EP0251302A3 - Alkalisches aussenstromloses Kupferbad - Google Patents
Alkalisches aussenstromloses Kupferbad Download PDFInfo
- Publication number
- EP0251302A3 EP0251302A3 EP87109422A EP87109422A EP0251302A3 EP 0251302 A3 EP0251302 A3 EP 0251302A3 EP 87109422 A EP87109422 A EP 87109422A EP 87109422 A EP87109422 A EP 87109422A EP 0251302 A3 EP0251302 A3 EP 0251302A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- alcaline
- plating bath
- copper plating
- chemical copper
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 2
- 229910052802 copper Inorganic materials 0.000 title abstract 2
- 239000010949 copper Substances 0.000 title abstract 2
- 238000007747 plating Methods 0.000 title 1
- 239000000126 substance Substances 0.000 title 1
- 239000008139 complexing agent Substances 0.000 abstract 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 abstract 1
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 abstract 1
- 239000003513 alkali Substances 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 150000001879 copper Chemical class 0.000 abstract 1
- HRKQOINLCJTGBK-UHFFFAOYSA-N dihydroxidosulfur Chemical compound OSO HRKQOINLCJTGBK-UHFFFAOYSA-N 0.000 abstract 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 abstract 1
- 229910052733 gallium Inorganic materials 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 150000003566 thiocarboxylic acids Chemical class 0.000 abstract 1
- 239000000080 wetting agent Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19863622090 DE3622090C1 (enrdf_load_stackoverflow) | 1986-07-02 | 1986-07-02 | |
| DE3622090 | 1986-07-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0251302A2 EP0251302A2 (de) | 1988-01-07 |
| EP0251302A3 true EP0251302A3 (de) | 1988-07-27 |
Family
ID=6304162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP87109422A Withdrawn EP0251302A3 (de) | 1986-07-02 | 1987-06-30 | Alkalisches aussenstromloses Kupferbad |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0251302A3 (enrdf_load_stackoverflow) |
| DE (1) | DE3622090C1 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5419926A (en) * | 1993-11-22 | 1995-05-30 | Lilly London, Inc. | Ammonia-free deposition of copper by disproportionation |
| JP4843164B2 (ja) * | 2001-08-21 | 2011-12-21 | 日本リーロナール有限会社 | 銅−樹脂複合材料の形成方法 |
| EP1411147A1 (en) * | 2002-10-18 | 2004-04-21 | Shipley Co. L.L.C. | Formaldehyde-free electroless copper plating process and solution for use in the process |
| CN100402700C (zh) * | 2002-11-20 | 2008-07-16 | 希普雷公司 | 无甲醛化学镀铜方法及该方法中使用的溶液 |
| US7892413B2 (en) | 2006-09-27 | 2011-02-22 | Solopower, Inc. | Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films |
| US8425753B2 (en) | 2008-05-19 | 2013-04-23 | Solopower, Inc. | Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3902907A (en) * | 1973-08-17 | 1975-09-02 | Kazutaka Kishita | System for electroless plating of copper and composition |
| US4124399A (en) * | 1977-09-13 | 1978-11-07 | Shipley Company Inc. | Stabilized electroless plating solutions |
| US4301196A (en) * | 1978-09-13 | 1981-11-17 | Kollmorgen Technologies Corp. | Electroless copper deposition process having faster plating rates |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1254935B (de) * | 1960-12-31 | 1967-11-23 | Bayer Ag | Waessriges Bad zur chemischen Abscheidung von borhaltigen Metallueberzuegen |
| DE1243493B (de) * | 1961-02-04 | 1967-06-29 | Bayer Ag | Waessriges Bad zur chemischen Abscheidung von borhaltigen Metallueberzuegen |
| US3361580A (en) * | 1963-06-18 | 1968-01-02 | Day Company | Electroless copper plating |
| US3377174A (en) * | 1963-10-24 | 1968-04-09 | Torigai Eiichi | Method and bath for chemically plating copper |
| US3403035A (en) * | 1964-06-24 | 1968-09-24 | Process Res Company | Process for stabilizing autocatalytic metal plating solutions |
| US3607317A (en) * | 1969-02-04 | 1971-09-21 | Photocircuits Corp | Ductility promoter and stabilizer for electroless copper plating baths |
| US3649308A (en) * | 1970-05-21 | 1972-03-14 | Shipley Co | Stabilized electroless plating solutions |
| US3959531A (en) * | 1971-04-23 | 1976-05-25 | Photocircuits Corporation | Improvements in electroless metal plating |
| NL7402422A (nl) * | 1974-02-22 | 1975-08-26 | Philips Nv | Universele verkoperingsoplossing. |
| US4189324A (en) * | 1978-06-02 | 1980-02-19 | Michael Gulla | Stabilized electroless plating solutions |
| IT1157006B (it) * | 1982-03-09 | 1987-02-11 | Alfachimici Spa | Miscela stabilizzante per un bagno di rame chimico |
-
1986
- 1986-07-02 DE DE19863622090 patent/DE3622090C1/de not_active Expired - Fee Related
-
1987
- 1987-06-30 EP EP87109422A patent/EP0251302A3/de not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3902907A (en) * | 1973-08-17 | 1975-09-02 | Kazutaka Kishita | System for electroless plating of copper and composition |
| US4124399A (en) * | 1977-09-13 | 1978-11-07 | Shipley Company Inc. | Stabilized electroless plating solutions |
| US4301196A (en) * | 1978-09-13 | 1981-11-17 | Kollmorgen Technologies Corp. | Electroless copper deposition process having faster plating rates |
Non-Patent Citations (1)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN, Band 8, Nr. 106 (C-223)[1543], 18. Mai 1984; & JP-A-59 20 460 (NIPPON DENKI K.K.) 02-02-1984 * |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3622090C1 (enrdf_load_stackoverflow) | 1990-02-15 |
| EP0251302A2 (de) | 1988-01-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB808104A (en) | Electrodeposition of copper from aqueous alkaline cyanide solutions | |
| EP0630991A4 (enrdf_load_stackoverflow) | ||
| KR870010216A (ko) | 무전해 구리도금 및 이에 사용되는 도금욕 | |
| GB1302674A (enrdf_load_stackoverflow) | ||
| EP0251302A3 (de) | Alkalisches aussenstromloses Kupferbad | |
| GB1426462A (en) | Process and composition for sensitizing articles for metallization | |
| JPH0261073A (ja) | 無電解錫めっき浴及び無電解錫めっき方法 | |
| GB1461036A (en) | Process and liquid for the catalytic sensitization of non- metallic surfaces for subsequent electroless metallization | |
| GB939007A (en) | Bright gold electroplating | |
| SE8002598L (sv) | Silver- och silver/guld-pleteringsbad | |
| GB1270902A (en) | Continuously bronze plating aluminium wire or strip | |
| GB1400492A (en) | Gold alloy plating solutions | |
| GB1292006A (en) | Improvements in or relating to the electroplating of wire | |
| GB955648A (en) | Bright silver plating | |
| GB1101848A (en) | Process and solution for sensitizing substrates for electroless plating | |
| GB1283024A (en) | Electro-depositing silver alloys | |
| US2783194A (en) | Iodate-containing plating baths | |
| GB831929A (en) | Improvements in or relating to copper plating | |
| GB899020A (en) | Electroplating bath and process | |
| GB1337281A (en) | Electroplating of cobalt or cobalt alloy and a composition for depositing the electroplate | |
| GB626693A (en) | Improvements in and relating to the surface treatment of aluminium and aluminium base alloys | |
| GB741111A (en) | Electrodeposition of metal from alkaline cyanide bath | |
| GB1385663A (en) | Particulate compositions for adding to copper electroplating baths | |
| GB1033307A (en) | Gold plating | |
| GB1017402A (en) | Method for electroplating on aluminium and its alloys |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE CH FR GB IT LI LU NL SE |
|
| PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
| AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE CH FR GB IT LI LU NL SE |
|
| 17P | Request for examination filed |
Effective date: 19890117 |
|
| 17Q | First examination report despatched |
Effective date: 19900117 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 19920103 |
|
| RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: BREIDENBACH, HERBERT Inventor name: HUPE, JUERGEN, DR. Inventor name: KRONENBERG, WALTER, DR. Inventor name: KNAAK, EBERHARD |