EP2835446A1 - Metallisation method with protective layer - Google Patents
Metallisation method with protective layer Download PDFInfo
- Publication number
- EP2835446A1 EP2835446A1 EP20130179697 EP13179697A EP2835446A1 EP 2835446 A1 EP2835446 A1 EP 2835446A1 EP 20130179697 EP20130179697 EP 20130179697 EP 13179697 A EP13179697 A EP 13179697A EP 2835446 A1 EP2835446 A1 EP 2835446A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- protective layer
- component
- layer
- plastic
- deposited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011241 protective layer Substances 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000001465 metallisation Methods 0.000 title claims abstract description 14
- 238000010899 nucleation Methods 0.000 claims abstract description 12
- 238000006277 sulfonation reaction Methods 0.000 claims abstract description 8
- 230000006911 nucleation Effects 0.000 claims abstract description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 21
- 239000010410 layer Substances 0.000 claims description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000004033 plastic Substances 0.000 claims description 12
- 229920003023 plastic Polymers 0.000 claims description 12
- 229910052763 palladium Inorganic materials 0.000 claims description 9
- 230000035784 germination Effects 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 238000005234 chemical deposition Methods 0.000 claims description 7
- 239000003365 glass fiber Substances 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 2
- 238000004070 electrodeposition Methods 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- AKEJUJNQAAGONA-UHFFFAOYSA-N sulfur trioxide Chemical compound O=S(=O)=O AKEJUJNQAAGONA-UHFFFAOYSA-N 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- -1 palladium ions Chemical class 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010012239 Delusion Diseases 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 231100000868 delusion Toxicity 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- HIFJUMGIHIZEPX-UHFFFAOYSA-N sulfuric acid;sulfur trioxide Chemical compound O=S(=O)=O.OS(O)(=O)=O HIFJUMGIHIZEPX-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Definitions
- the present invention relates to a method for metallizing a component surface.
- Methods for metallizing component surfaces are used extensively.
- An example to which the present invention is also preferably directed is the metallization of plastic components, in particular vehicle interior components. It may be z. B. act delusions or buttons in a car. Often, a metal surface is desired here for aesthetic reasons or to improve the cleaning properties or for other reasons.
- the invention is based on the object of specifying in such a metallization a simple way to exclude a certain part of the surface of the metallization.
- the surface (usually cleaned) is prepared for nucleation by sulfonation (optionally followed by a rinsing step), e.g. for a known seeding with palladium.
- a protective layer that is non-metallic and non-conductive.
- non-conductive denotes the absence of a metallic conductivity; It is about preventing a subsequent metallization in a preferred subsequent galvanic process.
- a metal layer is then deposited by means of a chemical process, that is, without external current.
- This metal layer may separate selectively, ie not on the protective layer, because there, as I said, there is no or no equivalent germination. Even if it deposits on the protective layer, it can later be removed with the protective layer.
- Typical layer thicknesses are 0.1 to 1 ⁇ m.
- Preferred examples are a chemical nickel layer and thereon e.g. a galvanic nickel layer and possibly a final chrome layer.
- a treatment with palladium ions is preferred, ie in particular no seeding with colloidal palladium.
- protective layer materials dissolve in the chemical metallization step or at the latest in the galvanic metallization step.
- suitable cleaning steps can also be included. It has proven useful to deposit the protective layer using a printing process. Concretely, for example, an inkjet printer can be used become. The printer ink already forms a suitable protective layer.
- the process according to the invention works particularly well on plastic components, preferably on those whose plastic has double bonds. These double bonds are good sites for sulfonation. For sulfonation is treated in gaseous sulfur trioxide, for example with oleum (fuming sulfuric acid).
- a preferred group of materials are the polyaryl plastics.
- Preferred field of application of the invention is the consideration of windows in the component, in particular for visible light, in special cases but also for infrared radiation. Then, e.g. a light signal or a light source for illumination or a sensor functioning with corresponding radiation use the corresponding translucent window.
- the plastic may have a glass fiber portion for mechanical reinforcement and to improve the translucency (wherein translucency basically includes the transparency).
- the glass fiber content is at least 50 percent by weight.
- different material thicknesses are conceivable, from quite thin covered by the metallization and kept free through the window wall sections with a thickness in the tenth of a millimeter range up to a few millimeters.
- a particular advantage lies in the fact that, especially with a glass fiber reinforcement, thick (and therefore stable) materials with thicknesses of more than 2 or even more than 3 mm are possible.
- the plastic component coated in accordance with the invention may in particular also be a two-component injection-molded component in which one of the injection-molding operations has produced a transparent or generally translucent plastic window in a component which is otherwise designed according to criteria other than translucency. In the translucent area then a window according to the invention can be arranged.
- the part of the surface covered by the protective layer can also form an opening in a planar metallization, that is to say an opening in an all-round and in comparison to the one Dimensions of the opening significantly larger area metal layer.
- Such an opening can also serve for aesthetic design or leave a lying below the metal layer material for other reasons.
- the application of the protective layer prior to seeding is also advantageous because the process can thus be carried out particularly simply.
- the parts can be hung on a conventional galvanic rack and remain, so go through the various stages of the process (such as in the claims so numbered steps 3 to 5 and if necessary further) without further changing or remounting.
- another frame is advantageous anyway, which is why a subsequent capping can hardly be avoided here.
- the application of the protective layer according to the invention produces no significant additional expense.
- the invention relates, as explained above, to a manufacturing method, but also to a finished vehicle interior component or another manufactured product, in whose production, inter alia, the inventive method has been applied, with a further processing is not excluded.
- the invention also relates to the use of a sulfonated and partially covered with the protective layer according to claim 1 component for metallizing according to claim 1, that is, by seeding and subsequent chemical deposition.
- the various features and retraction positions should also be disclosed for this purpose.
- a switch or pushbutton for a motor vehicle interior is produced in a two-component injection molding process.
- This component consists of glass fiber reinforced polyaryl plastic with a glass fiber content of 60 percent by weight and a translucent part.
- This component to be coated is first cleaned and then sulfonated in gaseous sulfur trioxide for one minute. Basically, treatment times of between 10 seconds (preferably 20, 30, 40 or 50 seconds) and 10 minutes (preferably 9, 8, 7, 6 or 5 minutes) make sense for the sulfonation.
- the sulfonated surface is first rinsed with water and then printed in the translucent portion with an ink jet printer, the ink jet printer, under the control of a computer, printing a particular symbol corresponding to the button actuated function in the vehicle, e.g. a seat heating symbol.
- the printer ink stops processing and protects the underlying sub-surface from the next steps.
- palladium ions are deposited on the surface and can be reduced in a subsequent reducing solution to metallic palladium nuclei.
- the palladium nuclei can then deposit a nickel layer in a conventional chemical nickel deposition step. This is again reinforced with nickel in a second galvanic step. Subsequently, a so-called acidic copper layer can be electrodeposited and finally the component can be galvanically covered with a chromium layer.
- the printer ink already dissolves during the chemical nickel step and at the latest at the galvanic nickel step. Since there is no metallic base in the surface part covered by the ink and no conductivity is given, the remaining metal layers do not separate there but remain a neatly defined window. Through this window, e.g. the light of an LED indicates the operating state of the switch, e.g. light up when the seat heating is switched on.
- the component hangs with other type-like components in a stainless steel frame and is then transferred after printing in a PVC-coated electroplated rack. In this, it remains for the remainder of the process up to and including the chrome coating, so that the printing step insignificantly complicates the metallization process.
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Die Erfindung betrifft ein Verfahren zum Metallisieren einer Bauteiloberfläche, wobei nach einer Sulfonierung zur Vorbereitung eine Schutzschicht auf einem Teil der Oberfläche abgeschieden und danach auf dem nicht durch die Schutzschicht abgedeckten Teil eine Bekeimung und nachfolgende Metallisierung durchgeführt wird.The invention relates to a method for metallizing a component surface, wherein after a sulfonation for preparation, a protective layer is deposited on a part of the surface and then a nucleation and subsequent metallization is carried out on the part not covered by the protective layer.
Description
Die vorliegende Erfindung betrifft ein Verfahren zum Metallisieren einer Bauteiloberfläche.The present invention relates to a method for metallizing a component surface.
Verfahren zum Metallisieren von Bauteiloberflächen werden umfangreich eingesetzt. Ein Beispiel, auf das sich die vorliegende Erfindung auch vorzugsweise richtet, ist die Metallisierung von Kunststoff-Bauteilen, insbesondere Fahrzeug-innenbauteilen. Dabei kann es sich z. B. um Verblendungen oder Tasten in einem PKW handeln. Oft wird hier aus ästhetischen Gründen oder auch zur Verbesserung der Reinigungseigenschaften oder aus anderen Gründen eine Metalloberfläche gewünscht.Methods for metallizing component surfaces are used extensively. An example to which the present invention is also preferably directed is the metallization of plastic components, in particular vehicle interior components. It may be z. B. act delusions or buttons in a car. Often, a metal surface is desired here for aesthetic reasons or to improve the cleaning properties or for other reasons.
Der Erfindung liegt dabei die Aufgabe zugrunde, bei einem solchen Metallisierungsverfahren eine einfache Möglichkeit anzugeben, einen bestimmten Teil der Oberfläche von der Metallisierung auszunehmen.The invention is based on the object of specifying in such a metallization a simple way to exclude a certain part of the surface of the metallization.
Die Lösung besteht in einem Verfahren mit den folgenden Schritten:
- 1) Sulfonieren der Oberfläche zur Vorbereitung einer Bekeimung,
- 2) Abscheiden einer auf einen Teil der Oberfläche begrenzten nicht metallischen und nicht leitfähigen Schutzschicht,
- 3) Bekeimung der sulfonierten Oberfläche mit einem Metall, insbesondere Palladium, wobei die Bekeimung wegen der Abdeckung durch die Schutzschicht nicht auf dem von der Schutzschicht eingenommenen Teil der Oberfläche erfolgt,
- 4) chemische Abscheidung einer Metallschicht auf der bekeimten Oberfläche, wobei auch die chemische Abscheidung nicht auf dem von der Schutzschicht eingenommenen Teil der Oberfläche erfolgt.
- 1) sulfonating the surface to prepare a germination,
- 2) depositing a non-metallic and non-conductive protective layer bounded on a part of the surface,
- 3) seeding of the sulfonated surface with a metal, in particular palladium, whereby the germination does not take place on the part of the surface occupied by the protective layer because of the covering by the protective layer,
- 4) chemical deposition of a metal layer on the germinated surface, wherein also the chemical deposition does not take place on the part of the surface occupied by the protective layer.
Bei der erfindungsgemäßen Metallisierung wird die (üblicherweise gereinigte) Oberfläche durch eine Sulfonierung (optional gefolgt von einem Spülschritt) für eine Bekeimung vorbereitet, z.B. für eine an sich bekannte Bekeimung mit Palladium. Der freizuhaltende Bereich wird daraufhin mit einer Schutzschicht abgedeckt, die nicht metallisch und nicht leitfähig ist. Dabei bezeichnet "nicht leitfähig" das Nichtvorhandensein einer metallischen Leitfähigkeit; es geht um die Verhinderung einer späteren Metallisierung bei einem bevorzugt nachfolgenden galvanischen Prozess.In the metallization of the present invention, the surface (usually cleaned) is prepared for nucleation by sulfonation (optionally followed by a rinsing step), e.g. for a known seeding with palladium. The area to be kept clear is then covered with a protective layer that is non-metallic and non-conductive. In this case, "non-conductive" denotes the absence of a metallic conductivity; It is about preventing a subsequent metallization in a preferred subsequent galvanic process.
In Folge der Schutzschicht ist ein Teil der Oberfläche für die Bekeimung nicht zugänglich. Zudem wird es in vielen Fällen auch auf der Schutzschicht nicht zu einer Bekeimung, jedenfalls nicht zu einer mit dem Rest der Oberfläche vergleichbaren Bekeimung, kommen, weil die Sulfonierungs-Vorbehandlung fehlt.As a result of the protective layer, part of the surface is not accessible to germination. In addition, in many cases, even on the protective layer, there will be no seeding, at least not germination comparable to the rest of the surface, because the sulphonation pretreatment is lacking.
Nach der Bekeimung wird dann mit einem chemischen, also außenstromlosen, Prozess eine Metallschicht abgeschieden. Diese Metallschicht scheidet sich möglicherweise selektiv ab, also nicht auf der Schutzschicht, weil dort, wie gesagt, keine oder keine gleichwertige Bekeimung vorliegt. Selbst wenn sie sich auf der Schutzschicht abscheidet, so kann sie später mit der Schutzschicht entfernt werden. Typische Schichtdicken betragen 0,1 bis 1 µm.After seeding, a metal layer is then deposited by means of a chemical process, that is, without external current. This metal layer may separate selectively, ie not on the protective layer, because there, as I said, there is no or no equivalent germination. Even if it deposits on the protective layer, it can later be removed with the protective layer. Typical layer thicknesses are 0.1 to 1 μm.
In vielen Fällen wird man die chemisch abgeschiedene Schicht verstärken, vorzugsweise durch eine galvanische Metallisierung von einigen bis einigen Zig µm. Bevorzugte Beispiele sind eine chemische Nickelschicht und darauf z.B. eine galvanische Nickelschicht und möglicherweise eine abschließende Chromschicht.In many cases, one will reinforce the chemically deposited layer, preferably by a galvanic metallization of a few to a few tens of microns. Preferred examples are a chemical nickel layer and thereon e.g. a galvanic nickel layer and possibly a final chrome layer.
Für die Bekeimung ist eine Behandlung mit Palladium-Ionen bevorzugt, also insbesondere keine Bekeimung mit kolloidalem Palladium.For the germination, a treatment with palladium ions is preferred, ie in particular no seeding with colloidal palladium.
In vielen Fällen lösen sich praktisch geeignete Schutzschichtmaterialien bei dem chemischen Metallisierungsschritt oder spätestens bei dem galvanischen Metallisierungsschritt. Es können aber auch geeignete Reinigungsschritte aufgenommen werden. Bewährt hat sich eine Abscheidung der Schutzschicht mit einem Druck-verfahren. Konkret kann z.B. ein Tintenstrahldrucker eingesetzt werden. Die Druckertinte bildet bereits eine geeignete Schutzschicht. Besonders gut funktioniert der erfindungsgemäße Prozess auf Kunststoffbauteilen, und zwar vorzugsweise auf solchen, deren Kunststoff Doppelbindungen aufweist. Diese Doppelbindungen sind gute Anlagerungsplätze für die Sulfonierung. Zur Sulfonierung wird in gasförmigem Schwefeltrioxid behandelt, beispielsweise mit Oleum (rauchender Schwefelsäure). Eine bevorzugte Materialgruppe sind die Polyaryl-Kunststoffe.In many cases, practically suitable protective layer materials dissolve in the chemical metallization step or at the latest in the galvanic metallization step. However, suitable cleaning steps can also be included. It has proven useful to deposit the protective layer using a printing process. Concretely, for example, an inkjet printer can be used become. The printer ink already forms a suitable protective layer. The process according to the invention works particularly well on plastic components, preferably on those whose plastic has double bonds. These double bonds are good sites for sulfonation. For sulfonation is treated in gaseous sulfur trioxide, for example with oleum (fuming sulfuric acid). A preferred group of materials are the polyaryl plastics.
Bevorzugtes Anwendungsgebiet der Erfindung ist die Berücksichtigung von Fenstern in dem Bauteil, insbesondere für sichtbares Licht, in besonderen Fällen aber auch für Infrarot-Strahlung. Dann kann z.B. ein Leuchtsignal oder eine Lichtquelle zur Beleuchtung oder auch ein mit entsprechender Strahlung funktionierender Sensor das entsprechend transluzente Fenster nutzen.Preferred field of application of the invention is the consideration of windows in the component, in particular for visible light, in special cases but also for infrared radiation. Then, e.g. a light signal or a light source for illumination or a sensor functioning with corresponding radiation use the corresponding translucent window.
Hierfür kann der Kunststoff einen Glasfaseranteil zur mechanischen Verstärkung und zur Verbesserung der Transluzenz aufweisen (wobei Transluzenz grundsätzlich die Transparenz beinhaltet). Bevorzugt liegt der Glasfaseranteil bei mindestens 50 Gewichtsprozenten. In dieser Form sind unterschiedliche Materialstärken denkbar, von recht dünnen von der Metallisierung abgedeckten und durch das Fenster freigehaltenen Wandabschnitten mit einer Stärke im Zehntelmillimeterbereich bis zu einigen Millimetern. Ein besonderer Vorteil liegt darin, dass vor allem bei einer Glasfaserverstärkung auch dicke (und damit stabile) Materialien mit Stärken von über 2 oder sogar über 3 mm möglich sind.For this purpose, the plastic may have a glass fiber portion for mechanical reinforcement and to improve the translucency (wherein translucency basically includes the transparency). Preferably, the glass fiber content is at least 50 percent by weight. In this form, different material thicknesses are conceivable, from quite thin covered by the metallization and kept free through the window wall sections with a thickness in the tenth of a millimeter range up to a few millimeters. A particular advantage lies in the fact that, especially with a glass fiber reinforcement, thick (and therefore stable) materials with thicknesses of more than 2 or even more than 3 mm are possible.
Das erfindungsgemäß beschichtete Kunststoffbauteil kann insbesondere auch ein Zweikomponenten-Spritzgussbauteil sein, bei dem mit einem der Spritzgussvorgänge ein transparentes oder allgemeiner transluzentes Kunststofffenster in einem im Übrigen nach anderen Kriterien als der Transluzenz gestalteten Bauteil erzeugt worden ist. In dem transluzenten Bereich kann dann ein erfindungsgemäßes Fenster angeordnet werden.The plastic component coated in accordance with the invention may in particular also be a two-component injection-molded component in which one of the injection-molding operations has produced a transparent or generally translucent plastic window in a component which is otherwise designed according to criteria other than translucency. In the translucent area then a window according to the invention can be arranged.
Auch unabhängig von der Transluzenz kann der von der Schutzschicht abgedeckte Teil der Oberfläche eine Öffnung in einer flächigen Metallisierung bilden, also eine Öffnung in einer rundum geschlossenen und im Vergleich zu den Abmessungen der Öffnung deutlich flächengrößeren Metallschicht. Eine solche Öffnung kann auch zur ästhetischen Gestaltung dienen oder ein unter der Metallschicht liegendes Material aus anderen Gründen frei lassen.Regardless of the translucency, the part of the surface covered by the protective layer can also form an opening in a planar metallization, that is to say an opening in an all-round and in comparison to the one Dimensions of the opening significantly larger area metal layer. Such an opening can also serve for aesthetic design or leave a lying below the metal layer material for other reasons.
Bei dem Herstellungsprozess ist das Aufbringen der Schutzschicht vor der Bekeimung auch deswegen vorteilhaft, weil der Prozess damit besonders einfach ausgeführt werden kann. Insbesondere können die Teile an einem üblichen Galvanikgestell aufgehängt werden und bleiben, also die verschiedenen Prozessstufen (etwa die in den Ansprüchen so bezifferten Schritte 3 bis 5 und bei Bedarf weitere) ohne weiteres Umhängen oder Ummontieren durchlaufen. Für die Sulfonierung ist aber ohnehin ein weiteres Gestell von Vorteil, weswegen hier ein nachfolgendes Umhängen kaum vermieden werden kann. Insoweit erzeugt die erfindungsgemäße Aufbringung der Schutzschicht keinen wesentlichen Mehraufwand.In the manufacturing process, the application of the protective layer prior to seeding is also advantageous because the process can thus be carried out particularly simply. In particular, the parts can be hung on a conventional galvanic rack and remain, so go through the various stages of the process (such as in the claims so numbered steps 3 to 5 and if necessary further) without further changing or remounting. For the sulfonation, however, another frame is advantageous anyway, which is why a subsequent capping can hardly be avoided here. In that regard, the application of the protective layer according to the invention produces no significant additional expense.
Die Erfindung bezieht sich, wie vorstehend erläutert, auf ein Herstellungsverfahren, aber auch auf ein fertiges Fahrzeuginnenbauteil oder ein anderes hergestelltes Erzeugnis, bei dessen Herstellung unter anderem das erfindungsgemäße Verfahren angewendet wurde, wobei eine weitere Verarbeitung nicht ausgeschlossen ist. Die Erfindung bezieht sich auch auf die Verwendung eines sulfonierten und mit der Schutzschicht gemäß Anspruch 1 teilweise bedeckten Bauteils zum Metallisieren gemäß Anspruch 1, das heißt durch Bekeimung und nachfolgende chemische Abscheidung. Die verschiedenen Merkmale und Rückzugspositionen sollen auch hierfür offenbart sein.The invention relates, as explained above, to a manufacturing method, but also to a finished vehicle interior component or another manufactured product, in whose production, inter alia, the inventive method has been applied, with a further processing is not excluded. The invention also relates to the use of a sulfonated and partially covered with the protective layer according to claim 1 component for metallizing according to claim 1, that is, by seeding and subsequent chemical deposition. The various features and retraction positions should also be disclosed for this purpose.
Im Folgenden wird die Erfindung anhand eines Ausführungsbeispiels näher erläutert.In the following the invention will be explained in more detail with reference to an embodiment.
In an sich bekannter Weise wird in einem Zweikomponenten-Spritzgussverfahren ein Schalter oder Taster für einen KFZ-Innenraum hergestellt. Dieses Bauteil besteht aus glasfaserverstärktem Polyaryl-Kunststoff mit einem Glasfaseranteil von 60 Gewichtsprozent und einem transluzenten Teil.In a manner known per se, a switch or pushbutton for a motor vehicle interior is produced in a two-component injection molding process. This component consists of glass fiber reinforced polyaryl plastic with a glass fiber content of 60 percent by weight and a translucent part.
Dieses zu beschichtende Bauteil wird zunächst gereinigt und dann in gasförmigem Schwefeltrioxid für eine Minute sulfoniert. Grundsätzlich sind für die Sulfonierung Behandlungszeiten zwischen 10 Sekunden (vorzugsweise 20, 30, 40 oder 50 Sekunden) und 10 Minuten (vorzugsweise 9, 8, 7, 6 bzw. 5 Minuten) sinnvoll.This component to be coated is first cleaned and then sulfonated in gaseous sulfur trioxide for one minute. Basically, treatment times of between 10 seconds (preferably 20, 30, 40 or 50 seconds) and 10 minutes (preferably 9, 8, 7, 6 or 5 minutes) make sense for the sulfonation.
Die sulfonierte Oberfläche wird zunächst mit Wasser gespült, und dann in dem transluzenten Teil mit einem Tintenstrahldrucker bedruckt, wobei der Tintenstrahldrucker durch einen Computer gesteuert ein bestimmtes Symbol druckt, das der durch den Taster zu betätigenden Funktion in dem KFZ entspricht, z.B. einem Sitzheizungssymbol. Die Druckertinte wird nicht weiter behandelt und schützt die darunter liegende Teiloberfläche vor den nächsten Schritten.The sulfonated surface is first rinsed with water and then printed in the translucent portion with an ink jet printer, the ink jet printer, under the control of a computer, printing a particular symbol corresponding to the button actuated function in the vehicle, e.g. a seat heating symbol. The printer ink stops processing and protects the underlying sub-surface from the next steps.
Danach erfolgt eine Bekeimung in einer ionogenen Palladiumlösung. Dabei lagern sich an der Oberfläche Palladiumionen an und können in einer nachfolgenden reduzierenden Lösung zu metallischen Palladiumkeimen reduziert werden.This is followed by seeding in an ionic palladium solution. In this case, palladium ions are deposited on the surface and can be reduced in a subsequent reducing solution to metallic palladium nuclei.
An die Palladiumkeime kann sich dann in einem üblichen chemischen Nickelabscheidungsschritt eine Nickelschicht anlagern. Diese wird in einem zweiten galvanischen Schritt wiederum mit Nickel verstärkt. Anschließend kann eine sogenannte saure Kupferschicht galvanisch abgeschieden und das Bauteil schließlich mit einer Chromschicht galvanisch abgedeckt werden.The palladium nuclei can then deposit a nickel layer in a conventional chemical nickel deposition step. This is again reinforced with nickel in a second galvanic step. Subsequently, a so-called acidic copper layer can be electrodeposited and finally the component can be galvanically covered with a chromium layer.
Erfahrungsgemäß löst sich die Druckertinte bereits während des chemischen Nickelschritts und spätestens beim galvanischen Nickelschritt. Da in dem von der Tinte abgedeckten Oberflächenteil keine metallische Grundlage vorliegt und keine Leitfähigkeit gegeben ist, scheiden sich die übrigen Metallschichten dort nicht ab sondern bleibt ein sauber definiertes Fenster bestehen. Durch dieses Fenster kann z.B. das Licht einer LED den Betätigungszustand des Schalters anzeigen, also z.B. bei eingeschalteter Sitzheizung leuchten.Experience has shown that the printer ink already dissolves during the chemical nickel step and at the latest at the galvanic nickel step. Since there is no metallic base in the surface part covered by the ink and no conductivity is given, the remaining metal layers do not separate there but remain a neatly defined window. Through this window, e.g. the light of an LED indicates the operating state of the switch, e.g. light up when the seat heating is switched on.
Im Prinzip wäre in gleicher Form aber auch ein im sichtbaren oder Infrarot-Bereich arbeitender Sensor hinter dem Fenster denkbar oder sogar die Durchsicht auf eine komplexere Anzeige als ein einfaches Leuchtsymbol.In principle, however, a sensor operating in the visible or infrared range behind the window would also be conceivable in the same form, or even viewing a more complex display as a simple luminous symbol.
Während des Sulfonierungsschritts hängt das Bauteil mit anderen typgleichen Bauteilen in einem Edelstahlgestell und wird nach dem Bedrucken dann in ein PVC-beschichtetes Galvanikgestell umgehängt. In diesem verbleibt es für den restlichen Prozess bis einschließlich zur Chrombeschichtung, sodass der Druckschritt den Metallisierungsprozess unwesentlich verkompliziert.During the sulfonation step, the component hangs with other type-like components in a stainless steel frame and is then transferred after printing in a PVC-coated electroplated rack. In this, it remains for the remainder of the process up to and including the chrome coating, so that the printing step insignificantly complicates the metallization process.
Claims (15)
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US2400720A (en) * | 1942-02-20 | 1946-05-21 | Distillers Co Yeast Ltd | Treatment of plastic surfaces |
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US4594311A (en) * | 1984-10-29 | 1986-06-10 | Kollmorgen Technologies Corporation | Process for the photoselective metallization on non-conductive plastic base materials |
US4666739A (en) * | 1984-05-11 | 1987-05-19 | Dr.-Ing. Max Schlotter Gmbh & Co. Kg | Process for the production of metal patterns on insulating substrates as well as insulating substrates with metal patterns, especially printed circuits |
US5296020A (en) * | 1991-04-11 | 1994-03-22 | Bayer Aktiengesellschaft | Formulation for the activation of substrate surfaces for currentless metallization thereof |
US20080175986A1 (en) * | 2007-01-24 | 2008-07-24 | Kenneth Crouse | Second surface metallization |
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US2400720A (en) * | 1942-02-20 | 1946-05-21 | Distillers Co Yeast Ltd | Treatment of plastic surfaces |
US4039714A (en) * | 1971-05-28 | 1977-08-02 | Dr. -Ing. Max Schloetter | Pretreatment of plastic materials for metal plating |
CA1007523A (en) * | 1972-02-18 | 1977-03-29 | Photocircuits Division Of Kollmorgen Corporation | Direct bonding of electroless metals to substrates |
US4666739A (en) * | 1984-05-11 | 1987-05-19 | Dr.-Ing. Max Schlotter Gmbh & Co. Kg | Process for the production of metal patterns on insulating substrates as well as insulating substrates with metal patterns, especially printed circuits |
US4594311A (en) * | 1984-10-29 | 1986-06-10 | Kollmorgen Technologies Corporation | Process for the photoselective metallization on non-conductive plastic base materials |
US5296020A (en) * | 1991-04-11 | 1994-03-22 | Bayer Aktiengesellschaft | Formulation for the activation of substrate surfaces for currentless metallization thereof |
US20080175986A1 (en) * | 2007-01-24 | 2008-07-24 | Kenneth Crouse | Second surface metallization |
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