EP0372666A1 - Appareil multicompatible de fixation pour cartes intégrant des CMS ou des circuits imprimés à tester, et pour plaques contenant des contacts et des plaques de support, pour application dans des bancs de test - Google Patents

Appareil multicompatible de fixation pour cartes intégrant des CMS ou des circuits imprimés à tester, et pour plaques contenant des contacts et des plaques de support, pour application dans des bancs de test Download PDF

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Publication number
EP0372666A1
EP0372666A1 EP89250089A EP89250089A EP0372666A1 EP 0372666 A1 EP0372666 A1 EP 0372666A1 EP 89250089 A EP89250089 A EP 89250089A EP 89250089 A EP89250089 A EP 89250089A EP 0372666 A1 EP0372666 A1 EP 0372666A1
Authority
EP
European Patent Office
Prior art keywords
holding device
printed circuit
boards
frame
tested
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP89250089A
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German (de)
English (en)
Inventor
Werner Dipl.-Ing. Thom
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP0372666A1 publication Critical patent/EP0372666A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G01R1/07335—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards for double-sided contacting or for testing boards with surface-mounted devices (SMD's)
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals

Definitions

  • the invention relates to a holding device for circuit boards to be tested, printed circuit boards, electromechanical modules and devices; and for contact pin carrier plates and hold-down plates for use in test equipment.
  • Modern electronic devices such as computers, measuring and control devices, consumer electronics devices, etc. are usually made up of several assemblies both in electrical and mechanical terms.
  • An assembly usually consists of a printed circuit board, which is equipped on one or both sides with the corresponding active and passive electrical components, such as resistors, transistors and ICs.
  • the entire assembly which is often also referred to as an SMD printed circuit board (surface mounted device) or as a flat assembly, is generally connected electrically and mechanically to the rest of the device in the form of an insert via a plug connection, usually in the form of a male connector.
  • Electromechanical units such as larger relays, could also be arranged on a printed circuit board, so that the entire unit is then addressed as an electromechanical assembly.
  • Printed circuit boards of the type described are usually manufactured on semi or fully automatic assembly and tinning systems and then checked for their functional reliability in extensive testing procedures. For this purpose, it is possible on the one hand to contact the printed circuit board to be tested with an electrical test device via the plug connector provided as standard, on the other hand - in view of the increasingly complex electronic circuits and the associated susceptibility to faults - it is also necessary to carry out so-called "in-circuit tests" to carry out, in which, for example, integrated circuits (IC's) are contacted at certain points in the state soldered onto the semiconductor board, whereupon various test and adjustment routines can then be carried out.
  • IC's integrated circuits
  • test devices are usually used in which the printed circuit board or printed circuit board is held in a defined position, whereupon an arrangement of contact pins arranged on a plate against the one to be tested is then used Printed circuit board is pressed so that the test or contact points selected on the printed circuit board or printed circuit board are contacted.
  • the contact pins are connected Cable connected to a multiple connector, with which the connection to the electrical part of the test device is made.
  • hold-down plates which absorb the forces exerted by the contact pins are usually arranged on printed circuit boards to be tested on one side on the side which is not clad with copper. For this purpose, approximately peg-shaped elements are provided on the hold-down plate, which are placed on free areas of the printed circuit board or printed circuit board assembly. Combinations of hold-down plates and contact pin carrier plates have also become known for testing flat assemblies equipped on both sides.
  • DE-OS 27 50 492 discloses a test holder for plate-shaped assemblies equipped with electrical components, in which the circuit board to be tested is inserted into a pivotable guide and pressed against an exchangeable cassette with test probes.
  • an adapter for connecting the connection and / or test points of an electrical assembly arranged on a carrier via contacting elements to the connections of a measuring circuit in which the circuit board to be tested is in a frame firmly connected to the test device is held and pressed against a number of contact pins (contacting elements), the contact pins to be used being selected by interposing a replaceable grid plate with bores corresponding to the test points.
  • DE-AS 26 28 428 a device is known from DE-AS 26 28 428 in which the circuit board to be tested is also held in a U-shaped frame and in which the contact pins (test pins) are partially movable.
  • test adapter for flat electrical assemblies is known in which the circuit board to be tested is free, i.e. is pressed onto evenly distributed contact pins (styli) without a special fixing device.
  • DE-OS 34 05 568 describes a device for contacting contact units for the automatic testing of printed circuit boards, in which the printed circuit board to be tested is placed on a test fixture that is firmly connected to the device, whereby a position fixation is to be ensured by special guide needles.
  • test devices have in common that for each type of printed circuit board to be tested, a contact pin carrier plate specially matched to this, as well as often a hold-down plate, must be made and kept in stock.
  • Various test devices have been proposed in which this effort should be reduced by a universal arrangement of contact pins, but which could not be implemented due to the high construction costs and / or poor contacting properties:
  • test equipment needs to equip the test equipment with other contact pin carrier plates, possibly test specimen mounting plates and hold-down plates when converting production to a different type of printed circuit board leads to long set-up times, which Particularly in view of the increasing proportion of so-called ASIC's (user-specific integrated circuits) and the associated relatively small lot sizes, this is a serious disadvantage.
  • ASIC's user-specific integrated circuits
  • contact pin carrier plates, and possibly hold-down plates and test specimen receiving plates not only have to be tailored to a specific type of printed circuit board, but above that can also only be used on a specific test device.
  • the number was therefore according to the prior art
  • the contact pin carrier plates, hold-down plates and possibly test specimen receptacles to be stored by a manufacturing company not only depend on the production program, i.e. the number of different circuit board types, printed circuit boards and devices, but also multiplied by the number of testing devices used in the manufacturing company.
  • the invention is therefore also based on the object of providing a holding device of the type mentioned which can be used on any test devices provided for this purpose.
  • mechanically stable units are created by the use according to the invention of frames that receive the plates or flat assemblies are easy to use and allow a quick change that minimizes set-up times.
  • the manually prepared units each consisting of a contact pin carrier plate, a test specimen receiving plate or a hold-down plate and a frame according to the invention, also allow the testing process to be integrated into a CIM (computer integrated manufacturing) system with in-line testing devices.
  • CIM computer integrated manufacturing
  • test specimen receiving plate which lies in the frame and in which the circuit board to be tested is in turn.
  • This makes it possible to also test special designs of printed circuit boards, such as circular ones - for example, for attaching them to display tubes.
  • test specimen receiving plate it is possible to provide this for receiving several printed circuit boards - in particular in European format (100 mm x 160 mm) - so that in one test run, ie Several test specimens can be tested at the same time with a single start-up or shutdown of the contact pin carrier plates or hold-down plate and the throughput of test specimens can be increased significantly.
  • This can make it possible for a manufacturer, for example, to offer two different device series, one of which is designed to accommodate the smaller frame type - i.e. includes a number of smaller, manually operated test devices - and the other is intended to accommodate the larger frame type is, but can alternatively accommodate two smaller frames. This ensures consistency in production from a manual test device to a large in-line test machine.
  • the basic idea of the invention is to provide a multi-compatible - i.e. to create suitable holding devices for different test devices, in which the holding elements provided for holding the frames in the respective test device are identical in one to all test devices, i.e. standardized distance are arranged.
  • FIG. 1 The perspective arrangement shown in FIG. 1 consists of three frames 1, 2 and 3 according to the invention, the frames 1 and 3 being identical.
  • the frames are inserted into groove-shaped receiving elements 4, which are shown partially broken away in the drawing or have been omitted with regard to the middle frame 2, in order to promote the clarity of the illustration.
  • the upper frame 1 is connected to a correspondingly movable part of the testing device via two groove-shaped receiving elements 4, so that it can be lowered in the direction of the arrow 5, for example hydraulically or pneumatically.
  • the lower frame 3 is connected via groove-shaped receiving elements 4 to a part of the test device which can be moved upwards in the direction of the arrow 6 - likewise hydraulically or pneumatically.
  • the middle frame 2 is also connected to the test device via groove-shaped receiving elements, which are not shown here.
  • the upper frame 1 as well as the lower frame 3 has on one narrow side a quick-release cross bar 7 or 8, after its release a plate can be inserted into the frame having a circumferential U-shaped groove on its inside.
  • a hold-down plate 9 is inserted into the upper frame 1, which has pin-shaped pressing elements 10 on its underside.
  • a contact pin carrier plate 11 is inserted into the lower frame 3 and has contact pins 12 on its upper side.
  • the middle frame 2 has an L-shaped groove 13 on the inside, into which a circuit board 14 to be tested can be inserted.
  • Corresponding locating pins 16 can be arranged in the L-shaped groove 13 with a corresponding hole 15 in the circuit board 14 to be tested, with which pins, for example, a reverse position of the circuit board 14 to be tested can be excluded.
  • plug-shaped contact elements can be arranged in order, for example, to contact existing male connectors on the circuit board to be tested.
  • the arrangement of the contact pins 12 on the contact pin carrier plate 11 corresponds to the arrangement of the test points to be contacted on the underside of the printed circuit board 14 to be tested.
  • the arrangement of the pin-shaped pressing elements 10 on the underside of the hold-down plate 9 corresponds to that on the upper side of the printed circuit board 14 between the Components 18 remaining vacancies.
  • the three frames After the three frames have been fitted with the corresponding plates and inserted into the test device, the three frames are moved towards one another in the direction of arrows 5 and 6 by appropriate movement of the test device parts to which they are connected via the groove-shaped receiving elements 4. so that the peg-shaped pressing elements 10 of the hold-down plate 9 come into contact with the corresponding free spaces on the upper side of the printed circuit board 14 to be tested and the contact pins 12 on the contact pin carrier plate 11 with the test points to be contacted on the underside of the printed circuit board 14 to be tested, whereupon the actual electrical test routine can be performed.
  • the groove-shaped receiving elements 4, each provided in pairs for receiving a frame 1, 2 or 3, have the same distance in each test device provided for use with the holding device according to the invention a on, so that the frame with the corresponding hold-down plates 9 or contact-pin support plates 11 tailored to a specific type of printed circuit board 19 to be tested when changing to another test device - for example to a more modern device with more extensive programming options within a manufacturer's series , - can continue to be used so that unnecessary investments are avoided.
  • Fig. 2 three frames 1, 2 and 3 according to the invention are shown in groove-shaped receiving elements 4, which are equipped with a hold-down or contact pin support plate for testing a double-sided printed circuit board 20.
  • the two-sided printed circuit board 20 lies in a test specimen receiving plate 21, which allows the testing of non-standard dimensions printed circuit boards.
  • a contact pin carrier plate 22 with contact pins 12 is arranged, on the underside of which an additional hold-down plate 24 with peg-shaped pressing elements 10 is fastened via springs 23.
  • the lower frame 3 which in this exemplary embodiment has an L-shaped groove, supports a contact pin carrier plate 11 with contact pins 12 as in the exemplary embodiment shown in FIG. 1.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
EP89250089A 1988-11-23 1989-11-16 Appareil multicompatible de fixation pour cartes intégrant des CMS ou des circuits imprimés à tester, et pour plaques contenant des contacts et des plaques de support, pour application dans des bancs de test Withdrawn EP0372666A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3839539 1988-11-23
DE19883839539 DE3839539A1 (de) 1988-11-23 1988-11-23 Multikompatible halteeinrichtung fuer zu pruefende leiterplatten bzw. flachbaugruppen, und fuer kontaktstift-traegerplatten und niederhalteplatten zur verwendung in pruefgeraeten

Publications (1)

Publication Number Publication Date
EP0372666A1 true EP0372666A1 (fr) 1990-06-13

Family

ID=6367717

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89250089A Withdrawn EP0372666A1 (fr) 1988-11-23 1989-11-16 Appareil multicompatible de fixation pour cartes intégrant des CMS ou des circuits imprimés à tester, et pour plaques contenant des contacts et des plaques de support, pour application dans des bancs de test

Country Status (2)

Country Link
EP (1) EP0372666A1 (fr)
DE (1) DE3839539A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991006203A1 (fr) * 1989-10-10 1991-05-02 Dowty Woodville Polymer Limited Planche de support
EP0864871A2 (fr) * 1997-03-10 1998-09-16 Canon Kabushiki Kaisha Procédé, dispositif et outil de nettoyage pour sondes de test électrique pour plaquettes. Dispositif et procédé pour tests électriques pour plaquettes
DE19707485B4 (de) * 1996-02-26 2008-01-24 Everett Charles Technologies, Inc., Pomona Haltevorrichtung und Haltebaugruppe für ein Leiterplatten-Prüfgerät
EP1995602A1 (fr) * 2007-05-23 2008-11-26 RRo Industrial Design B.V. Panneau de sonde, élément de test, procédé de fabrication d'un panneau de sonde, et procédé de test pour une carte de circuit imprimée (PBC)
EP3715864A3 (fr) * 2019-03-29 2020-10-21 Yamaichi Electronics Deutschland GmbH Dispositif d'essai et utilisation du dispositif d'essai

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2224972A1 (en) * 1973-04-03 1974-10-31 Cit Alcatel Printed circuit card test instrument - signals measured on card as well as from card terminals
EP0261829A1 (fr) * 1986-09-23 1988-03-30 Marconi Instruments Limited Dispositif d'interface électrique
US4797610A (en) * 1986-05-08 1989-01-10 Miguel Fombellida Electronic test fixture

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2224972A1 (en) * 1973-04-03 1974-10-31 Cit Alcatel Printed circuit card test instrument - signals measured on card as well as from card terminals
US4797610A (en) * 1986-05-08 1989-01-10 Miguel Fombellida Electronic test fixture
EP0261829A1 (fr) * 1986-09-23 1988-03-30 Marconi Instruments Limited Dispositif d'interface électrique

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991006203A1 (fr) * 1989-10-10 1991-05-02 Dowty Woodville Polymer Limited Planche de support
DE19707485B4 (de) * 1996-02-26 2008-01-24 Everett Charles Technologies, Inc., Pomona Haltevorrichtung und Haltebaugruppe für ein Leiterplatten-Prüfgerät
EP0864871A2 (fr) * 1997-03-10 1998-09-16 Canon Kabushiki Kaisha Procédé, dispositif et outil de nettoyage pour sondes de test électrique pour plaquettes. Dispositif et procédé pour tests électriques pour plaquettes
EP0864871A3 (fr) * 1997-03-10 2000-05-03 Canon Kabushiki Kaisha Procédé, dispositif et outil de nettoyage pour sondes de test électrique pour plaquettes. Dispositif et procédé pour tests électriques pour plaquettes
US6118289A (en) * 1997-03-10 2000-09-12 Canon Kabushiki Kaisha Cleaning method and cleaning device and cleaning tool for board electrical-test probes, and board electrical-test device and method
EP1995602A1 (fr) * 2007-05-23 2008-11-26 RRo Industrial Design B.V. Panneau de sonde, élément de test, procédé de fabrication d'un panneau de sonde, et procédé de test pour une carte de circuit imprimée (PBC)
WO2008143512A1 (fr) * 2007-05-23 2008-11-27 Rro Industrial Design B.V. Carte sonde, montage de test, procédé de fabrication d'une carte sonde, et procédé de test d'une carte de circuit imprimé (pcb)
EP3715864A3 (fr) * 2019-03-29 2020-10-21 Yamaichi Electronics Deutschland GmbH Dispositif d'essai et utilisation du dispositif d'essai

Also Published As

Publication number Publication date
DE3839539A1 (de) 1990-05-31

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