Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/24—Acids; Salts thereof
  • C08K3/26—Carbonates; Bicarbonates
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
  • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
  • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
  • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
  • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
  • C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
  • C08G73/065—Preparatory processes
  • C08G73/0655—Preparatory processes from polycyanurates
  • C08G73/0661—Preparatory processes from polycyanurates characterised by the catalyst used
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
  • C08G8/28—Chemically modified polycondensates
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00

Definitions

• Encapsulating compositions have previously been prepared from epoxy resins such as phenol-aldehyde epoxy resins, cresol-aldehyde epoxy resins, bisphenol A epoxy resins, and the like. Encapsulating compositions have likewise been prepared from bisphenol A cyanates. However, while these epoxy resins and bisphenol A cyanates result in encapsulating compositions suitable for use in encapsulating electrical and electronic components, it would be desirable if such compositions had an improvement in one or more of its properties.
• the present invention provides an improvement in one or more of the following: moisture resistance, thermal cycling character ⁇ istics and resistance to thermal shock, elevated tempera- ture electrical properties, retention of physical thermal electrical and chemical resistant properties after moisture exposure.
• the present invention concerns encapsu ⁇ lating compositions comprising
• component (A) at least one polyaromatic cyanate; and optionally (B) one or more catalysts to aid in the curing of component (A); characterized by employing as at least a part of com ⁇ ponent (A) at least one hydrocarbon polyaromatic cyanate resin in an amount such that at least 40, preferably from 90 to 100 percent of the cyanate groups present in component (A) are contributed by said hydrocarbon polyaromatic cyanate novolac resin.
• the present invention concerns an encapsulating composition which comprises in addition to components (A) and (B), a filler material (C) wherein
• component (i) is the product resulting from cyanating (1) a hydrocarbon novolac resin, (2) a halogenated hydrocarbon novolac resin, (3) a combination of (1) and (2) or (4) a combination of (1), (2) or (3) and a phenol-aldehyde cyanate resin, a bisphenol A cyanate resin, a halogenated phenol-aldehyde cyanate resin, a halogenated bisphenol A cyanate resin or a combination thereof;
• component (B) is a cobalt salt;
• component (C) is present in an amount of from 50 to 80 percent by weight of the combined weigh of components (A),.
• hydrocarbon polyaromatic cyanate resin or halogenated hydrocarbon poly ⁇ aromatic cyanate resin is present in an amount such that from 90 to 100 percent of the cyanate groups present in com ⁇ ponent (A) are contributed by said hydrocarbon polyaromatic cyanate or halogenated hydrocarbon polyaromatic cyanate resins or a combination of such resins.
• this inven ⁇ tion concerns an encapsulating composition
• component (A) contains the product resulting from cyanating the product resulting from reacting phenol, cresol or a combination thereof with an unsat- urated hydrocarbon containing an average of from 6 to 55 carbon atoms per molecule or halogenated derivatives of such reaction products, or mixture of such hydrocarbons or halogenated derivatives thereof
• component (B) is cobalt naphthenate, cobalt acetylacetonate or cobalt octo- ate
• component (B) is cobalt naphthenate, cobalt acetylacetonate or cobalt octo- ate
• component (C) is silica flour.
• this invention concerns an encapsulating composition wherein (i) component (A) contains (a) the product resulting from cya ⁇ nating the reaction product of phenol, cresol or a combination thereof with a composition com ⁇ prising from 70 to 100 percent by weight of dicyclopentadiene, from zero to 30 percent by weight of
• C 9 -C 12 dimers of C -C 6 dienes from zero to 7 percent by weight of oligomers of C -C 6 unsaturated hydrocarbons and the balance, if any, to provide 100 percent by weight of C 4 -C 6 alkanes, alkenes or dienes; (b) halogenated derivatives of the product of component (a); or (c) combinations of components (a) and
• component (B) is cobalt naphthenate
• component (C) is silica flour
• this invention concerns an electrical and/or electronic component encapsulated with the above encapsulating composition.
• the hydrocarbon polyaromatic cyanate resins employed in the present invention can be prepared by reacting cyanogen chloride or cyanogen bromide in a suitable solvent such as a chlorinated hydrocarbon with a hydrocarbon novolac resin dissolved in a suitable solvent in the presence of a tertiary araine at a tem ⁇ perature of 0°C or below.
• the cyanogen chloride can be prepared insit by reacting a solution of chlorine in a chlorinated hydrocarbon with an aqueous solution of an alkali metal cyanate at a temperature of 0°C or below, separating the chlorinated hydrocarbon in which the cyanogen chloride is dissolved from the aqueous layer in which the alkali metal chloride is dissolved.
• the cyanogen chloride containing chlori- nated hydrocarbon can then be employed in the above reaction.
• Suitable hydrocarbon polyphenolic resins which can be reacted with cyanogen chloride or cyanogen bromide to form the hydrocarbon polyaromatic cyanate resins employed herein include those disclosed by -Vegter et al in U.S. Patent 3,536,734, by Nelson in - U.S. Patent 4,390,680 and Nelson et al in U.S. Patent 4,394,497.
• Particularly suitable hydrocarbon novolac resins include the reaction product of an aromatic hydroxyl-containing compound with an unsaturated hydro ⁇ carbon having from 4 to 55 carbon atoms.
• Suitable aromatic hydroxyl-containing com ⁇ pounds which can be employed include any such compounds which contain one or two aromatic rings, at least one phenolic hydroxyl group and at least one ortho or para ring position with respect to a hydroxyl group available for alkylation. They may also contain substituent hydrocarbon or halogen groups if desired.
• aromatic hydroxyl- -containing compounds which can be employed include, for example, phenol, chlorophenol, bromophenol, methyl- phenol, hydroquinone, catechol, resorcinol, guaiacol, pyrogallol, phloroglucinol, isopropylphenol, ethyl- ..
• phenol propylphenol, t-butylphenol, isobutylphenol, octylphenol, ' nonylphenol, cumylphenol, p-phenylphenol, o-phenylphenol, m-phenylphenol, bisphenol A, tetra- bromobisphenol A, dihydroxydiphenyl sulfone, and mix ⁇ tures thereof.
• Suitable unsaturated hydrocarbons which, either in a crude or purified state, can be employed include, for example, butadiene, isoprene, piperylene, cyclopentadiene, cyclopentene, 2-methylbutene-2, cyclo- hexene, cyclohexadiene, methyl cyclopentadiene, dicyclo ⁇ pentadiene, limonene, dipentene, linear and cyclic dimers of piperylene, methyl dicyclopentadiene, dimethyl dicyclopentadiene, norbornene, norbornadiene, ethylidine norbornene, and mixtures thereof.
• suitable unsat ⁇ urated hydrocarbons include the other dimers, codimers, oligomers and cooligomers of the aforementioned unsat- urated hydrocarbons.
• Particularly suitable unsaturated hydrocarbons which can be employed herein include, for example, a dicyclopentadiene concentrate containing from 70 to 100 percent by weight of dicyclopentadiene; from 0 to 30 percent by weight of C 9 -C 12 dimers or codimers of C 4 -C 6 dienes such as, for example, cyclo- pentadiene-isoprene, cyclopentadienepiperylene, cyclo- pentadiene-methyl cyclopentadiene, and/or dimers of isoprene, piperylene, methyl cyclopentadiene and the like; from zero to 7 percent by weight of C 14 -C 18 trimers of C 4 -C 6 dienes and from zero to 10 percent by weight of aliphatic diolefins such as, for example
• particularly suitable unsaturated hydrocarbons which can be employed herein include a crude piperylene or isoprene stream containing from -30 to 70 percent by weight piperylene or isoprene, zero to ten percent by weight C 9 -C 12 dimers and codimers of C 4 -C 6 dienes, and the balance to provide 100 percent C 4 -C 6 alkanes, alkenes and dienes.
• hydrocarbon oligomers prepared by polymerization of the reactive components in the above hydrocarbon streams e.g., dicyclopentadiene concentrate, crude dicyclopentadiene, crude piperylene or isoprene, individually or in com ⁇ bination with one another or in combination with high purity diene streams.
• Suitable aromatic polycyanate resins which can be employed herein in combination with the hydro- carbon polyaromatic cyanate resins include, the cyanate derivatives of di- or polyhydroxyl compounds such as, for example, resorcinol, catechol, hydroquinone, bis ⁇ phenol A, bisphenol F, bisphenol S, phenol or substi ⁇ tuted phenol/aldehyde resins, tetrabromobisphenol A, and other halogenated phenolic compounds, and com ⁇ binations thereof.
• Suitable catalysts which can be employed to cure the polycyanate resins include acids, bases, salts, nitrogen and phosphorus compounds.
• catalysts include, for example, Lewis acids such as A1C1 3 , BF 3 , FeCl 3 , TiCl 4 , ZnCl 2 , SnCl 4 ; proton acids such as HC1, H 3 P0 4 ; aromatic hydroxy compounds such as phenol, p-nitrophenol, pyrocatechol, dihydroxy naphthalene, sodium hydroxide, sodium methylate, sodium phenolate, trimethylamine, triethylamine, tributyl- amine, diazobicyclo(2,2,2)octane, quinoline, isoquino- line, tetrahydroisoquinoline, tetraethyl ammonium chloride, pyridine-N-oxide, tributylphosphine, phos- pholine- ⁇ 3 -l-oxa-l-phenyl, zinc octoate, tin octoate, zinc naphthenate and mixtures thereof.
• Lewis acids
• catalysts include, for example, cobalt naphthenate, cobalt acetylace onate, cobalt octoate, cobalt chloride, 1,4-diazobicyclo- (2,2,2)octane, and combinations thereof.
• filler materials in the encapsulating compositions of the present invention.
• suitable filler materials include, for example, finely divided silica flour, quartz, calcium silicate, barium sulfate, hydrated alumina. Filler selection will have varying effects on moisture permeation through the molded or encapsulated piece since they make up between 50 and 80 percent by weight of the complete composition.
• mold release agents can be . employed in the transfer molding compositions of the present invention.
• Suitable such mold release agents include, for example, stearates such as glycerol mono- stearate, calcium stearate or waxes such as Montan wax or carnauba wax, and combinations thereof.
• the encapsulating compositions of the present invention are suitable for use in encapsulating elec ⁇ trical and electronic devices and the like. They are particularly suitable for use in encapsulation of micro circuitry typically found in discrete device and inte- grated circuits.
• composition of the present invention can also contain fire retardant additives and coupling agents.
• the aqueous phase was removed and the organic phase was washed with one 250 ml portion of 0.2N HCl and two 250 ml portions of H 2 0 prior to drying over MgS0 4 . After filtering, the 0 CH 2 C1 2 was removed on a rotating evaporator.
• an unfilled molding composition was prepared by blending 400 g of a cresol epoxy novolac resin having an epoxide equivalent weight of 216 and an average functionality of 5.5 with 92.6 g of methylene dianiline. This mixture was poured into a mold as described in Example 1-B and cured for 16 hours (57,600 s) at 55°C, 2 hours (7200 s) at 125°C and 2 hours (7200 s) at 175°C. The results are given in the following Tables I, II, III and IV.
• Example 1 1.26 Comp. Expt. A 2.73 Corap. Expt. B 1.90 Comp. Expt. C 2.81
• samples were exposed by submersion in water at 80°C. The exposure times were in excess of 1000 hours (3,600,000 s) allowing all samples to reach an equi ⁇ librium moisture gain.

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• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• General Chemical & Material Sciences (AREA)
• Physics & Mathematics (AREA)
• Spectroscopy & Molecular Physics (AREA)
• Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
• Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
• Compositions Of Macromolecular Compounds (AREA)
• Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

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• 1986
  • 1986-09-19 EP EP19860906123 patent/EP0237562A4/fr not_active Withdrawn
  • 1986-09-19 AU AU64078/86A patent/AU6407886A/en not_active Abandoned
  • 1986-09-19 JP JP61505257A patent/JPS62501977A/ja active Granted
  • 1986-09-19 KR KR1019870700438A patent/KR900006275B1/ko not_active IP Right Cessation
  • 1986-09-19 WO PCT/US1986/001960 patent/WO1987001712A1/fr not_active Application Discontinuation
  • 1986-09-22 ES ES8602083A patent/ES2002366A6/es not_active Expired
  • 1986-09-23 NZ NZ217671A patent/NZ217671A/xx unknown

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