GB1400492A - Gold alloy plating solutions - Google Patents

Gold alloy plating solutions

Info

Publication number
GB1400492A
GB1400492A GB2981372A GB2981372A GB1400492A GB 1400492 A GB1400492 A GB 1400492A GB 2981372 A GB2981372 A GB 2981372A GB 2981372 A GB2981372 A GB 2981372A GB 1400492 A GB1400492 A GB 1400492A
Authority
GB
United Kingdom
Prior art keywords
alkali metal
brightener
complexed
june
electro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2981372A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Finishing Corp
Original Assignee
Oxy Metal Finishing Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxy Metal Finishing Corp filed Critical Oxy Metal Finishing Corp
Publication of GB1400492A publication Critical patent/GB1400492A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

1400492 Electro-deposition of gold alloys OXY METAL FINISHING INTERNATIONAL SA 26 June 1972 [9 July 1971 6 Sept 1971 21 June 1972] 29813/72 Heading C7B Bright, ductile gold alloy is electro-deposited from a plating solution containing 3-5 g/l Au; 30-50 g/l Cu; 0À2-0À5 g/l Cd and 0À005-0À02 g/l Ag - all present as complex cyanides; 15-25 g/l free alkali metal cyanide or ammonium cyanide; a brightener, a wetting agent and a buffering agent. The brightener may be a sulphur compound, e.g. thiourea, thioacetamide, alkali metal thiocyanate or thiosulphate, a sulphurous, sulphonic or amino-sulphonic acid; an organic oxygen or nitrogen compound, e.g. hydroxyl, carbonyl or ether compound, alkanolamine, formamide, acetamide, morpholine, oxazoles or vinyl pyrrolidene; or complexed stannous ions, e.g. complexed with gluconic, tartaric, lactic, malic or citric acid. The surfactant may be an alkali metal resinate or polyalkylene sulphonate; and the buffer may be phosphate or borate. The plating current may be D.C., rectified A.C., A.C. + D.C. or periodically reversed. The counter electrode may be Pt, platinized Ti or graphite.
GB2981372A 1971-07-09 1972-06-26 Gold alloy plating solutions Expired GB1400492A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH1018471A CH529843A (en) 1971-07-09 1971-07-09 Bath for the electrolytic deposition of gold alloys and its use in electroplating
CH1302371A CH558836A (en) 1971-07-09 1971-09-06 USE OF AN ELECTROLYTIC BATH FOR THE DEPOSIT OF GOLD ALLOYS.
CH934872A CH540344A (en) 1971-07-09 1972-06-21 Bath for electroplating gold alloys

Publications (1)

Publication Number Publication Date
GB1400492A true GB1400492A (en) 1975-07-16

Family

ID=27176205

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2981372A Expired GB1400492A (en) 1971-07-09 1972-06-26 Gold alloy plating solutions

Country Status (4)

Country Link
CH (3) CH529843A (en)
DE (1) DE2233783A1 (en)
FR (1) FR2145734B1 (en)
GB (1) GB1400492A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2166660A1 (en) * 1999-05-06 2002-04-16 Torres Josep Ferre Equipment for the electrolytic deposition of gold or gold alloys
EP2312021A1 (en) 2009-10-15 2011-04-20 The Swatch Group Research and Development Ltd. Method for obtaining a deposit of a yellow gold alloy by galvanoplasty without using toxic metals
EP1728898A3 (en) * 2005-06-02 2012-04-18 Rohm and Haas Electronic Materials LLC Electrolytes for the deposition of gold alloys
DE102012004348A1 (en) * 2012-03-07 2013-09-12 Umicore Galvanotechnik Gmbh Additive for improving the layer thickness distribution in galvanic drum electrolytes
US9683303B2 (en) 2007-09-21 2017-06-20 The Swatch Group Research And Development Ltd Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH621367A5 (en) * 1977-07-08 1981-01-30 Systemes Traitements Surfaces Electrolytic bath for plating gold-copper-cadmium alloys and its use in galvanoplasty
CH632533A5 (en) * 1979-06-14 1982-10-15 Aliprandini P PROCESS FOR THE GALVANOPLASTIC DEPOSIT OF A GOLD ALLOY.
CH662583A5 (en) * 1985-03-01 1987-10-15 Heinz Emmenegger GALVANIC BATH FOR THE ELECTROLYTIC DEPOSITION OF GOLD-COPPER-CADMIUM-ZINC ALLOYS.
US5256275A (en) * 1992-04-15 1993-10-26 Learonal, Inc. Electroplated gold-copper-silver alloys

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1370596A (en) * 1962-03-30 1964-08-28 Marconi Co Ltd Improvements in gold electrolytic deposition processes
CH418085A (en) * 1964-08-19 1966-07-31 Pilot Pen Co Ltd Electrolyte for the galvanic deposition of gold alloys
FR1433211A (en) * 1965-05-14 1966-03-25 Further development in gold plating
CH522740A (en) * 1968-06-28 1972-06-30 Degussa Process for the electrodeposition of gold-copper-cadmium alloy coatings

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2166660A1 (en) * 1999-05-06 2002-04-16 Torres Josep Ferre Equipment for the electrolytic deposition of gold or gold alloys
EP1728898A3 (en) * 2005-06-02 2012-04-18 Rohm and Haas Electronic Materials LLC Electrolytes for the deposition of gold alloys
US9683303B2 (en) 2007-09-21 2017-06-20 The Swatch Group Research And Development Ltd Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids
US10233555B2 (en) 2007-09-21 2019-03-19 The Swatch Group Research And Development Ltd. Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids
US10619260B2 (en) 2007-09-21 2020-04-14 The Swatch Group Research And Development Ltd. Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids
EP2312021A1 (en) 2009-10-15 2011-04-20 The Swatch Group Research and Development Ltd. Method for obtaining a deposit of a yellow gold alloy by galvanoplasty without using toxic metals
KR101297476B1 (en) * 2009-10-15 2013-08-16 더 스와치 그룹 리서치 앤 디벨롭먼트 엘티디 Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals
US9567684B2 (en) 2009-10-15 2017-02-14 The Swatch Group Research And Development Ltd Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials
DE102012004348A1 (en) * 2012-03-07 2013-09-12 Umicore Galvanotechnik Gmbh Additive for improving the layer thickness distribution in galvanic drum electrolytes
WO2013131784A1 (en) 2012-03-07 2013-09-12 Umicore Galvanotechnik Gmbh Addition for improving the layer thickness distribution in galvanic drum electrolytes
DE102012004348B4 (en) * 2012-03-07 2014-01-09 Umicore Galvanotechnik Gmbh Use of organic thiourea compounds to increase the galvanic deposition rate of gold and gold alloys

Also Published As

Publication number Publication date
CH558836A (en) 1975-02-14
FR2145734A1 (en) 1973-02-23
DE2233783A1 (en) 1973-02-01
CH540344A (en) 1973-08-15
CH529843A (en) 1972-10-31
FR2145734B1 (en) 1976-10-29

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee