EP0251302A3 - Alcaline chemical copper plating bath - Google Patents

Alcaline chemical copper plating bath Download PDF

Info

Publication number
EP0251302A3
EP0251302A3 EP87109422A EP87109422A EP0251302A3 EP 0251302 A3 EP0251302 A3 EP 0251302A3 EP 87109422 A EP87109422 A EP 87109422A EP 87109422 A EP87109422 A EP 87109422A EP 0251302 A3 EP0251302 A3 EP 0251302A3
Authority
EP
European Patent Office
Prior art keywords
alcaline
plating bath
copper plating
chemical copper
agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP87109422A
Other languages
German (de)
French (fr)
Other versions
EP0251302A2 (en
Inventor
Walter Dr. Kronenberg
Herbert Breidenbach
Jürgen Dr. Hupe
Eberhard Knaak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blasberg-Oberflachentechnik GmbH
Original Assignee
Blasberg-Oberflachentechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blasberg-Oberflachentechnik GmbH filed Critical Blasberg-Oberflachentechnik GmbH
Publication of EP0251302A2 publication Critical patent/EP0251302A2/en
Publication of EP0251302A3 publication Critical patent/EP0251302A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Abstract

Ein alkalisches außenstromloses Kupferbad enthaltend Kupfersalz, Reduktionsmittel, Netzmittel, Alkalihydro­ xid und Komplexierungsmittel kann cyanidfrei und ge­ wünschtenfalls auch formaldehydfrei hergestellt werden, wenn es als Komplexierungsmittel N,N,N′,N′-Tetrakis­ (2-hydroxipropyl)-ethylendiamin, Thioalkohol oder eine Thiocarbonsäure und ein Gallium-, Indium- und/oder Thal­ liumsalz enthält. Containing an alkaline external electroless copper bath Copper salt, reducing agent, wetting agent, alkali hydro xid and complexing agent can be cyanide-free and ge if desired, can also be produced free of formaldehyde, when it is used as a complexing agent N, N, N ′, N′-tetrakis (2-hydroxypropyl) ethylenediamine, thioalcohol or one Thiocarboxylic acid and a gallium, indium and / or thal contains lium salt.

EP87109422A 1986-07-02 1987-06-30 Alcaline chemical copper plating bath Withdrawn EP0251302A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3622090 1986-07-02
DE19863622090 DE3622090C1 (en) 1986-07-02 1986-07-02

Publications (2)

Publication Number Publication Date
EP0251302A2 EP0251302A2 (en) 1988-01-07
EP0251302A3 true EP0251302A3 (en) 1988-07-27

Family

ID=6304162

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87109422A Withdrawn EP0251302A3 (en) 1986-07-02 1987-06-30 Alcaline chemical copper plating bath

Country Status (2)

Country Link
EP (1) EP0251302A3 (en)
DE (1) DE3622090C1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4843164B2 (en) * 2001-08-21 2011-12-21 日本リーロナール有限会社 Method for forming copper-resin composite material
EP1411147A1 (en) * 2002-10-18 2004-04-21 Shipley Co. L.L.C. Formaldehyde-free electroless copper plating process and solution for use in the process
CN100402700C (en) * 2002-11-20 2008-07-16 希普雷公司 Methyl free copper plating method and used solution thereof
US7892413B2 (en) 2006-09-27 2011-02-22 Solopower, Inc. Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films
US8425753B2 (en) 2008-05-19 2013-04-23 Solopower, Inc. Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3902907A (en) * 1973-08-17 1975-09-02 Kazutaka Kishita System for electroless plating of copper and composition
US4124399A (en) * 1977-09-13 1978-11-07 Shipley Company Inc. Stabilized electroless plating solutions
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1254935B (en) * 1960-12-31 1967-11-23 Bayer Ag Aqueous bath for chemical deposition of boron-containing metal coatings
DE1243493B (en) * 1961-02-04 1967-06-29 Bayer Ag Aqueous bath for chemical deposition of boron-containing metal coatings
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
US3377174A (en) * 1963-10-24 1968-04-09 Torigai Eiichi Method and bath for chemically plating copper
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
US3607317A (en) * 1969-02-04 1971-09-21 Photocircuits Corp Ductility promoter and stabilizer for electroless copper plating baths
US3649308A (en) * 1970-05-21 1972-03-14 Shipley Co Stabilized electroless plating solutions
US3959531A (en) * 1971-04-23 1976-05-25 Photocircuits Corporation Improvements in electroless metal plating
NL7402422A (en) * 1974-02-22 1975-08-26 Philips Nv UNIVERSAL SALES SOLUTION.
US4189324A (en) * 1978-06-02 1980-02-19 Michael Gulla Stabilized electroless plating solutions
IT1157006B (en) * 1982-03-09 1987-02-11 Alfachimici Spa STABILIZING MIXTURE FOR A CHEMICAL COPPER BATH
JPS5920460A (en) * 1982-07-27 1984-02-02 Nec Corp Electroless copper plating solution

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3902907A (en) * 1973-08-17 1975-09-02 Kazutaka Kishita System for electroless plating of copper and composition
US4124399A (en) * 1977-09-13 1978-11-07 Shipley Company Inc. Stabilized electroless plating solutions
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, Band 8, Nr. 106 (C-223)[1543], 18. Mai 1984; & JP-A-59 20 460 (NIPPON DENKI K.K.) 02-02-1984 *

Also Published As

Publication number Publication date
EP0251302A2 (en) 1988-01-07
DE3622090C1 (en) 1990-02-15

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Inventor name: BREIDENBACH, HERBERT

Inventor name: HUPE, JUERGEN, DR.

Inventor name: KRONENBERG, WALTER, DR.

Inventor name: KNAAK, EBERHARD