EP0246255A1 - Thermo-rupteur a bilame. - Google Patents

Thermo-rupteur a bilame.

Info

Publication number
EP0246255A1
EP0246255A1 EP86906334A EP86906334A EP0246255A1 EP 0246255 A1 EP0246255 A1 EP 0246255A1 EP 86906334 A EP86906334 A EP 86906334A EP 86906334 A EP86906334 A EP 86906334A EP 0246255 A1 EP0246255 A1 EP 0246255A1
Authority
EP
European Patent Office
Prior art keywords
carrier
bimetallic
contact spring
switch according
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP86906334A
Other languages
German (de)
English (en)
Other versions
EP0246255B2 (fr
EP0246255B1 (fr
Inventor
Manfred K Muller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Limitor AG
Original Assignee
Limitor AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
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Application filed by Limitor AG filed Critical Limitor AG
Publication of EP0246255A1 publication Critical patent/EP0246255A1/fr
Application granted granted Critical
Publication of EP0246255B1 publication Critical patent/EP0246255B1/fr
Publication of EP0246255B2 publication Critical patent/EP0246255B2/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/02—Details
    • H01H37/32—Thermally-sensitive members
    • H01H37/52—Thermally-sensitive members actuated due to deflection of bimetallic element
    • H01H37/54—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/002—Thermally-actuated switches combined with protective means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/02—Details
    • H01H37/32—Thermally-sensitive members
    • H01H37/52—Thermally-sensitive members actuated due to deflection of bimetallic element
    • H01H37/54—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting
    • H01H37/5427—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting encapsulated in sealed miniaturised housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00—Electrothermal relays
    • H01H61/01—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/10—Adaptation for built-in fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/0241—Structural association of a fuse and another component or apparatus
    • H01H2085/0258—Structural association of a fuse or a fuse holder with a bimetallic element

Definitions

  • the invention relates to a bimetallic switch with the features specified in the preamble of claim 1.
  • Such a switch is described in DE-29 16 516 A1. It is a thermal switch, which is arranged on a printed circuit board as a carrier. One or more heating resistors can be provided on the circuit board, with the help of which the thermal switch can operate as a relay or timing relay.
  • the known switch has the disadvantage that the circuit board tends to warp as a result of thermal stress, which means that the thermal switch cannot function properly, at least its switching temperature can be changed.
  • the invention has for its object to provide a bimetallic switch of the type mentioned, which can be manufactured in a very flat design, remains dimensionally stable even under different temperatures and is versatile and adaptable. This object is achieved by a thermobimetal switch with the features specified in claim 1. Advantageous developments of the invention are the subject of the dependent claims.
  • the new Thermobimetal 1 switch uses a thin aluminum oxide ceramic plate, which is also referred to as a wafer in semiconductor technology.
  • a thin aluminum oxide ceramic plate which is also referred to as a wafer in semiconductor technology.
  • the production of such aluminum oxide ceramic plates with exceptional breaking strength is state of the art. Despite their advantages, which are described below, they have so far not been used as carriers for bimetallic circuit breakers.
  • the aluminum oxide ceramic plates used as carriers for the thermobimetal switches can be considerably thinner than the carriers made of injection-molded plastic that have been used frequently for small, open thermal switches, and thinner than printed circuit boards.
  • the carrier used according to the invention has only a relatively low heat capacity, which has a favorable effect on the response speed of the switch.
  • aluminum Oxide ceramic carrier also, and especially in the form of a thin plate, highly heat-resistant: it can be used up to considerably higher temperatures than plastic carrier or printed circuit boards and does not warp.
  • Another advantage is its low thermal expansion coefficient compared to plastics.
  • an aluminum oxide ceramic plate can be produced more dimensionally from the outset than a plastic injection molded part, so that fewer tolerance problems occur when manufacturing a bimetal switch with an aluminum oxide ceramic plate as a carrier.
  • an aluminum oxide ceramic plate can not only be used like a printed circuit board
  • resistors and other active or passive circuit elements up to complete circuits can be integrated into the carrier plate, which means that
  • Switch becomes a compact, inexpensive hybrid component.
  • the aluminum oxide ceramic carrier carries the generic elements of the thermobimetal switch on one side, while it is provided with a resistance layer on its opposite side (the underside) and is thus designed as a thick-film resistor. If the resistance layer is arranged in such a way that it electrically bridges the switch, then such a switch can be used as an overtemperature switch, which does not close again automatically after a predetermined temperature has been exceeded, but remains open because after opening the switch, the current is only exceeded the resistance layer flows, which heats up and generates so much heat and transfers it to the bimetal element that it remains above its switching temperature. In its design according to the invention, such a switch is considerably more compact and less expensive than the switch described in DE-PS 32 31 136, which also remains open after its switching temperature has been exceeded.
  • two can on the underside of the carrier plate Sheet resistors may be provided, one of which is electrically bridging the switch and one is arranged as a series resistor, which is accordingly connected to one of the two electrical connecting parts assigned to the two switching contacts and, on the other hand, to a third electrical connecting part;
  • a switch is distinguished from a comparable switch as described in DE-GM 84 11 838 by a more compact and less expensive structure.
  • more than two film resistors can of course also be formed on the carrier plate.
  • a fuse wire could be arranged in series with the switching contacts on the aluminum oxide ceramic plate.
  • a fuse wire offers additional security in the event that the switch contacts are not separated despite the switching temperature being exceeded, for example because they stick; in such a case the fuse wire heats up to above its melting temperature and. interrupts the circuit.
  • An aluminum oxide ceramic plate is also ideally suited for equipping it with sensors that generate an electrical output signal.
  • the output signal of such a sensor can be used to control a heating resistor provided on the carrier plate, which heats the bimetal element and thereby actuates the switch.
  • thermobimetal switch can be attached to the carrier by drilling holes in the carrier, e.g. by means of a laser beam, and the connecting parts are screwed or riveted to the carrier at the holes drilled in this way.
  • the soldering can be carried out according to inexpensive, automatic processes customary in electronics production, e.g. by passing the carrier plates over a wave pool.
  • the possibility of metallizing an aluminum oxide ceramic plate leads to a further advantage of the invention: namely, the fixed contact can also be formed by selective metallization of the upper side of the carrier, in particular by a printing process.
  • the electrical connection parts can also be used as a carrier for the fixed contact of the switch or as a carrier for one end of the contact spring to be fixed on the carrier.
  • the connection between the fixed contact and the one connection part and between the contact spring and the other connection part can be carried out in the usual way by spot welding, the welding process also being able to take place after the electrical connection parts have been fastened to the carrier plate because of the temperature resistance of the aluminum oxide ceramic.
  • Another, particularly advantageous way of fastening the connecting parts on the carrier is to use the re-flow method. For this purpose, a solder metal is pressed onto the carrier at the intended fastening points, on which the connecting parts, which are best designed for this purpose for a fork, are clamped and then soldered in a soldering furnace.
  • thermobimetal switches Another advantage of the invention is that it is possible to start with larger alumina ceramic plates in the manufacture of the thermobimetal switches, to form a whole number of thermobimetal switches on these plates and to separate the plates along predetermined dividing lines between the thermobimetal switches only in a final manufacturing step.
  • the contact spring itself can be made from a thermobimetal (for use as an overcurrent switch), or a separate bimetal element can be provided for actuating the contact spring.
  • a bimetallic snap disc which is arranged between the contact spring and the carrier.
  • a snap disc is a disc that is curved by embossing and, as a result of its curvature, can assume two oppositely curved, stable shapes, the transition between the two shapes taking place suddenly. To hold and center the bimetallic snap disc, you could on or under the
  • contact spring hooks and tabs that the Hold the bimetallic snap disc on its edge and at least partially grasp it.
  • a plastic pin which is guided through a hole in the bimetal snap-action disc with play and is either attached to the contact spring and projects through a hole in the carrier with play or is fastened to the carrier and with play through a hole in protrudes through the contact spring, this pin expediently having a collar between the contact spring and the bimetallic snap disk, by means of which the two are kept at a distance.
  • the contact spring can be provided with an extension, for example by means of a deep-drawing process which reaches through a hole in the bimetallic snap disk and through a hole in the carrier with play.
  • the best way to prevent heat transfer from the contact spring to the separate bimetal disc is to place the bimetal disc on the side of the carrier facing away from the contact spring.
  • the contact spring and the bimetallic element can be arranged on the same side of the carrier. For many applications, however, it is cheaper to arrange the contact spring on one side and the bimetallic element on the opposite side of the carrier, because then the bimetallic element is protected from thermal influence by the current-carrying contact spring by the intermediate carrier.
  • the necessary operative connection between the bimetallic element and the contact spring is expediently produced by an actuating element which is arranged in a hole in the carrier between the bimetallic element and the contact spring
  • the actuating element could be a plunger, which is guided axially, that is to say movable in the longitudinal direction of the plunger, in an opening in the carrier designed as a bore.
  • This plunger could be attached to the bimetallic element to prevent it from being lost. However, it is cheaper to attach it to the contact spring in order to influence the switching behavior of the bimetal element as little as possible.
  • a further, particularly advantageous possibility is to attach the plunger neither to the contact spring nor to the bimetallic element, but to arrange it loosely between them in a bore in the carrier; Due to the loose arrangement, the heat transfer from the contact spring to the bimetal element via the plunger is reduced to a minimum.
  • it is best to form it at one end with a head whose diameter is larger than the diameter of the hole in the carrier. This head also improves the thermal shielding between the contact spring and the bimetal element.
  • the diameter of the bore in the carrier should not be significantly larger than the diameter of the plunger below its head. This ensures that the plunger is not can slide obliquely past the contact spring out of the bore of the carrier, rather it is always enclosed between the contact spring on one side and the bimetallic element on the other side.
  • thermobimetal switch according to the invention is particularly advantageous, in which the actuating element, which is enclosed between the bimetal element on one side and the contact spring on the other side and is arranged in a hole in the carrier, is a ball, which preferably consists of glass or a ceramic material.
  • a ball which preferably consists of glass or a ceramic material.
  • Such a ball not only has the advantage of being a particularly poor thermal bridge between the contact spring and the bimetallic element, it is also extremely easy to install. By sieving out the balls, it can be ensured in a simple and inexpensive manner that the balls used are only slightly less in diameter decide that these diameter tolerances do not lead to any noticeable scatter in the switching temperature.
  • the carrier made of an aluminum oxide ceramic also contributes significantly to low scattering in the switching temperature, because it can be manufactured to a very good size and does not warp even after prolonged use and frequent changes in temperature, but maintains its shape in a stable manner.
  • the combination of a carrier made of a thin aluminum oxide ceramic plate with a loose ball as the actuating element between the bimetallic element and the contact spring is therefore particularly favorable in order to achieve low scatter in the switching temperatures of thermobimetal I switches in a series, in view of the fact that such switches are produced in large quantities, is an advantage that should not be underestimated.
  • the very thin aluminum oxide ceramic carrier that makes the use of such balls possible and interesting, because the smaller the balls, the greater the advantages; however, the diameter of the balls must be greater than the thickness of the aluminum oxide ceramic carrier. Its thickness is preferably between 1.0 and 1.5 mm; the diameter of the balls is preferably chosen to be twice the thickness of the carrier.
  • Such small balls - especially if they are made of a ceramic or glass - are so light and have one low heat capacity so that they do not affect the switching temperature of the bimetal element.
  • the bimetallic element could be a bimetallic spring soldered on one side to the underside of the carrier, but it is more advantageous to use a bimetallic snap disk instead, which is held by brackets which are attached to the carrier and encompass the edge of the bimetallic element and / or a stop for the edge form the bimetallic element, loose - but captive - is held on the carrier.
  • Suitable holders for the bimetallic snap disc are e.g. on the top of the carrier brackets attached by soldering, which are folded over to the underside of the carrier and there similar to photo corners
  • At least one of the brackets is expediently an integral part of one of the two electrical connection parts of the switch and therefore does not have to be installed separately.
  • a holder which is an integral part of one of the two electrical connection parts, as a further holder such with a pin, with which it is captively inserted into a bore in the carrier, particularly fastened .
  • Be idie ser second bracket can be an injection molded part made of plastic.
  • the bimetallic disc it is also possible for the bimetallic disc to be inserted into the carrier only, particularly by means of it Hold brackets. The brackets must secure the bimetal disc against sliding out in all directions.
  • Another advantage of using a carrier made of a thin aluminum oxide ceramic plate is that both electrical connections of the switch can be arranged at one and the same end of the carrier without difficulty; for this purpose, a conductor track printed on the carrier leads from the fixed contact to that end of the carrier at which the connecting part for the contact spring is also located.
  • thermobimetal switch can be easily provided with an adjustable resistor. You can do that apply a resistance layer on the underside of the carrier, which is connected at one end to one of the electrical connection parts of the switch.
  • a slide for example a spring clip guided on the support itself, can slide over this resistance layer, which slides on the top of the support on a conductor track which leads to a further electrical connection part of the switch.
  • thermobimetal switch according to the invention consists in providing a further aluminum oxide ceramic plate under the carrier, which is connected to the carrier in a sandwich-like manner to form a structural unit. This makes it possible to combine a larger number of electrical components, in particular sheet resistors, with the switch without increasing the base area of the switch, or to provide a resistance layer in the intermediate space between the two aluminum oxide ceramic plates in a well-protected manner.
  • the two aluminum oxide ceramic plates are not arranged one on top of the other, but at a short distance from one another, then one can advantageously arrange a resistance layer on one of the two mutually facing sides of the two plates, which on the one hand forms a potentiometer with one of the fixed to the Plates attached connecting parts and on the other hand is connected to an electrical contact part designed as a slide.
  • the slide and the resistance layer are arranged in a well-protected manner and the slide is guided precisely and can be supported on the resistance layer on the opposite aluminum oxide ceramic plate in order to produce a contact pressure which is always sufficient.
  • the recess can be formed, for example, by providing a through hole in the upper aluminum oxide ceramic plate, which is somewhat larger in the lower region than the diameter of the bimetal snap disk and is narrowed at the upper edge by a collar or inwardly projecting projections so that the bimetal snap disk cannot fall out of the hole upwards. After this Inserting the bimetallic disc into the hole in the upper plate from below covers the hole with the lower aluminum oxide ceramic plate so that the bimetallic snap disc cannot fall out downwards.
  • the lower aluminum oxide ceramic plate can be formed at this point without any recess.
  • a through hole can of course also be arranged in the lower plate, which is narrowed at the lower edge by a collar or inwardly projecting projections.
  • the contact spring is expediently provided with a bump directed against the bimetallic snap disk or with a pin in order to reduce the distance between the bimetal element and the contact spring which has become larger due to the recessed arrangement of the bimetal element.
  • thermobimetal switch in which the bimetallic snap disk is arranged in a recess in the alumina ceramic plates, can be developed particularly advantageously by arranging in this recess between the bimetal element and the contact spring a conventional snap disk, which has a uniform coefficient of thermal expansion, i.e. a snap disk which does not reverse the direction of its curvature due to the effects of temperature.
  • a conventional snap disk which has a uniform coefficient of thermal expansion, i.e. a snap disk which does not reverse the direction of its curvature due to the effects of temperature.
  • Such an ordinary snap disc is inserted into the recess in such a way that its curvature points in the same direction as the curvature of the bimetal snap disc below its switching temperature.
  • thermobimetal switch in side view
  • Fig. 3 shows the same switch in the view of the bottom
  • thermobimetal switch 4 shows a second thermobimetal switch in a partially sectioned side view
  • thermobimetal switch in a partially sectioned side view
  • FIG. 8 shows a top view of the switch from FIG. 8,
  • FIG. 11 shows the switch from FIG. 10 in a top view
  • thermobimetal switch 12 shows a detail in a longitudinal section through the support of the thermobimetal switch, another embodiment of a holder for a bimetallic snap disk, 13 shows the holder from FIG. 12 in a section laid parallel to the support of the switch,
  • thermobimetal switch 14 shows a sixth thermobimetal switch in a partially sectioned side view
  • thermobimetal switch 16 shows a seventh thermobimetal switch in a partially sectioned side view
  • FIG. 17 shows the switch from FIG. 16 in a top view
  • Fig. 18 shows an eighth bimetallic switch in a partially cut
  • Fig. 19 shows a ninth thermobimetal switch in a partially sectioned
  • thermobimetal switches are designated with the same reference numbers.
  • the switch shown in FIGS. 1 to 3 consists of a thin, rectangular carrier 1 made of an aluminum oxide ceramic, which has an elongated hole 2 in the middle.
  • the elongated carrier 1 is metallized at its two ends on the underside 1 a and there are therefore attached two connecting lugs 3 and 4, each of which has a soldering eye 5 at one end and is fork-shaped at its other end.
  • the prongs 6 of the fork which rest against the metallized underside 1a of the carrier are soldered to the carrier 1 in the immersion bath.
  • the prongs 7 of the fork resting on the top of the carrier 1 are not soldered to the carrier 1.
  • a contact spring 8 On one terminal lug 3, one end of a contact spring 8 is welded by spot welding, which carries a contact piece 9 at its free end. Opposite this movable contact piece 9, a fixed contact 10 is welded onto the other connecting lug 4.
  • the contact spring 8 has a hole 11 approximately in the middle, in which a pin 12 made of plastic is held captive.
  • the bolt 12 rests with a head 13 on the top of the contact spring 8 and extends downward through the contact spring. Its shaft is guided through a central hole 14 in the middle of a bimetallic snap disc 15, which is arranged between the carrier 1 and the contact spring 8, and through the elongated hole 2 of the carrier 1. Between the contact spring 8 and the bimetallic snap disc 15, the bolt 12 is provided with an extended collar 16 which, on the one hand, ensures a certain distance and, on the other hand, provides thermal shielding between the contact spring 8 and the bi-snapping mechanism 15.
  • the bimetallic snap disk 15 speaks due to the occurrence of a temperature which is above its switching temperature, then it raises the contact spring 8 and current only flows through the sheet resistor 17, which heats up, consequently heating the bimetal snap disk 15 and preventing it from entering into it Starting position back jumps in which the switch would close.
  • the bimetallic snap disk 15 is hardly influenced by the current heat which is generated in the contact spring 8. This is ensured on the one hand by the shielding by the collar 16, but on the other hand also by the contact of the bimetallic snap disk 15 with the carrier 1, as a result of which heat can flow away from the bimetal element onto the carrier 1.
  • the thermal bimetallic switch shown in FIGS. 4 and 5 differs from that shown in FIGS. 1 to 3 primarily in that the bimetallic snap disk 15 is not arranged on the upper side of the carrier 1 between the carrier and the contact spring 8, but on the The underside of the carrier 1 is held loosely by a holder 20 which is an integral part of the one connecting lug 3 to which the contact spring 8 is also attached.
  • This terminal lug 3 is, like the terminal lug shown in FIG. 1, fork-shaped.
  • the immovable end of the contact spring 8 is under the upper prong 7 of the fork of the connecting lug 3, and both are soldered to the carrier 1.
  • the lower prong 6 of the fork 3 is over the center of the carrier 1 is also extended and shaped into a structure 20 which is similar to a pan, in the bottom of which a large recess 21 is provided which extends almost from edge to edge. At their edges are four upstanding, directed against the underside 1a of the carrier, parallel to the four edges of the carrier 1 side walls 22, 23, 24 and 25, of which the two walls 24 and 25 parallel to the narrow sides of the carrier 1 are the underside Touch 1a of the wearer.
  • the structure 20 serves as a holder for the bimetallic snap disk 15, which is inserted before the connecting lug 3 is attached to the carrier 1.
  • the large recess 21 ensures that the bimetallic snap disk 15 can reach the ambient temperature unhindered.
  • a continuous, cylindrical hole 26 is provided in the middle of the carrier 1, in which a cylindrical plunger 27 with a lenticular head 28 is inserted.
  • the plunger can be a Act on plastic injection molding.
  • the shaft diameter of the plunger should be only a little smaller than the diameter of the hole 26 in order to ensure that the plunger 27 is guided in the hole 26 largely without play.
  • the contact spring extending over the head 28 of the plunger 27 ensures that the plunger. 27 is movable, but is held captive.
  • the shaft length of the butt 27 is dimensioned such that when the temperature of the bimetallic snap disk is below its switching temperature and the bimetallic snap disk is curved downward, as shown in FIG. 4 in solid lines, the tappet 27 does not extend all the way down to the bimetallic snap disk. However, if the temperature of the bimetallic snap disc exceeds its switching temperature, then its curvature reverses, as shown in dashed lines in Fig. 4, and thereby it raises the plunger 27 and this the contact spring 8, so that the contact piece 9 provided at the tip of the Fixed contact 10 is lifted off.
  • thermobimetal switch shown in FIGS. 6 and 7 differs from the switch shown in FIGS. 4 and 5 essentially in the off Formation of the connection lugs and the holder for the bimetallic snap disc.
  • the two connecting lugs 3 and 4 are not fork-shaped, but angled twice at the ends intended for attachment to the carrier 1 to form an approximately C-shaped structure on one side. With this approximately C-shaped structure, the connecting lugs 3 and 4 grip the carrier 1 from the side and are soldered to it.
  • the immovable end of the contact spring 8 is in turn located between the carrier and the bent leg 30 of the terminal lug 3 lying thereon, and the corresponding leg 31 of the opposite terminal lug carries the fixed contact 10.
  • the holder for the bimetallic snap disk 15 is formed only in part by the connecting lug 3, and this is provided with a step-like angled extension 32; Opposite this there is a second through hole 33 in the carrier 1, into which a holding part 34 is inserted from above; it is a pin with a flat head 35 lying on the top of the carrier 1 and a shaft 36 which has a flat recess 37 below the carrier 1, which extends the extension 32 of the connecting lug 3 is facing.
  • the bimetallic snap disc 15 lies at one end in the gap formed between the underside 1a of the carrier and the extension 32 and at the opposite end in the recess 37 of the pin 34.
  • the bracket 34 designed as a pin allows the bimetallic snap disk 15 to be easily installed.
  • the pin can simply be inserted into its hole / 33 and is held captive therein by the contact spring 8 extending over it. However, it is preferably ensured that it is stuck in its hole 33, for example by closely matching its diameter to the diameter of the hole.
  • the thermobimetal switch shown in FIGS. 8 and 9 differs from the switch shown in FIGS. 4 and 5 essentially by the different design of the connecting lugs and the holder of the bimetallic snap disk.
  • the two connecting lugs 3 and 4 are of substantially the same design, essentially the same as the connecting lug 4 in FIGS. 4 and 5. Neither of the two connecting lugs 3 and 4 serves to hold the bimetallic snap disk 15. Rather, two separate holders 40 are provided for this , which are formed in a cone-like manner as the bracket 34 in Fig. 6.
  • the two brackets 40 have a flat head 45, which on the
  • the top of the carrier 1 rests, a shaft 46 with which they extend through their respective hole 43 in the carrier 1, a collar 44, which abuts the underside 1a of the carrier, and a wedge-shaped recess 47 in the shaft 46 below the collar 44.
  • the brackets 40 can be injection-molded parts made of plastic, which are first manufactured without the head 45, inserted into their respective hole 43 from below up to the collar 44 and then by thermoplastic shaping of their upwardly projecting end into a head 45 are captively attached to the carrier 1.
  • the two brackets are arranged so that the two wedge-shaped
  • Recesses 47 are at the same height to accommodate the two opposite edges 49 of the bimetallic snap disc 15, both of which are provided with a recess 48 - corresponding to the recess 38 in FIG. 7 - into which the brackets 40 engage and prevent the bimetal snap disc 15 from being lost .
  • the switch shown in FIG. 8 has a plunger 27 between the bimetallic snap disk 15 and the contact spring 8, which has a cylindrical extension 41 above its head 28, which with some play through a hole in the Contact spring 8 passes through and thereby leads to improved centering.
  • the bimetallic switch shown in FIGS. 10 and 11 has a terminal lug 4 which essentially looks like the terminal lug 4 in FIGS. 1 to 3, and has a terminal lug 3 which looks essentially like that in FIGS. 1 to 3, but additionally has an extension 32 which serves to hold the bimetallic snap disk 15, as shown in FIG. 6 d argestel l te connection lug 3.
  • the switch shown in FIG. 10 has a further peg-shaped holder 54, which is latched into a through hole 33 of the carrier 1 with a longitudinally slotted shaft 56, which is undercut near its one end.
  • the bracket 54 is inserted from below up to a collar 55 in the hole 33.
  • a flat head 57 adjoins the collar 55.
  • the bimetallic snap disk 15 is provided in the area of action of the holder 54 with a recess 38 as in the example in FIGS. 6 and 7, in which the holder 54 engages with the collar 55.
  • bracket 54 in FIG. 10 differs from the holder shown in FIG. 6 in that a semicircular projection facing the bimetallic snap disk 15 and engaging in its recess 38 is provided in the recess 37.
  • Thermobimetal 1 switch is still essential in that the movement of the bimetallic snap disk 15 is transmitted to the contact spring 8 not by a plunger but by a small ball.
  • the ball 58 is located in the cylindrical hole 26 of the carrier, the diameter of which is somewhat larger than the diameter of the ball 58.
  • the diameter of the ball 58 is selected and matched to the position of the contact spring 8 and the bimetallic snap disk 15 such that the ball captive in the cage formed by the bimetallic snap disk, the hole 26 in the carrier and the contact spring 8, both when the switch is closed and when it is open.
  • the diameter of the ball 58 is preferably approximately twice the thickness of the carrier 1.
  • the ball expediently consists of glass or a ceramic material. Such balls can be manufactured very precisely and are easy to use and favor tightly tolerated switching temperatures for switches in a series.
  • thermobi meta ll switch shown in FIGS. 1 4 and 1 5 differs from that in FIG. 1 to 3 shown switch essentially in that its bimetallic snap disk 15 is heated by a fixed resistor 60.
  • the location of this fixed resistor is indicated in Fig. 14 by a circle.
  • the fixed resistor could - as indicated in FIG. 15 - be a wire resistor.
  • the fixed resistor is connected as a series resistor of the switch; Therefore, the electrical current runs from the terminal lug 3 first over the extension 61 lying on the underside 1a of the carrier to one end of the fixed resistor 60, then via the fixed resistor 60 to a conductor track 62 which runs back on the underside 1a of the carrier to that end of the Carrier 1, to which the connecting lug 3 is fastened, is turned over at that end to the upper side of the carrier 1 and extends as a frame-shaped structure 63 along one edge of the carrier 1 first in the direction of the opposite connecting lug 4 and then runs to the opposite longitudinal edge of the carrier 1 and at this back in the direction of the connecting lug 3.
  • the frame-shaped structure 63 is soldered to the carrier 1 and also fixes the contact spring 8, the immovable end of which is between the frame-shaped structure 63 and the carrier 1.
  • the frame-shaped structure 63 is expediently a sheet which is formed in one operation from the same sheet from which the connecting lug 3 is also produced. The latter still owns
  • a tab 64 which rests on the top of the carrier 1, but has no direct connection to the contact spring 8.
  • the tab 64 and the extension 61 together form a fork which is attached to the carrier 1.
  • the interior 65 of the frame-shaped structure 63 is used to hold the ßimetal l snap disc 15, under which there is an opening 66 in the carrier 1, through which the heat generated by the fixed resistor 60 can be transferred to the bimetal snap disc 15. As soon as it reaches its switching temperature through the heating by means of the fixed resistor, it snaps, acts on a downward bulge 67 of the contact spring 8 and lifts it, whereby the switch is opened and at the same time the current flow through the fixed resistor 60 is interrupted.
  • a switch can be used as a time switch, which is predetermined by the heating power
  • the fixed resistor 60 could also be a fuse wire as a fuse against overcurrent.
  • 16 and 17 two mutually identical aluminum oxide ceramic plates 1 and 1 'are sandwiched together to form a structural unit.
  • the An End flag 4 is similar to that shown in Fig. 4 and Fig. 5, but it has a further extension 71, which is inserted into the space between the two plates 1 and 1 '.
  • the other connecting lug 3 does not engage around the plates 1, 1 ', it is only inserted with an extension 70 into the space between the two plates 1, 1'.
  • the two extensions 70, 71 keep the plates 1, 1 'parallel to each other at a short distance. Otherwise, the arrangement of the contact spring 8, the bimetallic snap disk 15 and the plunger 27 connecting them are solved in the same way as in FIG. 4.
  • a slide 77 is also provided, which is designed as a bracket, which is guided displaceably on the longitudinal edges of the lower plate 1 'and is bent around the underside of the lower plate 1' and with its two free ends 78 and 79 in engages the space between the two plates 1 and 1 '.
  • the two free ends 78 and 79 are designed as corrugated contact springs, one of which makes contact with the resistance layer 72 and the other with the resistance layer 73, both being supported on the opposite underside of the upper plate 1.
  • connection lug 3 runs from the connection lug 3 via its extension 70 to the conductor 74, from there to the resistance layer 72, via the slide 77 to the resistance layer 73 and from there via the conductor 75 to the electrical connection part 76, which is part of a bracket 80, which encompasses the two plates 1 and 1 ', is soldered from the upper side of the upper plate 1 with the end of the contact spring 8 to the plate 1 and is located on the underside of the lower plate 1' in a pan-shaped holder 20 for the bimetallic snap disk 15 (as in Fig. 4) continues.
  • This bracket 80 has no direct connection with the connecting lug 3, the extension 70 of which is passed through a window 81 of the bracket 80.
  • the resistance layers 72 and 73 form a series resistor of the switch as in the example according to FIGS. 14 and 15, but the resistance is through this time the slider 77 designed variable.
  • variable resistor As a parallel resistor, it is also possible to design such a variable resistor as a parallel resistor.
  • a hole 82 is provided, which is narrowed at its upper edge by a collar 83 In the recess formed by this hole 82 is - secured by the collar 83 against falling out - a bimetallic snap disk 15, which snaps when its switching temperature is exceeded and the contact spring 8 lifts off.
  • the recess forms the holder for the bimetallic snap disk, and because this is arranged sunk, a bulge 67 is provided in the contact spring 8, which is directed against the bimetal snap disk.
  • thermobimetal switch shown in FIG. 19 differs from that shown in FIG. 18 in that the hole 82 of the upper plate 1 continues into a recess 85 in the lower aluminum oxide ceramic plate 1 ', which, however, is one has a slightly larger diameter and is designed as a blind hole.
  • the bimetallic snap disk 15 now lies in the blind hole 85.
  • an ordinary snap disk 86 which does not consist of a bimetal and therefore does not snap when the temperature changes, but when subjected to mechanical action.
  • the two snap disks 15 and 86 are held in the blind hole 85 in that the overlying hole 82 in the upper plate 1 is somewhat narrower than the underlying blind hole 85.
  • the shape remains until it is reset from the outside, for example by hand.

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Thermally Actuated Switches (AREA)
  • Contacts (AREA)

Abstract

Le thermo-rupteur à bilame ci-décrit comporte un support (1) plat, électriquement isolant, au moins deux pièces de raccordement électrique (3, 4) fixées sur ledit support (1), dont l'une communique avec un contact fixe (10) disposé sur le support (1) et l'autre communique avec une lame de contact (8), laquelle est fixée au support (1) par l'une de ses extrémités et porte à son autre extrémité un plot de contact (9) mobile coopérant avec le contact fixe (10). Le support (1) est une fine plaquette en aluminium/céramique oxydée.
EP86906334A 1985-11-07 1986-11-07 Thermo-rupteur a bilame Expired - Lifetime EP0246255B2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE3539425 1985-11-07
DE19853539425 DE3539425A1 (de) 1985-11-07 1985-11-07 Thermobimetallschalter
PCT/EP1986/000642 WO1987003137A2 (fr) 1985-11-07 1986-11-07 Thermo-rupteur a bilame

Publications (3)

Publication Number Publication Date
EP0246255A1 true EP0246255A1 (fr) 1987-11-25
EP0246255B1 EP0246255B1 (fr) 1994-06-08
EP0246255B2 EP0246255B2 (fr) 2001-08-22

Family

ID=6285332

Family Applications (2)

Application Number Title Priority Date Filing Date
EP86201993A Pending EP0224950A3 (fr) 1985-11-07 1986-11-07 Interrupteur thermostatique à élément bimétallique
EP86906334A Expired - Lifetime EP0246255B2 (fr) 1985-11-07 1986-11-07 Thermo-rupteur a bilame

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP86201993A Pending EP0224950A3 (fr) 1985-11-07 1986-11-07 Interrupteur thermostatique à élément bimétallique

Country Status (6)

Country Link
US (1) US4847587A (fr)
EP (2) EP0224950A3 (fr)
JP (1) JPS63501833A (fr)
DE (3) DE3539425A1 (fr)
ES (1) ES2059310T5 (fr)
WO (1) WO1987003137A2 (fr)

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DE3843950C1 (en) * 1988-12-24 1990-03-29 Inter Control Hermann Koehler Elektrik Gmbh & Co Kg, 8500 Nuernberg, De Thermally controllable switching device
DE9101925U1 (de) 1991-02-19 1991-09-19 Limitor GmbH, 7530 Pforzheim Elektrischer Thermobimetallschalter und Halbzeug zu seiner Herstellung
DE4108725A1 (de) * 1991-03-18 1992-09-24 Inter Control Koehler Hermann Thermische schalteinheit fuer elektrische waermegeraete
JP2585148B2 (ja) * 1991-04-05 1997-02-26 ウチヤ・サーモスタット株式会社 フィルム状発熱体内蔵型サーモスタット
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FR2725082A1 (fr) * 1994-09-22 1996-03-29 Electricite De France Dispositif de limitation de puissance pour installation electrique
JP2948916B2 (ja) * 1994-12-21 1999-09-13 バイエリッシェ モートーレン ウエルケ アクチエンゲゼルシャフト 内燃機関の冷媒循環系用サーモスタット弁
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JP5000540B2 (ja) * 2008-01-31 2012-08-15 新光電気工業株式会社 スイッチング機能付配線基板
DE102013017232A1 (de) 2013-10-17 2015-04-23 Thermik Gerätebau GmbH Temperaturabhängiges Schaltwerk
CN104752098A (zh) * 2015-03-27 2015-07-01 卢润湖 一种用于突跳式温控器的双金属片
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Also Published As

Publication number Publication date
EP0224950A3 (fr) 1987-11-25
US4847587A (en) 1989-07-11
DE8690150U1 (de) 1987-11-19
WO1987003137A3 (fr) 1987-08-13
WO1987003137A2 (fr) 1987-05-21
EP0224950A2 (fr) 1987-06-10
DE3689906D1 (de) 1994-07-14
DE3539425A1 (de) 1987-05-14
EP0246255B2 (fr) 2001-08-22
EP0246255B1 (fr) 1994-06-08
DE3539425C2 (fr) 1989-06-22
JPS63501833A (ja) 1988-07-21
ES2059310T3 (es) 1994-11-16
ES2059310T5 (es) 2002-01-16
JPH0426171B2 (fr) 1992-05-06

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