JPS5276793A - Grinder for forming grindstone - Google Patents

Grinder for forming grindstone

Info

Publication number
JPS5276793A
JPS5276793A JP50152878A JP15287875A JPS5276793A JP S5276793 A JPS5276793 A JP S5276793A JP 50152878 A JP50152878 A JP 50152878A JP 15287875 A JP15287875 A JP 15287875A JP S5276793 A JPS5276793 A JP S5276793A
Authority
JP
Japan
Prior art keywords
grinder
forming grindstone
grindstone
forming
dresser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50152878A
Other languages
Japanese (ja)
Inventor
Masabumi Sueyoshi
Takeshi Fukahori
Tomio Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP50152878A priority Critical patent/JPS5276793A/en
Publication of JPS5276793A publication Critical patent/JPS5276793A/en
Pending legal-status Critical Current

Links

Landscapes

  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

PURPOSE: To form the width of a grindstone in high accuracy at high speed by using brackets for holding a dresser movable to approach or separate to or from each other.
COPYRIGHT: (C)1977,JPO&Japio
JP50152878A 1975-12-23 1975-12-23 Grinder for forming grindstone Pending JPS5276793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50152878A JPS5276793A (en) 1975-12-23 1975-12-23 Grinder for forming grindstone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50152878A JPS5276793A (en) 1975-12-23 1975-12-23 Grinder for forming grindstone

Publications (1)

Publication Number Publication Date
JPS5276793A true JPS5276793A (en) 1977-06-28

Family

ID=15550085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50152878A Pending JPS5276793A (en) 1975-12-23 1975-12-23 Grinder for forming grindstone

Country Status (1)

Country Link
JP (1) JPS5276793A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6156812A (en) * 1984-08-22 1986-03-22 Yasuhito Itagaki Polishing of grooving cutter for film resistor
US4677963A (en) * 1984-11-14 1987-07-07 Ajamian Hrant K Annular cutting disc
JPS63229265A (en) * 1987-03-13 1988-09-26 Sumitomo Metal Ind Ltd Abrasive cut-off machine
US4784108A (en) * 1987-10-05 1988-11-15 Johnson Lloyd E Grinding wheel dressing apparatus
JPH03184767A (en) * 1989-12-12 1991-08-12 Wacker Chemitronic Ges Elektron Grundstoffe Mbh Device for repolishing cut edge part of cutoff tool upon separation of wafer particularly from rod-like or block-like workpiece consisting of semiconductor and its use and sawing method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6156812A (en) * 1984-08-22 1986-03-22 Yasuhito Itagaki Polishing of grooving cutter for film resistor
US4677963A (en) * 1984-11-14 1987-07-07 Ajamian Hrant K Annular cutting disc
JPS63229265A (en) * 1987-03-13 1988-09-26 Sumitomo Metal Ind Ltd Abrasive cut-off machine
JPH0520228B2 (en) * 1987-03-13 1993-03-18 Sumitomo Metal Ind
US4784108A (en) * 1987-10-05 1988-11-15 Johnson Lloyd E Grinding wheel dressing apparatus
JPH03184767A (en) * 1989-12-12 1991-08-12 Wacker Chemitronic Ges Elektron Grundstoffe Mbh Device for repolishing cut edge part of cutoff tool upon separation of wafer particularly from rod-like or block-like workpiece consisting of semiconductor and its use and sawing method
JPH0725027B2 (en) * 1989-12-12 1995-03-22 ワッカー・ケミトロニク・ゲゼルシャフト・フュア・エレクトロニクス・グルントシュトッフェ・ミット・ベシュレンクテル・ハフツング Apparatus for re-grinding the cutting edge of a separating tool, especially for separating a wafer from a rod-shaped or block-shaped workpiece made of semiconductor material, and its use and sawing method

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