protection

Country Status (1)

Country Link
EP (1) EP2835446A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2400720A (en) * 1942-02-20 1946-05-21 Distillers Co Yeast Ltd Treatment of plastic surfaces
CA1007523A (en) * 1972-02-18 1977-03-29 Photocircuits Division Of Kollmorgen Corporation Direct bonding of electroless metals to substrates
US4039714A (en) * 1971-05-28 1977-08-02 Dr. -Ing. Max Schloetter Pretreatment of plastic materials for metal plating
US4594311A (en) * 1984-10-29 1986-06-10 Kollmorgen Technologies Corporation Process for the photoselective metallization on non-conductive plastic base materials
US4666739A (en) * 1984-05-11 1987-05-19 Dr.-Ing. Max Schlotter Gmbh & Co. Kg Process for the production of metal patterns on insulating substrates as well as insulating substrates with metal patterns, especially printed circuits
US5296020A (en) * 1991-04-11 1994-03-22 Bayer Aktiengesellschaft Formulation for the activation of substrate surfaces for currentless metallization thereof
US20080175986A1 (en) * 2007-01-24 2008-07-24 Kenneth Crouse Second surface metallization

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2400720A (en) * 1942-02-20 1946-05-21 Distillers Co Yeast Ltd Treatment of plastic surfaces
US4039714A (en) * 1971-05-28 1977-08-02 Dr. -Ing. Max Schloetter Pretreatment of plastic materials for metal plating
CA1007523A (en) * 1972-02-18 1977-03-29 Photocircuits Division Of Kollmorgen Corporation Direct bonding of electroless metals to substrates
US4666739A (en) * 1984-05-11 1987-05-19 Dr.-Ing. Max Schlotter Gmbh & Co. Kg Process for the production of metal patterns on insulating substrates as well as insulating substrates with metal patterns, especially printed circuits
US4594311A (en) * 1984-10-29 1986-06-10 Kollmorgen Technologies Corporation Process for the photoselective metallization on non-conductive plastic base materials
US5296020A (en) * 1991-04-11 1994-03-22 Bayer Aktiengesellschaft Formulation for the activation of substrate surfaces for currentless metallization thereof
US20080175986A1 (en) * 2007-01-24 2008-07-24 Kenneth Crouse Second surface metallization

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