EP0499237B1 - Elektret Kondensator Mikrofon und Verfahren zu dessen Herstellung - Google Patents

Elektret Kondensator Mikrofon und Verfahren zu dessen Herstellung Download PDF

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Publication number
EP0499237B1
EP0499237B1 EP19920102344 EP92102344A EP0499237B1 EP 0499237 B1 EP0499237 B1 EP 0499237B1 EP 19920102344 EP19920102344 EP 19920102344 EP 92102344 A EP92102344 A EP 92102344A EP 0499237 B1 EP0499237 B1 EP 0499237B1
Authority
EP
European Patent Office
Prior art keywords
diaphragm
metal gate
ring
gate ring
capacitor microphone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP19920102344
Other languages
English (en)
French (fr)
Other versions
EP0499237A3 (en
EP0499237A2 (de
Inventor
Hiroyuki Baba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of EP0499237A2 publication Critical patent/EP0499237A2/de
Publication of EP0499237A3 publication Critical patent/EP0499237A3/en
Application granted granted Critical
Publication of EP0499237B1 publication Critical patent/EP0499237B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones

Definitions

  • the present invention relates to an electret capacitor microphone (hereinafter referred to as an "ECM”) and, particularly, to an ECM capable of being assembled by an automatic assembly machine.
  • ECM electret capacitor microphone
  • a conventional ECM has a bottomed cylindrical metal casing, and a bottomed cylindrical insulator telescoped into the metal casing.
  • a diaphragm (electret member), having a metallized foil on one surface thereof, and a backplate are disposed between a bottom of the metal casing and an opening end of the insulator with a predetermined gap between the diaphragm and the backplate.
  • a printed circuit board is mounted on an exposed bottom surface of the cylindrical insulator.
  • a field effect transistor (FET) for impedance conversion is disposed in a space within the cylindrical insulator. The FET has an input lead and an output lead, which are respectively connected to the backplate and an electrode on the printed circuit board.
  • the backplate, the insulator, the FET and the printed circuit board are pre-assembled together into an amplifier block.
  • the diaphragm is disposed inside the metal casing.
  • the amplifier block is inserted into the metal casing, and a portion at the opening end of the metal casing is caulked, thereby completing the assembly.
  • the construction of the conventional ECM is complicated throughout the apparatus, in particular, in the amplifier block.
  • the amplifier block requires to be pre-assembled.
  • the conventional ECM has a problem in that the apparatus is not suitable for assembly by an automatic assembly machine.
  • the conventional ECM also has the following drawback.
  • the various component parts of the ECM are fixed in place by caulking a portion of the cylindrical metal casing, and the component parts include an insulator which is generally molded from a resin.
  • the use of a resin product is disadvantageous in terms of thermal resistance. For instance, where the output lead of the FET is connected to another printed circuit board by a solder dip or the like, the resin insulator may be collapsed or melted due to heat generated during the solder dipping. This involves the risk of the caulked portion becoming loose, resulting in the product quality being deteriorated.
  • the present invention has an object to eliminate the above-described disadvantages.
  • the present invention is particularly directed to providing an ECM which can be assembled by an automatic assembly machine.
  • an ECM includes a bottomed cylindrical metal casing 1 having a sound hole 1a formed in a bottom thereof, a diaphragm clamping metal ring 2 disposed on an inner side of the bottom of the metal casing 1, a diaphragm 3 (serving as an electret member) having a metallized foil 3a on one surface thereof attached to the metal ring 2 by an adhesive or other suitable means, a gap spacer 4 and a backplate 5 having a through-hole 5a located on the other surface of the diaphragm 3 through the gap spacer 4.
  • An air layer 10 is defined between the backplate 5 and the diaphragm 3.
  • the ECM further includes a cylindrical metal gate ring 12 supporting the backplate 5.
  • the metal gate ring 12 is electrically connected with the backplate 5 by contacting or welding to it.
  • a plurality of recesses 12a are formed at an end portion of the metal gate ring 12.
  • the metal gate ring 12 can be easily formed by, for example, rounding stamped flat sheet, as shown in Fig. 3.
  • An insulator 11 is disposed to insulate the backplate 5 and the metal gate ring 12 from the surroundings as well as to house therein these members so as to place them in appropriate positions. The insulator 11 is held in place by, for example, press-fitting it onto the backplate 5 or the metal gate ring 12.
  • An FET 7 for impedance conversion is directly mounted on a printed circuit board 8 and positioned within the metal gate ring 12.
  • An input lead 7a of the FET 7 is interposed between the recess 12a of the metal gate ring 12 and a surface of the printed circuit board 8 so as to allow electrical conduction through these members, and hence to be electrically connected with the backplate 5.
  • An output lead 7b of the FET 7 is electrically connected with an electrode on the printed circuit board 8 by a solder 8a provided by dipping.
  • the component parts of the ECM, described above, are integrally fixed in place by caulking an opening end portion of the cylindrical metal casing 1, as indicated by reference numeral lb.
  • a cloth 9 covers the sound hole 1a to prevent penetration of dust. Without the cloth 9, however, there would be no particular hindrance to the operation of the ECM.
  • an amplifier block is prepared in advance, which consists of a first and a second assembly sub-blocks 21 and 22.
  • the first sub-block 21 comprises the backplate 5, the metal gate ring 12 and the insulator 11.
  • the second assembly sub-block 20 comprises the FET 7 and the printed circuit board 8.
  • the metal ring 2 to which the diaphragm 3 is partially fixed, the gap spacer 4, the first assembly sub-block 21, and the second assembly sub-block 20 are successively inserted. Thereafter, an end portion 1b of the cylindrical metal casing 1 is caulked, thereby completing the assembly.
  • the air layer 10 has a capacitance of about several pF to 10s pF. Sound waves from the outside of the ECM pass through the sound hole 1a, and cause the diaphragm 3 to vibrate, thereby causing slight changes in the above capacitance. The changes in the capacitance are transformed by means of the FET 7 to changes in an electrical output.
  • This embodiment has an excellent advantage in that the entire apparatus can be assembled by an automatic assembly machine, the advantage being helped by the very simple constructions of the individual assembly sub-blocks 20 and 21.
  • Another advantage is that, even when the application of heat during solder dipping or the like has caused the insulator 11 to partially melt, this does not cause any adverse influence on the settling portion or the caulked end portion 1b, hence, no adverse influence on the settling of the components of the apparatus, thereby making it possible to avoid deterioration in the product quality, such as loose settling of the components.
  • the conventional ECM (shown in Fig. 8) is assembled in the manner shown in Fig. 9.
  • a backplate 5, an insulator 6, an FET 7 and a printed circuit board 8 are previously assembled together into an amplifier block.
  • a metal ring 2 to which a diaphragm 3 is attached, a gap spacer 4, and the amplifier block are successively inserted into a cylindrical metal casing 1 with a cloth 9 attached thereto.
  • an end portion 1b of the cylindrical metal casing 1 is caulked, thereby assembling the components into an integral construction.
  • the amplifier block is complicated, and further required to be pre-assembled.
  • the construction of the conventional ECM is not suitable for performing a fully automatized assembly operation.
  • a metal gate ring 13 is, as shown in Fig. 6, an annular metal gate ring having no recess.
  • the second embodiment further includes a dual-lead type FET 14 and a printed circuit board 15 having patterns on both surfaces thereof.
  • an input lead 14a of the FET 14 is connected with an inner printed circuit pattern 15c by soldering or the like, and connected with the metal gate ring 13 via the inner printed circuit pattern 15c.
  • An output lead 14b of the FET 14 is connected with another inner printed circuit pattern 15d by soldering, and connected with an outer printed circuit pattern 15e via the inner printed circuit pattern 15d, a through hole 15b and a soldered portion 15a.
  • the soldered portion 15a also serves to close the through hole 15b.
  • the FET 14 is fixed to the printed circuit board 15 by an adhesive 16.
  • the adhesive 16 may be also used to close the through hole 15b, instead of the soldered portion 15a.
  • assembly can be performed in a manner similar to that in the first embodiment, and operation and advantages similar to those of the first embodiment are provided.
  • a third embodiment of the present invention is distinguished in that a metal pin lead 17 with a flange passes through a through hole 15b of a printed circuit board 15.
  • the metal pin lead 17 is connected with an outer printed circuit pattern 15e via a soldered portion 15a.
  • the third embodiment constitutes an ECM known as a legged type ECM.
  • the apparatus according to the third embodiment also enables assembly similar to those in the first and the second embodiments, and provides similar operation and advantages.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Telephone Set Structure (AREA)

Claims (7)

  1. Elektretkodensatormikrofon, umfassend:
    ein mit einem Boden versehenes zylindrisches Metallgehäuse (1), in dessen Boden ein Schalloch (1a) ausgebildet ist;
    ein Diaphragma (3), das an einer Oberfläche eine metallisierte Folie (3a) aufweist, welche metallisierte Folie auf eine innere Oberfläche des Bodens zu weist, wobei ein Diaphragmaklemmring (2) zwischen dem Diaphragma und dem Boden angeordnet ist;
    einen Montageblock, der eine Rückwandplatte (5), in der ein Loch (5a) ausgebildet ist, einen zylindrischen Metalltorring (12), der elektrisch mit der Rückwandplatte (5) verbunden ist, und einen Isolator (11), der den Metalltorring umgibt, enthält; und
    eine gedruckte Schaltung (8), auf der ein FET (7) angebracht ist.
  2. Elektretkondensatormikrofon nach Anspruch 1, bei welchem der FET (7) eine Eingangszuleitung (7a) aufweist und der Metalltorring (12) eine an einem seiner Enden ausgebildete Ausnehmung (12a) hat, wobei die Eingangszuleitung (7a) zwischen der Ausnehmung und der gedruckten Schaltung (8) angeordnet ist.
  3. Elektretkondensatormikrofon nach Anspruch 1 oder 2, bei welchem der Metalltorring (12) ein Metalltorring ist, der durch Runden eines einzelnen gestanzten flachen Bleches geformt ist.
  4. Elektretkondensatormikrofon, umfassend:
    ein mit einem Boden versehenes zylindrisches Metallgehäuse (1), in dessen Boden ein Schalloch (1a) ausgebildet ist; einen metallenen Diaphragmaklemmring (2); ein Diaphragma, das an einer Oberfläche eine metallisierte Folie (3a) aufweist; einen Spalt-Abstandshalter (4); einen Montageblock, der eine Rückwandplatte (5), in der ein Loch ausgebildet ist, einen leitenden Metalltorring (12) und einen Isolator (11), der den Metalltorring umgibt, enthält; und eine gedruckte Schaltung (8), auf der ein FET (7) angebracht ist, wobei der Metallring, das Diaphragma, der Spalt-Abstandshalter, der Montageblock und die gedruckte Schaltung aufeinanderfolgend in das Metallgehäuse eingeführt werden, und wobei das Elektretkondensatormikrofon ferner einen Abschnitt am Öffnungsende des Metallgehäuses umfasst, der nach dem Einführen abgedichtet wird.
  5. Elektretkondensatormikrofon nach Anspruch 4, bei welchem der FET (7) eine Eingangszuleitung aufweist und der Metalltorring eine an einem seiner Enden ausgebildete Ausnehmung (12a) hat, wobei die Eingangszuleitung (7a) zwischen der Ausnehmung und der gedruckten Schaltung (8) angeordnet ist.
  6. Elektretkondensatormikrofon nach Anspruch 4 oder 5, bei welchem der Metalltorring (12) ein Metalltorring ist, der durch Runden eines einzelnen gestanzten flachen Bleches geformt ist.
  7. Verfahren zur Montage eines Elektretkondensatormikrofons, welches Verfahren die folgenden Schritte umfasst:
    Einführen eines Diaphragmaklemmrings (2) in ein mit einem Boden versehenes zylindrisches Metallgehäuse (1), das ein in seinem Boden ausgebildetes Schalloch (1a) aufweist;
    Anordnen eines Diaphragmas (3), auf dem eine metallisierte Folie (3a) vorgesehen ist, auf dem Diaphragmaklemmring;
    Einführen eines Montageblocks und eines Spalt-Abstandshalters (4) in das Metallgehäuse in der Weise, daß der Spalt-Abstandshalter zwischen dem Diaphragma und dem Montageblock angeordnet ist, welcher Montageblock eine Rückwandplatte (5), die ein darin ausgebildetes Loch (5a) aufweist, einen leitenden Metalltorring (12), der elektrisch mit der Rückwandplatte verbunden ist, und einen den Torring umgebenden Isolator (11) enthält;
    Anordnen einer gedruckten Schaltung, auf welcher ein FET (7) angebracht ist, auf dem Montageblock; und
    Abdichten eines Öffnungsendabschnitts des Metallgehäuses, um so das Elektretkondensatormikrofon zu integrieren.
EP19920102344 1991-02-12 1992-02-12 Elektret Kondensator Mikrofon und Verfahren zu dessen Herstellung Expired - Lifetime EP0499237B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1860791A JPH04257200A (ja) 1991-02-12 1991-02-12 エレクトレットコンデンサマイクロホン
JP18607/91 1991-02-12

Publications (3)

Publication Number Publication Date
EP0499237A2 EP0499237A2 (de) 1992-08-19
EP0499237A3 EP0499237A3 (en) 1993-10-20
EP0499237B1 true EP0499237B1 (de) 1995-05-10

Family

ID=11976331

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19920102344 Expired - Lifetime EP0499237B1 (de) 1991-02-12 1992-02-12 Elektret Kondensator Mikrofon und Verfahren zu dessen Herstellung

Country Status (4)

Country Link
EP (1) EP0499237B1 (de)
JP (1) JPH04257200A (de)
CA (1) CA2060542C (de)
DE (1) DE69202352T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG142141A1 (en) * 2003-11-05 2008-05-28 Bse Co Ltd Method of mounting condenser microphone on main pcb and condenser microphone adapted for the same

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1002880C2 (nl) * 1996-04-16 1997-10-17 Microtronic Nederland Bv Elektroakoestische transducent.
US6549632B1 (en) * 1996-11-08 2003-04-15 Kabushiki Kaisha Audio-Technica Microphone
JP2002223498A (ja) * 2000-11-21 2002-08-09 Matsushita Electric Ind Co Ltd エレクトレットコンデンサマイクロホン
KR100349200B1 (ko) * 2000-12-12 2002-08-21 주식회사 씨에스티 초박형 콘덴서 마이크로폰 조립체 및 그 조립방법
JP4145505B2 (ja) 2001-05-10 2008-09-03 松下電器産業株式会社 エレクトレットコンデンサマイクロホン及びその製造方法
US7065224B2 (en) * 2001-09-28 2006-06-20 Sonionmicrotronic Nederland B.V. Microphone for a hearing aid or listening device with improved internal damping and foreign material protection
US7239714B2 (en) * 2001-10-09 2007-07-03 Sonion Nederland B.V. Microphone having a flexible printed circuit board for mounting components
CA2464589C (en) 2001-10-23 2008-07-08 David W. Schindel Ultrasonic printed circuit board transducer
JP3908059B2 (ja) * 2002-02-27 2007-04-25 スター精密株式会社 エレクトレットコンデンサマイクロホン
KR100549189B1 (ko) * 2003-07-29 2006-02-10 주식회사 비에스이 Ｓｍｄ가능한 일렉트렛 콘덴서 마이크로폰
KR200330089Y1 (ko) * 2003-07-29 2003-10-11 주식회사 비에스이 통합 베이스 및 이를 이용한 일렉트릿 콘덴서마이크로폰
US7415121B2 (en) * 2004-10-29 2008-08-19 Sonion Nederland B.V. Microphone with internal damping
KR100675505B1 (ko) 2005-04-29 2007-01-30 주식회사 비에스이 콘덴서 마이크로폰의 케이스
JP4809912B2 (ja) * 2009-07-03 2011-11-09 ホシデン株式会社 コンデンサマイクロホン
CN109640241A (zh) * 2019-01-21 2019-04-16 深圳市广慧宏科技有限公司 一种驻极体传声器全自动组装系统

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE440581B (sv) * 1983-12-22 1985-08-05 Ericsson Telefon Ab L M Forfarande for framstellning av elektroakustiska omvandlare med slutet resonansrum, foretredesvis mikrofoner, samt elektroakustisk omvandlare framstelld enligt forfarandet
JPS627300A (ja) * 1985-07-03 1987-01-14 Matsushita Electric Ind Co Ltd エレクトレツトコンデンサマイクロホン
JPH02149199A (ja) * 1988-11-30 1990-06-07 Matsushita Electric Ind Co Ltd エレクトレットコンデンサマイクロホン

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG142141A1 (en) * 2003-11-05 2008-05-28 Bse Co Ltd Method of mounting condenser microphone on main pcb and condenser microphone adapted for the same

Also Published As

Publication number Publication date
EP0499237A3 (en) 1993-10-20
DE69202352D1 (de) 1995-06-14
DE69202352T2 (de) 1996-01-18
CA2060542A1 (en) 1992-08-13
CA2060542C (en) 1998-12-01
EP0499237A2 (de) 1992-08-19
JPH04257200A (ja) 1992-09-11

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