EP0246690A1 - Composant pour micro-ondes - Google Patents

Composant pour micro-ondes Download PDF

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Publication number
EP0246690A1
EP0246690A1 EP87200848A EP87200848A EP0246690A1 EP 0246690 A1 EP0246690 A1 EP 0246690A1 EP 87200848 A EP87200848 A EP 87200848A EP 87200848 A EP87200848 A EP 87200848A EP 0246690 A1 EP0246690 A1 EP 0246690A1
Authority
EP
European Patent Office
Prior art keywords
film
substrate
microwave
electrically conductive
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP87200848A
Other languages
German (de)
English (en)
Inventor
Reinhard Dr. Knöchel
Jürgen Köhler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Intellectual Property and Standards GmbH
Koninklijke Philips NV
Original Assignee
Philips Corporate Intellectual Property GmbH
Philips Patentverwaltung GmbH
Philips Gloeilampenfabrieken NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Corporate Intellectual Property GmbH, Philips Patentverwaltung GmbH, Philips Gloeilampenfabrieken NV, Koninklijke Philips Electronics NV filed Critical Philips Corporate Intellectual Property GmbH
Publication of EP0246690A1 publication Critical patent/EP0246690A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna

Definitions

  • the invention relates to a microwave module with an antenna consisting of at least one flat electrically conductive radiating element, which is arranged on a surface of a dielectric substrate, the opposite bearing surface of which is at least partially covered with an electrically conductive layer serving as a ground surface and with a processing and / / or generation of microwave circuit serving antenna signals.
  • identification systems are used to identify the units moving there (e.g. pallets, workpieces), which consist of a microwave module that emits an identification signal that is received by an evaluation unit. The received signals are evaluated in the evaluation unit and the moving unit is controlled as a function thereof.
  • a microwave module contains an antenna and a microwave circuit which reads the identification signals to be sent from a memory and forwards them to the antenna.
  • the antenna of such a microwave module contains a substrate which is connected to a metallized base plate. On the opposite of the base plate The radiator element lies on the surface.
  • the thickness of the substrate depends on the desired intensity of the electromagnetic wave to be emitted and on the required frequency bandwidth.
  • the microwave circuit of the microwave module is implemented with stripline elements and electronic components. In practice, you want to make the microwave circuit as small as possible. Therefore, striplines with small widths are used, which are applied to a dielectric carrier material, the thickness of which is much smaller than the thickness of the substrate. This also reduces the dispersion of the electromagnetic wave in the microwave circuit.
  • the connection between the antenna and the microwave circuit is realized in the previously known components by contact pins which lead through the antenna substrate and connect the radiator element to the microwave circuit. Various soldering processes are still required.
  • the object of the invention is to produce a microwave module of the type mentioned in the introduction more simply and to implement it with smaller dimensions.
  • the object is achieved in that a dielectric flexible film is placed around the substrate, on which the radiator element is applied, on the inner surface of which the electrically conductive layer serving as the ground surface is applied and on the outer surface of which the microwave circuit opposite the ground surface is arranged is connected to the antenna via a feed line.
  • the thickness of the flexible film is determined by the width of the strips line determined, while the thickness of the substrate is determined by specifying the required frequency bandwidth and radiation intensity of the electromagnetic wave.
  • the ground plane is the reference potential for the antenna and the microwave circuit.
  • the electrically conductive layers used here can be formed from metal layers.
  • the radiating element and the feed line are applied to the outer surface of the film.
  • the previously customary step of carrying out the connection between the antenna and the microwave circuit using contact pins is eliminated, since the connection is also applied to the flexible film during the production of the metallized layer.
  • a simple construction of the microwave module is obtained if the mass area is congruent with the support surface of the substrate.
  • the microwave circuit which can consist of a circuit using stripline technology and concentrated components, is arranged on the outer surface of the dielectric film.
  • Concentrated components are e.g. Diodes, transistors, memories, resistors, capacitors etc.
  • the passive circuit functions e.g. couplings, phase shifts
  • the connections are carried out in stripline technology.
  • the process for producing a microwave module according to the invention can be carried out as follows: First, the required electrically conductive layers are applied to the dielectric film. This can be done, for example, by Photolithography or by thick film processes can be realized.
  • the processed film is e.g. attached to the dielectric substrate by gluing. Finally, the concentrated components are placed on the microwave module.
  • Fig. 1 shows the schematic structure of an embodiment of the microwave module according to the invention.
  • the microwave module contains a plate-shaped dielectric substrate 1.
  • a dielectric film 2 with a thickness d2 and an electrically conductive layer is placed around the substrate 1, which is firmly connected to the substrate 1 and which rests at least on two opposite surfaces of the substrate.
  • the substrate and the film are chosen so that they have a dielectric constant of 2 to 5.
  • the substrate can consist, for example, of an epoxy resin, a fluorine-containing polymer and the film of a polyimide.
  • the electrically conductive layer is usually a metal layer, for example a copper layer.
  • the distance between the two opposite surfaces of the substrate 1 is dl.
  • the surfaces of the substrate 1 should be in following on the one hand as the antenna surface and on the other hand as the support surface and the surface of the film which is firmly connected to the substrate are referred to as the inner surface and the opposite surface as the outer surface.
  • a radiator element 3 made of a metal layer and formed in a flat manner is applied.
  • a metal layer is applied, which serves as a ground surface.
  • a microwave circuit comprising strip lines and concentrated components is built up on the outer surface of the film 2, which lies opposite the mass surface. The required passive circuit functions and the connections between the concentrated components are realized with the strip lines. Concentrated components can e.g. Semiconductors, memories and other components.
  • the microwave circuit processes or generates signals which are received or transmitted by the antenna formed from the radiator element 3, part of the film 2, the substrate 1 and the ground plane.
  • the thickness d1 of the substrate 1 depends on the required radiation intensity of the electromagnetic wave. This value can e.g. 3 mm at 2.45 GHz.
  • the thickness d2 of the film 2 is determined according to the requirements of the strip line. For the example mentioned above, a film with a thickness of 0.1 to 0.2 mm could be used if the strip line width was designed accordingly.
  • a feed line 4 is used, which is applied to the outer surface of the film 2 as a strip conductor.
  • the radiator element 3, the ground surface and the strip conductor tracks are formed on the flexible dielectric film by applying metal layers.
  • the circuit pattern of the ground plane, radiator element and stripline can e.g. be produced by photolithography processes or by processes in thick film technology. In thick-film technology, a metal powder paste is applied to the film and then heated. Circuit structures can be produced with the help of photo-etching technology or they can be printed on with the conductor paste using screen printing technology through a fine-mesh fabric using masks.
  • the inner surface of this film with the ground surface 5 can be seen on the flexible film 2 shown in FIG. 2.
  • the stripline structures and the connection 4 between the microwave circuit and the radiator element 3 are shown on the outside.
  • the radiator element 3 and the feed line 4 applied to the outer surface of the film 2 are shown in broken lines.
  • temperature compensation of the center frequency of the antenna can be carried out by the substrate being composed of two layers, which have the same or different dielectric constants and temperature coefficients acting in opposite directions.

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  • Waveguide Aerials (AREA)
  • Details Of Aerials (AREA)
  • Waveguides (AREA)
EP87200848A 1986-05-17 1987-05-11 Composant pour micro-ondes Withdrawn EP0246690A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3616723 1986-05-17
DE19863616723 DE3616723A1 (de) 1986-05-17 1986-05-17 Mikrowellenbaustein

Publications (1)

Publication Number Publication Date
EP0246690A1 true EP0246690A1 (fr) 1987-11-25

Family

ID=6301083

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87200848A Withdrawn EP0246690A1 (fr) 1986-05-17 1987-05-11 Composant pour micro-ondes

Country Status (4)

Country Link
US (1) US4806941A (fr)
EP (1) EP0246690A1 (fr)
JP (1) JPS62274802A (fr)
DE (1) DE3616723A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0634808A1 (fr) * 1993-07-13 1995-01-18 Ball Corporation Antenne à microbande surélevée
EP0651458A1 (fr) * 1993-10-28 1995-05-03 France Telecom Antenne plane et procédé de réalisation d'une telle antenne
FR2724772A1 (fr) * 1994-09-15 1996-03-22 Motorola Inc Antenne en ruban a positions multiples et methode de realisation de celle-ci
WO2004066444A1 (fr) * 2003-01-22 2004-08-05 Siemens Aktiengesellschaft Carreau pour un reseau d'antennes

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5155493A (en) * 1990-08-28 1992-10-13 The United States Of America As Represented By The Secretary Of The Air Force Tape type microstrip patch antenna
CA2089894A1 (fr) * 1991-06-20 1992-12-21 Apisak Ittipiboon Antenne active a microrubans integres
JPH06314923A (ja) * 1993-04-19 1994-11-08 Wireless Access Inc 小型二重リングマイクロストリップアンテナ
DE69422327T2 (de) * 1993-04-23 2000-07-27 Murata Manufacturing Co Oberflächenmontierbare Antenneneinheit
JP3185513B2 (ja) * 1994-02-07 2001-07-11 株式会社村田製作所 表面実装型アンテナ及びその実装方法
EP0687030B1 (fr) * 1994-05-10 2001-09-26 Murata Manufacturing Co., Ltd. Unité d'antenne
US5675345A (en) * 1995-11-21 1997-10-07 Raytheon Company Compact antenna with folded substrate
US6362785B1 (en) * 1999-10-29 2002-03-26 The United States Of America As Repesented By The Secretary Of The Army Compact cylindrical microstrip antenna
US6232923B1 (en) * 1999-11-11 2001-05-15 Lucent Technologies Inc. Patch antenna construction
US6424313B1 (en) * 2000-08-29 2002-07-23 The Boeing Company Three dimensional packaging architecture for phased array antenna elements
US7022251B2 (en) * 2003-06-19 2006-04-04 Agilent Technologies, Inc. Methods for forming a conductor on a dielectric
US6953698B2 (en) * 2003-06-19 2005-10-11 Agilent Technologies, Inc. Methods for making microwave circuits
US20040258841A1 (en) * 2003-06-19 2004-12-23 Casey John F. Methods for depositing a thickfilm dielectric on a substrate
US6900765B2 (en) * 2003-07-23 2005-05-31 The Boeing Company Method and apparatus for forming millimeter wave phased array antenna
US7187342B2 (en) * 2003-12-23 2007-03-06 The Boeing Company Antenna apparatus and method
JP4513971B2 (ja) * 2005-03-28 2010-07-28 ミツミ電機株式会社 アンテナ装置及びアンテナ素子
US7287987B2 (en) * 2005-05-31 2007-10-30 The Boeing Company Electrical connector apparatus and method
US7443354B2 (en) * 2005-08-09 2008-10-28 The Boeing Company Compliant, internally cooled antenna apparatus and method
US20100073258A1 (en) * 2007-03-07 2010-03-25 Konica Minolta Holdings, Inc. Antenna device
WO2009013817A1 (fr) * 2007-07-25 2009-01-29 Fujitsu Limited Marqueur sans fil
US9300032B2 (en) * 2007-10-31 2016-03-29 Tyco Fire & Security Gmbh RFID antenna system and method
US8503941B2 (en) 2008-02-21 2013-08-06 The Boeing Company System and method for optimized unmanned vehicle communication using telemetry
JP5915115B2 (ja) * 2011-11-24 2016-05-11 凸版印刷株式会社 アンテナユニット

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001822A (en) * 1974-05-28 1977-01-04 Rca Corporation Electronic license plate for motor vehicles
FR2527870A1 (fr) * 1982-05-27 1983-12-02 Telemecanique Electrique Carte repondeuse codee, destinee a etre associee a un emetteur-recepteur de micro-ondes en particulier, en vue de l'identification d'objets
WO1983004448A1 (fr) * 1982-06-07 1983-12-22 Reeb Max E Dispositif d'identification en forme d'etiquette pouvant etre appliquee sur un objet et son procede de fabrication

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4445122A (en) * 1981-03-30 1984-04-24 Leuven Research & Development V.Z.W. Broad-band microstrip antenna
US4623893A (en) * 1983-12-06 1986-11-18 State Of Israel, Ministry Of Defense, Rafael Armament & Development Authority Microstrip antenna and antenna array
JPH061848B2 (ja) * 1984-09-17 1994-01-05 松下電器産業株式会社 アンテナ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001822A (en) * 1974-05-28 1977-01-04 Rca Corporation Electronic license plate for motor vehicles
FR2527870A1 (fr) * 1982-05-27 1983-12-02 Telemecanique Electrique Carte repondeuse codee, destinee a etre associee a un emetteur-recepteur de micro-ondes en particulier, en vue de l'identification d'objets
WO1983004448A1 (fr) * 1982-06-07 1983-12-22 Reeb Max E Dispositif d'identification en forme d'etiquette pouvant etre appliquee sur un objet et son procede de fabrication

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0634808A1 (fr) * 1993-07-13 1995-01-18 Ball Corporation Antenne à microbande surélevée
EP0651458A1 (fr) * 1993-10-28 1995-05-03 France Telecom Antenne plane et procédé de réalisation d'une telle antenne
FR2711845A1 (fr) * 1993-10-28 1995-05-05 France Telecom Antenne plane et procédé de réalisation d'une telle antenne.
FR2724772A1 (fr) * 1994-09-15 1996-03-22 Motorola Inc Antenne en ruban a positions multiples et methode de realisation de celle-ci
WO2004066444A1 (fr) * 2003-01-22 2004-08-05 Siemens Aktiengesellschaft Carreau pour un reseau d'antennes

Also Published As

Publication number Publication date
JPS62274802A (ja) 1987-11-28
DE3616723A1 (de) 1987-11-19
US4806941A (en) 1989-02-21

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Inventor name: KOEHLER, JUERGEN

Inventor name: KNOECHEL, REINHARD, DR.