EP0195332A3 - Printed circuits - Google Patents

Printed circuits Download PDF

Info

Publication number
EP0195332A3
EP0195332A3 EP86103104A EP86103104A EP0195332A3 EP 0195332 A3 EP0195332 A3 EP 0195332A3 EP 86103104 A EP86103104 A EP 86103104A EP 86103104 A EP86103104 A EP 86103104A EP 0195332 A3 EP0195332 A3 EP 0195332A3
Authority
EP
European Patent Office
Prior art keywords
mean pore
manner
printed circuits
activation
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP86103104A
Other languages
English (en)
Other versions
EP0195332B1 (de
EP0195332A2 (de
Inventor
Kirkor Dr. Sirinyan
Gerhard Dieter Dr. Wolf
Ulrich Dr. Von Gizycki
Rudolf Dr. Merten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer AG
Original Assignee
Bayer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer AG filed Critical Bayer AG
Priority to AT86103104T priority Critical patent/ATE44345T1/de
Publication of EP0195332A2 publication Critical patent/EP0195332A2/de
Publication of EP0195332A3 publication Critical patent/EP0195332A3/de
Application granted granted Critical
Publication of EP0195332B1 publication Critical patent/EP0195332B1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Amplifiers (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
EP86103104A 1985-03-21 1986-03-08 Elektrische Leiterplatten Expired EP0195332B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT86103104T ATE44345T1 (de) 1985-03-21 1986-03-08 Elektrische leiterplatten.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19853510202 DE3510202A1 (de) 1985-03-21 1985-03-21 Elektrische leiterplatten
DE3510202 1985-03-21

Publications (3)

Publication Number Publication Date
EP0195332A2 EP0195332A2 (de) 1986-09-24
EP0195332A3 true EP0195332A3 (en) 1987-08-05
EP0195332B1 EP0195332B1 (de) 1989-06-28

Family

ID=6265887

Family Applications (1)

Application Number Title Priority Date Filing Date
EP86103104A Expired EP0195332B1 (de) 1985-03-21 1986-03-08 Elektrische Leiterplatten

Country Status (6)

Country Link
US (1) US4728560A (de)
EP (1) EP0195332B1 (de)
JP (1) JPS61219195A (de)
AT (1) ATE44345T1 (de)
CA (1) CA1249187A (de)
DE (2) DE3510202A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3800682A1 (de) * 1988-01-13 1989-07-27 Bayer Ag Verfahren zur herstellung von elektrischen leiterplatten
DE3939676C2 (de) * 1989-11-28 1994-01-27 Schering Ag Metallisierung von Nichtleitern
JP2768390B2 (ja) * 1990-12-11 1998-06-25 インターナショナル・ビジネス・マシーンズ・コーポレイション 無電解金属付着のために基体をコンディショニングする方法
TW256929B (de) * 1993-12-29 1995-09-11 Hirama Rika Kenkyusho Kk
US5542461A (en) * 1994-09-08 1996-08-06 Teh Yor Industrial Co., Ltd. Safety tassel for pull cords
US5683758A (en) * 1995-12-18 1997-11-04 Lucent Technologies Inc. Method of forming vias
DE69808225T2 (de) * 1997-11-27 2003-02-20 Kanto Kasei Co Beschichtete nicht-leitende Erzeugnisse und Verfahren zur Herstellung
CN112592554B (zh) * 2020-12-15 2022-11-29 广东生益科技股份有限公司 一种电路材料和印刷电路板
CN115785542B (zh) * 2022-12-15 2024-04-30 广东生益科技股份有限公司 一种树脂组合物、电路材料及其制备方法和应用

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1496748A1 (de) * 1964-02-28 1969-07-17 Clevite Corp Kupferkoerper mit bearbeiteter Oberflaeche und Verfahren zum Behandeln der Oberflaeche
US3560257A (en) * 1967-01-03 1971-02-02 Kollmorgen Photocircuits Metallization of insulating substrates
DE2320099A1 (de) * 1972-04-21 1973-10-25 Japan Circuit Ind Co Ltd Verfahren zur herstellung eines kunststoffsubstrates mit aufgerauhter oberflaeche
GB1337338A (en) * 1971-06-19 1973-11-14 Macdermid Inc Process for making printed circuit boards and products obtained by said process
EP0053279A1 (de) * 1980-12-01 1982-06-09 International Business Machines Corporation Verfahren zur Herstellung einer gedruckten Schaltung
EP0081129A1 (de) * 1981-12-05 1983-06-15 Bayer Ag Verfahren zur Aktivierung von Substratoberflächen für die stromlose Metallisierung

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3220897A (en) * 1961-02-13 1965-11-30 Esther S Conley Conducting element and method
US3328275A (en) * 1963-12-18 1967-06-27 Revere Copper & Brass Inc Treatment of copper to form a dendritic surface
BE621510A (de) * 1964-10-29
DE2116389C3 (de) * 1971-03-30 1980-04-03 Schering Ag, 1000 Berlin Und 4619 Bergkamen Lösung zur Aktivierung von Oberflächen für die Metallisierung
JPS4825865A (de) * 1971-08-10 1973-04-04
JPS5919100B2 (ja) * 1974-08-14 1984-05-02 カブシキガイシヤ サンワケミカル ３，５−ジアミノ−１，２，４−トリアゾ−ル硫酸塩の製造法
JPS525068A (en) * 1975-06-30 1977-01-14 Kiju Kawada Positioner in metal plate machining unit
JPS5418875A (en) * 1977-07-12 1979-02-13 Nippon Denki Kagaku Co Ltd Pretreatment for nonnelectrolytic copper plating on epoxyresin substrate
JPS54145379A (en) * 1978-05-02 1979-11-13 Asahi Chem Ind Co Ltd Aromatic polysulfone hollow fiber semipermeable membrane
EP0023389B1 (de) * 1979-07-27 1984-11-14 Imperial Chemical Industries Plc Metallisierte Filme und Verfahren zu ihrer Herstellung
JPS56169067A (en) * 1980-05-30 1981-12-25 Matsushita Electric Works Ltd Manufacture of coarse surface film
DE3202484A1 (de) * 1982-01-27 1983-08-04 Bayer Ag, 5090 Leverkusen Metallisierte halbleiter und verfahren zu ihrer herstellung
DE3215413A1 (de) * 1982-04-24 1983-10-27 Bayer Ag, 5090 Leverkusen Metallisierte polymergranulate, ihre herstellung und verwendung
JPS5968104A (ja) * 1982-10-09 1984-04-18 清水　紀夫 アデイテイブ回路基板
DE3248778A1 (de) * 1982-12-31 1984-07-12 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung metallisierter poroeser festkoerper

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1496748A1 (de) * 1964-02-28 1969-07-17 Clevite Corp Kupferkoerper mit bearbeiteter Oberflaeche und Verfahren zum Behandeln der Oberflaeche
US3560257A (en) * 1967-01-03 1971-02-02 Kollmorgen Photocircuits Metallization of insulating substrates
GB1337338A (en) * 1971-06-19 1973-11-14 Macdermid Inc Process for making printed circuit boards and products obtained by said process
DE2320099A1 (de) * 1972-04-21 1973-10-25 Japan Circuit Ind Co Ltd Verfahren zur herstellung eines kunststoffsubstrates mit aufgerauhter oberflaeche
EP0053279A1 (de) * 1980-12-01 1982-06-09 International Business Machines Corporation Verfahren zur Herstellung einer gedruckten Schaltung
EP0081129A1 (de) * 1981-12-05 1983-06-15 Bayer Ag Verfahren zur Aktivierung von Substratoberflächen für die stromlose Metallisierung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEW ELECTRONICS, Band 8, Nr. 6, 18 März 1975, Seiten 45,46,48, Juniper Journals Ltd., London, GB; M.J.AGGLETON et al.: "Semi- and fully- additive printed circuitry" *

Also Published As

Publication number Publication date
EP0195332B1 (de) 1989-06-28
EP0195332A2 (de) 1986-09-24
JPS61219195A (ja) 1986-09-29
CA1249187A (en) 1989-01-24
DE3664183D1 (en) 1989-08-03
ATE44345T1 (de) 1989-07-15
DE3510202A1 (de) 1986-09-25
US4728560A (en) 1988-03-01

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