EP0432637B1 - Dispositif pour dresser le tranchant d'un outil de tronçonnage lors du tronçonnage de tranches d'un barreau ou d'une pièce en bloc, en particulier d'un matériau semi-conducteur, son application et procédé de sciage - Google Patents

Dispositif pour dresser le tranchant d'un outil de tronçonnage lors du tronçonnage de tranches d'un barreau ou d'une pièce en bloc, en particulier d'un matériau semi-conducteur, son application et procédé de sciage Download PDF

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Publication number
EP0432637B1
EP0432637B1 EP90123400A EP90123400A EP0432637B1 EP 0432637 B1 EP0432637 B1 EP 0432637B1 EP 90123400 A EP90123400 A EP 90123400A EP 90123400 A EP90123400 A EP 90123400A EP 0432637 B1 EP0432637 B1 EP 0432637B1
Authority
EP
European Patent Office
Prior art keywords
sharpening
cutting edge
cutting
stones
semiconductor material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP90123400A
Other languages
German (de)
English (en)
Other versions
EP0432637A1 (fr
Inventor
Helmut Dipl.-Ing. Seeburger
Peter Lehfeld
Wolf-Rüdiger Dipl.-Ing. Kurtze
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Publication of EP0432637A1 publication Critical patent/EP0432637A1/fr
Application granted granted Critical
Publication of EP0432637B1 publication Critical patent/EP0432637B1/fr
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Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces

Definitions

  • the invention relates to a device and a method for resharpening the cutting edge of cutting tools when cutting disks from rod-shaped or block-shaped workpieces, in particular made of semiconductor material, the cutting edge of the cutting tool being subjected to sharp interventions during the cutting process.
  • the geometric quality of the disks separated from the bars or blocks, the thickness of which is generally in the range from about 100 to 1000 ⁇ m, can be assessed, for example, by measuring a parameter known in technical terms as "warp". This is the difference between the maximum and the minimum distances of the middle pane surface from a reference plane.
  • the "warp" of a pane can be determined, for example, in accordance with ASTM standard F 657-80.
  • the warp of the disks obtained can be improved in that during the cutting process the cutting edge of the cutting tool causing the material removal, generally an internal hole saw or external cutting saw blade, is re-sharpened in the event of a deviation from the desired cutting course .
  • the entire cutting edge is not reground, but mainly the side surface of the cutting edge that is closer to the nominal cutting line.
  • a device is also specified by means of which the sharpening process can be carried out.
  • the cutting edge passes through an incision in a working head, in which a belt which is guided over a roller system and whose inclination is adjustable and coated with abrasive grains can, if required, be applied to the side surface of the cutting edge to be treated in each case.
  • this device is complicated and prone to failure.
  • the object of the invention was therefore to provide a sharpening device which is simpler and more reliable than the prior art, and a suitable sharpening method.
  • a device which is characterized by a sharpening system movable laterally to the saw blade, consisting of two elongated sharpening stones facing the cutting edge, which can only be moved translationally and have two opposing work surfaces on the end face, with the Sharpening has at least one of the working surfaces in contact with the surface of the cutting edge facing it.
  • the object is further achieved by a method according to the preamble of claim 7, which is characterized in that at least one working surface of a sharpening system, consisting of two elongated sharpening stones facing the cutting edge, which can only be moved in translation and have two mutually opposite working surfaces on the end face, is brought into contact with the surface of the cutting edge facing it by a lifting or lowering movement.
  • a sharpening system consisting of two elongated sharpening stones facing the cutting edge, which can only be moved in translation and have two mutually opposite working surfaces on the end face
  • a sharpening system which consists of two sharpening stones arranged offset from one another, the end faces of which are located on both sides of the cutting edge, the working surfaces each facing the cutting edge surface to be sharpened.
  • the figure shows the saw blade 1 of an internal hole saw, which is clamped on its outer circumference, not shown here, in a rotating clamping frame, while the inner circumference carries the cutting edge 2, which causes the material removal during the cutting process.
  • this has a teardrop-shaped cross section and consists of a metal matrix, for example a nickel coating with cutting grains of hard material such as diamond or boron nitride embedded therein.
  • a metal matrix for example a nickel coating with cutting grains of hard material such as diamond or boron nitride embedded therein.
  • those with vertical, vertical saw blade are also used, the invention being equally suitable for both arrangements.
  • both sharpening stones 3 and 4 are directed towards the cutting edge and protrude slightly beyond the inner edge thereof.
  • both sharpening stones are preferably directed as radially as possible onto the cutting edge and are advantageously arranged essentially parallel to one another.
  • an exactly or approximately parallel arrangement is not mandatory; Deviations of up to approximately + 10 ° from the exact orientation have proven to be tolerable. Instead of such a parallel arrangement, angled, for example crossed or converging arrangements are also possible, the angles being able to be up to approximately 120 °. In particular for reasons of space, it can also be expedient to have the sharpening stones deviate from the exact or substantially radial orientation by up to approximately 60 °.
  • both sharpening stones can be moved together, i.e. in particular can be raised or lowered together.
  • Such a coupled movement can be implemented with the least outlay in terms of apparatus and thus allows effective sharpening operations on both side surfaces of the cutting edge in a simple manner.
  • both sharpening stones can be moved independently of one another.
  • Sharpening stones in the form of round or, in particular, square rods are particularly suitable, advantageously with a square cross section. They are expediently dimensioned such that their contact distance with the cutting edge is approximately 3 to 10 mm, advantageously approximately 4 to 6 mm, during the sharpening operation.
  • the length of unused sharpening stones is typically about 10 to 15 cm; at progressive use, they can be worn down to the rest necessary for the attachment.
  • Sharpening stones of similar dimensions and shape are advantageously used in order to keep the differences between the sharpening operations acting on the respective cutting edge side small.
  • sharpening stones the materials customary in sharpening technology come into question, as are also used, for example, in the so-called "honing stones".
  • Suitable materials are e.g. Aluminum oxide or silicon carbide, which are used, for example, in solid form or can preferably be incorporated as abrasive particles in a carrier material based on ceramic or plastic.
  • both sharpening stones are advantageously selected from the same material.
  • the sharpening stones are fastened in the sharpening stone receptacles 5 and 6, for example by clamping, jamming, gluing or screwing. These ensure the precise alignment of the sharpening stones with respect to the cutting edge, which is as free of play as possible, and are connected, for example via the connecting webs 7 and 8, to a guide system (not shown for reasons of clarity), with the aid of which mutually coupled lifting and lowering movements of the receptacles 5 and 6 and so that the sharpening stones can be executed. Due to the coupled raising or lowering of the sharpening stones, the working surfaces incorporated into the end faces 9 of the sharpening stones can each be brought laterally to a side surface of the cutting edge and alternatively brought into contact with it.
  • a guide unit in the radial direction is also advantageously provided in the guide system in order to To be able to move sharpening stones towards or away from the cutting edge. This facilitates both the replacement of the sharpening stones and, in particular, the tracking when the working surface of a sharpening stone is used up. At the same time, the depth of engagement of the cutting edge in the end face of the sharpening stones and thus also the intensity of the sharpening process can be controlled.
  • the exact guidance of the lifting and lowering, and possibly also the back and forth movement can be ensured by suitable guide elements, for example by correspondingly arranged guide cylinders, guide rails or corresponding gears.
  • the movement can basically, e.g. with the help of set screws, carried out by hand, but also with the help of inexpensive computer-controlled stepper motors.
  • the entire sharpening system is expediently attached to the device frame at a suitable position, from which the sharpening stones can be brought into their working position in the inner hole and, if necessary, in contact with the cutting edge without separating the disks from the rod or block and removing them can.
  • it has proven useful to attach it to the protective cover of the saw blade that is present in most devices.
  • the deviation, which the saw blade has with respect to the desired cutting line is detected in the known manner while it is working through the workpiece in order to separate the desired disk.
  • Magnetic or eddy current sensors can be used for this purpose, with the aid of which the position of the saw blade can be tracked during sawing with a resolution of approximately 1 ⁇ m through the resulting disk.
  • the cutting force and / or the structure-borne noise occurring during the sawing process are also monitored in order to obtain further information about the cutting process and also the effect of sharpening operations.
  • the side of the cutting edge is subjected to a sharpening operation that faces the target cutting line is.
  • the sharpening system is raised or lowered so that the working surface of the sharpening stone adjacent to the side surface to be sharpened in each case is brought into contact with the latter.
  • the position of the sharpening stone can be changed step by step, so that a certain amount of the sharpening stone is removed step by step during sharpening until the cutting edge can rotate freely again.
  • the cutting edge works with the side surface in contact with the sharpening stone in each case by an amount determined by the increase or decrease this one, so that ultimately a step-shaped surface corresponding to the negative profile of the cutting edge traverses across the end face of the sharpening stone.
  • the depth of engagement of the cutting edge in the sharpening stone is typically between 0.01 and 2 mm, advantageously 0.05 to 0.2 mm; it is advantageously set so that the cutting edge can come into contact with the sharpening stone at least from its apex surface to its maximum cross-section during the sharpening process. This depth of engagement can be set, for example, with the aid of the guide elements which permit a radial displacement of the sharpening stones.
  • the radial feed path required for a certain sharpening effect can be estimated, for example, by measuring the cutting force.
  • the device according to the invention can be used advantageously with internal hole saws and is particularly suitable for those sawing processes in which the sharpening takes place during the actual sawing process, in which the disk is separated from the rod or block.
  • This is a clear advantage over the methods in which the sharpening operations only take place with the saw blade rotating freely, and the success or failure of the operation can only be checked on the basis of the following sawn disks, so that reject disks are necessary.
  • the device has proven itself for internal hole sawing of workpieces requiring a large depth of engagement of the saw blade, in particular in the internal hole sawing of panes made of single-crystal rods, for example made of silicon, with large diameters from at least about 100 mm, in particular from about 150 mm.
  • the device can also be used for external cutting saws, the cutting edge of which is therefore on the outer circumference of the saw blade.
  • a commercially available arrangement for internal hole sawing of silicon rods was made on the protective cover surrounding the rotating inner hole saw blade (outer diameter approx. 86 cm, inner hole diameter approx. 30.5 cm, cutting edge nickel-coated with embedded diamond grains) with a sharpening device designed analogously to the figure using a hand-held sharpening device
  • the saw blade level is equipped with an axially aligned guide cylinder that can be raised and lowered by means of a set screw.
  • the two sharpening stone holders were inserted into the inner hole of the horizontal saw blade via the two connecting bars.
  • An approx. 10 cm long sharpening stone with a square cross-section edge length approx.
  • the upper and the lower sharpening stone were brought into contact with the freely rotating cutting edge by briefly raising or lowering the lifting unit, whereby the depth of engagement was approx. 0.2 mm in each case.
  • the device was now ready for operation.
  • the actual sawing process could be started, in which a silicon rod (diameter approx. 150 mm) was successively sawn into slices approx. 0.8 mm thick.
  • the eddy current sensor was used to monitor the movement of the saw blade through the workpiece, with a deviation of approx. + 10 ⁇ m from the nominal cut being considered tolerable.
  • the side surface of the cutting edge facing the nominal cutting line was brought into contact with the corresponding working surface of a sharpening stone by raising or lowering the sharpening device while the sawing process continued unchanged. The contact was maintained, possibly also by continuous tracking, until the measuring sensor indicated that the saw blade was beginning to move back towards the target cutting line.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Claims (9)

  1. Dispositif pour réaffûter l'arête de coupe (2) d'outils à tronçonner lors du tronçonnage de disques de matériaux en forme de barres ou de blocs, en particulier d'un matériau semiconducteur, caractérisé par un système d'aiguisage qui est mobile latéralement par rapport à la lame de scie (1) et est constitué par deux meules allongées (3,4), qui sont tournés vers l'arête de coupe (2), sont déplaçables exclusivement en translation et possèdent frontalement deux surfaces de travail (9) se faisant face, au moins l'une des surfaces de travail étant en contact, lors de l'affûtage, avec la surface, tournée vers elles, de l'arête de coupe (2).
  2. Dispositif selon la revendication 1, caractérisé en ce que les meules d'affûtage (3,4) sont mobiles d'une manière accouplée.
  3. Dispositif selon les revendications 1 ou 2, caractérisé en ce que les meules d'affûtage (3,4) sont disposées de manière à être sensiblement parallèles.
  4. Dispositif selon une ou plusieurs des revendications 1 à 3, caractérisé en ce que le système d'affûtage est aligné radialement par rapport à l'arête de coupe (2).
  5. Utilisation du dispositif selon les revendications 1 à 4, lors du sciage de trous internes.
  6. Utilisation suivant la revendication 5, caractérisée par le fait que les pièces à usiner, qui doivent être sciées, sont des barreaux possédant un diamètre d'au moins 10 cm.
  7. Procédé de réaffûtage de l'arête de coupe (2) d'outils à tronçonner lors du tronçonnage de disques de matériaux en forme de barres ou de blocs, en particulier d'un matériau semiconducteur, caractérisé par le fait qu'au moins une surface de travail d'un système d'affûtage, constituée par deux meules allongées d'affûtage (3,4), qui sont tournées vers l'arête de coupe (2), sont déplaçables exclusivement en translation et possèdent frontalement deux surfaces de travail (9) se faisant face, est amenée en contact avec la surface, qui est tournée vers elles, de l'arête de coupe (2), selon un mouvement de soulèvement ou d'abaissement.
  8. Procédé selon la revendication 7, caractérisé en ce que lors de l'opération d'affûtage, la profondeur d'engagement de l'arête de coupe (2) dans la meule d'affûtage (3,4) est comprise entre 0,01 et 2 mm.
  9. Procédé selon la revendication 7 ou 8, caractérisé en ce que l'opération d'affûtage est exécutée respectivement sur la surface latérale, tournée vers la ligne de coupe de consigne, de l'arête de coupe (2).
EP90123400A 1989-12-12 1990-12-06 Dispositif pour dresser le tranchant d'un outil de tronçonnage lors du tronçonnage de tranches d'un barreau ou d'une pièce en bloc, en particulier d'un matériau semi-conducteur, son application et procédé de sciage Expired - Lifetime EP0432637B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3941038A DE3941038A1 (de) 1989-12-12 1989-12-12 Vorrichtung zum nachschaerfen der schneidkante von trennwerkzeugen beim abtrennen von scheiben von stab- oder blockfoermigen werkstuecken, insbesondere aus halbleitermaterial, ihre verwendung und saegeverfahren
DE3941038 1989-12-12

Publications (2)

Publication Number Publication Date
EP0432637A1 EP0432637A1 (fr) 1991-06-19
EP0432637B1 true EP0432637B1 (fr) 1993-10-27

Family

ID=6395321

Family Applications (1)

Application Number Title Priority Date Filing Date
EP90123400A Expired - Lifetime EP0432637B1 (fr) 1989-12-12 1990-12-06 Dispositif pour dresser le tranchant d'un outil de tronçonnage lors du tronçonnage de tranches d'un barreau ou d'une pièce en bloc, en particulier d'un matériau semi-conducteur, son application et procédé de sciage

Country Status (4)

Country Link
US (1) US5144938A (fr)
EP (1) EP0432637B1 (fr)
JP (1) JPH0725027B2 (fr)
DE (2) DE3941038A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04314278A (ja) * 1991-04-12 1992-11-05 Sony Corp 映像信号受信装置
JPH05116138A (ja) * 1991-09-30 1993-05-14 Mitsubishi Materials Corp スライシングマシン
DE4226769C1 (de) * 1992-08-13 1994-02-17 Hoffs Dentaltechnik Gmbh Arbeitsplatz mit Zurichtstein
US5632666A (en) * 1994-10-28 1997-05-27 Memc Electronic Materials, Inc. Method and apparatus for automated quality control in wafer slicing
US6015335A (en) * 1997-12-17 2000-01-18 Memc Electronic Materials, Inc. Apparatus for dressing inside diameter saws
DE19818484A1 (de) * 1998-04-24 1999-10-28 Wacker Siltronic Halbleitermat Verfahren zum Abtrennen einer Halbleiterscheibe
DE102013200855A1 (de) * 2013-01-21 2014-07-24 Robert Bosch Gmbh Handkreissäge
CN105216130B (zh) * 2014-06-24 2019-04-19 恩智浦美国有限公司 用于半导体切单锯的清洁装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB309637A (en) * 1928-01-18 1929-04-18 Ernst Valdemar Gandil Improved means for sharpening circular knives
US3662732A (en) * 1970-04-30 1972-05-16 Brown & Sharpe Mfg Grinding wheel dresser
US3747584A (en) * 1972-01-24 1973-07-24 Toyoda Machine Works Ltd Rotary dressing apparatus
JPS5276793A (en) * 1975-12-23 1977-06-28 Sumitomo Bakelite Co Ltd Grinder for forming grindstone
JPS57144663A (en) * 1981-03-02 1982-09-07 Tokyo Seimitsu Co Ltd Dresser for slicer
SU1098773A1 (ru) * 1982-07-09 1984-06-23 Всесоюзный научно-исследовательский и конструкторско-технологический институт природных алмазов и инструмента Способ правки шлифовального круга
JPS59136886A (ja) * 1983-01-26 1984-08-06 株式会社東芝 自動取引装置
DE3718947A1 (de) * 1987-06-05 1988-12-15 Wacker Chemitronic Verfahren zum schaerfen von trennwerkzeugen fuer das abtrennen von scheiben von stab- oder blockfoermigen werkstuecken und trennverfahren
US4971021A (en) * 1987-07-31 1990-11-20 Mitsubishi Kinzoku Kabushiki Kaisha Apparatus for cutting semiconductor crystal
EP0329087B1 (fr) * 1988-02-15 1994-11-17 Tokyo Seimitsu Co.,Ltd. Méthode et dispositif pour finisage sur machine pour rectifier une surface cylindrique intérieure

Also Published As

Publication number Publication date
US5144938A (en) 1992-09-08
DE3941038A1 (de) 1991-06-13
EP0432637A1 (fr) 1991-06-19
DE59003241D1 (de) 1993-12-02
JPH03184767A (ja) 1991-08-12
JPH0725027B2 (ja) 1995-03-22

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