EP0471138B1 - Verfahren zur Herstellung eines elektrischen Messwiderstandes - Google Patents
Verfahren zur Herstellung eines elektrischen Messwiderstandes Download PDFInfo
- Publication number
- EP0471138B1 EP0471138B1 EP91102300A EP91102300A EP0471138B1 EP 0471138 B1 EP0471138 B1 EP 0471138B1 EP 91102300 A EP91102300 A EP 91102300A EP 91102300 A EP91102300 A EP 91102300A EP 0471138 B1 EP0471138 B1 EP 0471138B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- rhodium
- platinum
- range
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 24
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 52
- 229910052703 rhodium Inorganic materials 0.000 claims abstract description 27
- 239000010948 rhodium Substances 0.000 claims abstract description 27
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 26
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000002360 preparation method Methods 0.000 claims abstract description 10
- 238000007650 screen-printing Methods 0.000 claims abstract description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000919 ceramic Substances 0.000 claims abstract description 4
- 238000001035 drying Methods 0.000 claims abstract 2
- 239000010409 thin film Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052681 coesite Inorganic materials 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 229910052593 corundum Inorganic materials 0.000 claims description 2
- 229910052906 cristobalite Inorganic materials 0.000 claims description 2
- 239000012777 electrically insulating material Substances 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- 238000005259 measurement Methods 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 229910052682 stishovite Inorganic materials 0.000 claims description 2
- 229910052905 tridymite Inorganic materials 0.000 claims description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 2
- 239000002241 glass-ceramic Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000008020 evaporation Effects 0.000 claims 1
- 239000001023 inorganic pigment Substances 0.000 claims 1
- 238000007669 thermal treatment Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 229910001260 Pt alloy Inorganic materials 0.000 description 6
- 239000010408 film Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- -1 Platinum Metals Chemical class 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- YWFDDXXMOPZFFM-UHFFFAOYSA-H rhodium(3+);trisulfate Chemical compound [Rh+3].[Rh+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O YWFDDXXMOPZFFM-UHFFFAOYSA-H 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- ZCUFMDLYAMJYST-UHFFFAOYSA-N thorium dioxide Chemical compound O=[Th]=O ZCUFMDLYAMJYST-UHFFFAOYSA-N 0.000 description 1
- 229910003452 thorium oxide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/022—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/232—Adjusting the temperature coefficient; Adjusting value of resistance by adjusting temperature coefficient of resistance
Definitions
- the invention relates to a method for producing an electrical measuring resistor with a predetermined temperature coefficient for a resistance thermometer, which has a platinum-containing thin film on a carrier as a resistance layer, the surface of the carrier carrying the resistance layer being made of electrically insulating material.
- US Pat. No. 4,375,056 discloses a thin-film resistance thermometer with a predetermined temperature coefficient of resistance, in which a thin electrically conductive metal film is applied to an electrically insulating substrate, the thickness of the metal film being in the range from 0.05 and 0.8 ⁇ m lies; in the area of this small layer thickness it is possible to achieve a lower temperature coefficient than with solid material.
- the ratio of the relative change in the temperature coefficient to the relative change in the layer thickness is greater than 0.01.
- a platinum film is preferably used as the thin-layer material.
- a method for producing such a measuring resistor is described in US Pat. No. 4,469,717.
- a method for producing an electrical measuring resistor for a resistance thermometer which on a carrier made of ceramic material a platinum thin film produced by atomization in a thickness of 0.1 to 10 ⁇ m carries, which has a predetermined temperature coefficient; the average coefficient of thermal expansion of the ceramic substrate differs from that of the thermometer board by less than +/- 30%.
- Aluminum oxide, beryllium oxide, thorium oxide, magnesium oxide or a magnesium silicate are used as the substrate, the substrate after heat treatment containing less than 20 ppm of metals which are in a form which is reactive with platinum.
- the desired electrical temperature coefficient of the resistance depending on the application, for example in the range from 1600 to 3860 ppm / K, because when the resistance layer is evaporated due to different vapor pressures of the materials to be applied the desired alloy cannot be set with sufficient certainty, or in the case of cathode sputtering the target material has to be prepared beforehand in the desired alloy;
- the setting of a desired temperature coefficient of the electrical resistance via the variation of the layer thickness leads to a change in the width or length of the resistance path due to the associated change in the conductor cross section of the resistance path for the purpose of adaptation to the predetermined nominal resistance of the measuring resistor, which results in a change in the Structure of the resistance track results.
- the object of the invention is to provide a method by which a platinum thin-film resistance layer of a given layer thickness is treated by doping with foreign atoms in such a way that a desired electrical temperature coefficient can be set in the range from 1600 ppm / k to 3860 ppm / k.
- aluminum oxide is used as the carrier;
- a support made of a steel substrate which has an electrically insulating intermediate layer on the surface provided for the application of the platinum thin film, which consists of SiO2, BaO, Al2O3 and an inorganic, cobalt-containing dye compound, such as it is described for example in DE-PS 34 26 804.
- the platinum thin film is applied to the carrier by means of electron beam evaporation.
- the preparation to be applied by the screen printing process preferably has a rhodium content in the range from 0.1 to 12% by weight, based on the content of platinum and rhodium in the preparation.
- the measuring resistor produced by the method has a thickness in the range from 0.85 to 1.3 ⁇ m.
- a platinum thin film 2 is applied over the entire surface of the substrate 1 consisting of aluminum oxide in the electron beam process or sputtering process.
- a preparation is carried out according to FIG. 1b from a solution of platinum resinate and synthetic resin in organic solvents (12.5% Pt) and from a solution of rhodium sulphate resinate in organic solvents (5% Rh) using the screen printing process; the solutions mentioned are available, for example, under the names RP 10001 / 145B and MR 4511-L from WC Heraeus GmbH, Hanau.
- the screen printing layer 3 After the screen printing layer 3 has been applied, it is dried at a temperature in the range from 80 to 120 ° C.
- the rhodium content of layer 3 is in the range from 0.1% to 12%, based on the content of platinum and rhodium.
- the substrate 1, together with its two layers 2, 3, is subjected to a heat treatment under atmospheric conditions in an oven at a temperature in the range from 1000 to 1400 ° C. until the rhodium in the resistance layer 2 ′ which forms is evenly distributed, with at least a partial exchange of the platinum atoms from layer 3 with platinum atoms of layer 2 also taking place.
- the resistance layer 2 ' is structured, for example, by sputter etching in the form of a meander.
- the resistance layer 2 ' is in a meandering shape on the substrate 1, contact fields 4, 5 being provided for external connections at the ends of the resistance strip.
- the contact fields 4 and 5 are applied by the same method as the resistance layer 2 '.
- FIG. 3 shows the dependency of the temperature coefficient of the resistance TCR on the rhodium content in the platinum alloy, the rhodium content being stated in% by weight of the platinum alloy. It is thus possible, according to FIG. 3, to precisely adjust the temperature coefficient in the range from 1600 to 3850 ppm / K for measuring resistors based on platinum alloys by varying the rhodium content of the resistance layer; only the rhodium content of the platinum alloy is varied without changing the layer thickness, so that, for example, with a constant layer thickness of 1.1 ⁇ m and a rhodium content of 0.01%, a temperature coefficient of 3850 ppm / K (point A) is achieved; If the proportion of rhodium increases to 0.04% with the same layer thickness, a temperature coefficient of 3830 ppm / K (point B) is achieved.
- a further increase in the rhodium content to 0.16% reduces the temperature coefficient to 3750 ppm / K (point C). With a further increase in the proportion of rhodium to, for example, 10%, a temperature coefficient of 1600 ppm / K (point D) can be achieved.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Thermistors And Varistors (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4026061 | 1990-08-17 | ||
DE4026061A DE4026061C1 (enrdf_load_stackoverflow) | 1990-08-17 | 1990-08-17 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0471138A2 EP0471138A2 (de) | 1992-02-19 |
EP0471138A3 EP0471138A3 (en) | 1992-06-17 |
EP0471138B1 true EP0471138B1 (de) | 1994-12-14 |
Family
ID=6412421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP91102300A Expired - Lifetime EP0471138B1 (de) | 1990-08-17 | 1991-02-19 | Verfahren zur Herstellung eines elektrischen Messwiderstandes |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0471138B1 (enrdf_load_stackoverflow) |
AT (1) | ATE115761T1 (enrdf_load_stackoverflow) |
DE (2) | DE4026061C1 (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19542516C1 (de) * | 1995-11-15 | 1997-04-17 | Heraeus Sensor Gmbh | Temperatur-Sensor |
US5831512A (en) * | 1995-10-30 | 1998-11-03 | Heraeus Sensor-Nite Gmbh | Resistance thermometer |
US6316752B1 (en) | 1997-10-03 | 2001-11-13 | Schaffler & Co., Gesellschaft Mbh | Heating element with screen-printed Au-Pd resinate layer and Ag-Pd contact areas with solder resistant dams |
DE102007046900A1 (de) | 2007-09-28 | 2009-04-30 | Heraeus Sensor Technology Gmbh | 1200°C-Schichtwiderstand |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4300084C2 (de) * | 1993-01-06 | 1995-07-27 | Heraeus Sensor Gmbh | Widerstandsthermometer mit einem Meßwiderstand |
DE4330447C2 (de) * | 1993-09-09 | 1996-09-19 | Heraeus Sensor Gmbh | Temperatur-Sensor mit einem Meßwiderstand in einem Metallmantel |
JP3175890B2 (ja) * | 1993-12-27 | 2001-06-11 | 日本碍子株式会社 | 温度センサ |
EP0973020B1 (de) | 1998-07-16 | 2009-06-03 | EPIQ Sensor-Nite N.V. | Elektrischer Temperatur-Sensor mit Mehrfachschicht |
SK284764B6 (sk) * | 1999-01-18 | 2005-11-03 | Slovenská Technická Univerzita, Materiálovotechnologická | Spôsob tepelného spracovania platinových drôtov na zabezpečenie stabilizácie elektrického odporu |
DE19945641A1 (de) * | 1999-09-23 | 2001-04-05 | Abb Research Ltd | Strombegrenzendes Widerstandselement |
CN100359306C (zh) * | 2004-04-19 | 2008-01-02 | 重庆大学 | 薄膜电路热流计传感器 |
CN100359305C (zh) * | 2004-04-19 | 2008-01-02 | 重庆大学 | 平面绕线型热流计测头 |
BRPI0611752B8 (pt) | 2005-06-17 | 2021-05-25 | Merz Pharma Gmbh & Co Kgaa | dispositivo e processo para produção fermentativa de compostos biologicamente ativos |
DE102007023434B4 (de) | 2007-05-16 | 2017-07-06 | Innovative Sensor Technology Ist Ag | Widerstandsthermometer |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL83232C (enrdf_load_stackoverflow) * | 1950-06-20 | |||
DE1180215B (de) * | 1962-05-18 | 1964-10-22 | Duerrwaechter E Dr Doduco | Loesung von Resinaten der Edelmetalle und/oder Unedelmetalle in Chlorkohlenwasserstoffen zur Erzeugung von auf Traegerwerkstoffen ein-gebrannten duennen Edelmetallschichten bzw. Unedelmetalloxydschichten fuer elektrotechnische Zwecke |
DE2527739C3 (de) * | 1975-06-21 | 1978-08-31 | W.C. Heraeus Gmbh, 6450 Hanau | Verfahren zur Herstellung eines elektrischen Meßwiderstandes für ein Widerstandsthermometer |
US4469717A (en) * | 1980-02-29 | 1984-09-04 | Leeds & Northrup Company | Thin film resistance thermometer with a predetermined temperature coefficient of resistance and its method of manufacture |
US4375056A (en) * | 1980-02-29 | 1983-02-22 | Leeds & Northrup Company | Thin film resistance thermometer device with a predetermined temperature coefficent of resistance and its method of manufacture |
DE3426804C2 (de) * | 1984-07-10 | 1987-01-22 | W.C. Heraeus Gmbh, 6450 Hanau | Substrat für gedruckte Schaltungen |
US4766411A (en) * | 1986-05-29 | 1988-08-23 | U.S. Philips Corporation | Use of compositionally modulated multilayer thin films as resistive material |
-
1990
- 1990-08-17 DE DE4026061A patent/DE4026061C1/de not_active Expired - Lifetime
-
1991
- 1991-02-19 AT AT91102300T patent/ATE115761T1/de not_active IP Right Cessation
- 1991-02-19 EP EP91102300A patent/EP0471138B1/de not_active Expired - Lifetime
- 1991-02-19 DE DE59103868T patent/DE59103868D1/de not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5831512A (en) * | 1995-10-30 | 1998-11-03 | Heraeus Sensor-Nite Gmbh | Resistance thermometer |
DE19542516C1 (de) * | 1995-11-15 | 1997-04-17 | Heraeus Sensor Gmbh | Temperatur-Sensor |
US5959524A (en) * | 1995-11-15 | 1999-09-28 | Heraeus Electro-Nite International N.V. | Temperature sensor |
US6316752B1 (en) | 1997-10-03 | 2001-11-13 | Schaffler & Co., Gesellschaft Mbh | Heating element with screen-printed Au-Pd resinate layer and Ag-Pd contact areas with solder resistant dams |
DE102007046900A1 (de) | 2007-09-28 | 2009-04-30 | Heraeus Sensor Technology Gmbh | 1200°C-Schichtwiderstand |
DE102007046900B4 (de) * | 2007-09-28 | 2011-07-21 | Heraeus Sensor Technology GmbH, 63450 | Hochtemperatursensor und ein Verfahren zu dessen Herstellung |
DE102007046900C5 (de) | 2007-09-28 | 2018-07-26 | Heraeus Sensor Technology Gmbh | Hochtemperatursensor und ein Verfahren zu dessen Herstellung |
Also Published As
Publication number | Publication date |
---|---|
DE59103868D1 (de) | 1995-01-26 |
EP0471138A2 (de) | 1992-02-19 |
EP0471138A3 (en) | 1992-06-17 |
ATE115761T1 (de) | 1994-12-15 |
DE4026061C1 (enrdf_load_stackoverflow) | 1992-02-13 |
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