DE69201823D1 - Verbesserte Gleichförmigkeit beim Kupferätzen bei der Herstellung von mehrschichtig gedruckten Schaltungsplatinen. - Google Patents
Verbesserte Gleichförmigkeit beim Kupferätzen bei der Herstellung von mehrschichtig gedruckten Schaltungsplatinen.Info
- Publication number
- DE69201823D1 DE69201823D1 DE69201823T DE69201823T DE69201823D1 DE 69201823 D1 DE69201823 D1 DE 69201823D1 DE 69201823 T DE69201823 T DE 69201823T DE 69201823 T DE69201823 T DE 69201823T DE 69201823 D1 DE69201823 D1 DE 69201823D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- printed circuit
- circuit boards
- multilayer printed
- etch uniformity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/709,050 US5127991A (en) | 1991-06-03 | 1991-06-03 | Uniformity of copper etching in the fabrication of multilayer printed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69201823D1 true DE69201823D1 (de) | 1995-05-04 |
DE69201823T2 DE69201823T2 (de) | 1995-10-12 |
Family
ID=24848281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69201823T Expired - Fee Related DE69201823T2 (de) | 1991-06-03 | 1992-05-29 | Verbesserte Gleichförmigkeit beim Kupferätzen bei der Herstellung von mehrschichtig gedruckten Schaltungsplatinen. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5127991A (de) |
EP (1) | EP0517445B1 (de) |
JP (1) | JPH07114311B2 (de) |
KR (1) | KR960014473B1 (de) |
CA (1) | CA2066947C (de) |
DE (1) | DE69201823T2 (de) |
TW (1) | TW205613B (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5468409A (en) * | 1993-11-03 | 1995-11-21 | The Boeing Company | Copper etchant useful for making fine-line copper elements |
US5766496A (en) * | 1996-05-31 | 1998-06-16 | Nisene Technology Group, Inc. | Decapsulator and method for decapsulating plastic encapsulated device |
US5783098A (en) * | 1996-05-31 | 1998-07-21 | Nisene Technology Group | Decapsulator and method for decapsulating plastic encapsulated device |
US5855727A (en) * | 1996-07-12 | 1999-01-05 | Nisene Technology Group | Decapsulator for decapsulating small plastic encapsulated device packages |
KR20030020464A (ko) * | 2001-08-29 | 2003-03-10 | 주식회사 팬택앤큐리텔 | 단차를 갖는 인쇄회기판 |
US6784107B1 (en) | 2003-03-18 | 2004-08-31 | Hui Chen | Method for planarizing a copper interconnect structure |
KR100753393B1 (ko) * | 2005-11-03 | 2007-09-13 | 아이엔지플렉스(주) | 박판적층 연성회로기판 및 그 제조방법 |
JP4967800B2 (ja) * | 2007-05-17 | 2012-07-04 | 凸版印刷株式会社 | 銅溶解液およびそれを用いた銅または銅合金のエッチング方法 |
JP7363618B2 (ja) * | 2019-03-25 | 2023-10-18 | 住友金属鉱山株式会社 | 銅の価数分別定量方法および銅の定量装置 |
CN116641053A (zh) * | 2023-06-21 | 2023-08-25 | 惠州昊化电子材料有限公司 | 一种酸性蚀刻液及其制备方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2307503A1 (de) * | 1973-02-15 | 1974-08-22 | Hunt Chem Corp Philip A | Aetzmittel |
JPS59127692A (ja) * | 1983-01-12 | 1984-07-23 | Kurita Water Ind Ltd | 低発泡性中和剤 |
JPS60203689A (ja) * | 1984-03-29 | 1985-10-15 | Shikoku Chem Corp | 蓄熱材 |
JPS61130389A (ja) * | 1984-11-28 | 1986-06-18 | Nishi Nippon Tsusho Kk | 冷凍機油組成物 |
JPH0246672A (ja) * | 1988-08-05 | 1990-02-16 | Chiyoda Raito Kogyosho:Kk | 装飾電灯用ソケット |
JPH0325995A (ja) * | 1989-06-23 | 1991-02-04 | Mitsubishi Gas Chem Co Inc | 薄銅箔張回路基板の製造法 |
-
1991
- 1991-06-03 US US07/709,050 patent/US5127991A/en not_active Expired - Fee Related
-
1992
- 1992-03-17 TW TW081102010A patent/TW205613B/zh active
- 1992-04-23 CA CA002066947A patent/CA2066947C/en not_active Expired - Fee Related
- 1992-05-29 EP EP92304901A patent/EP0517445B1/de not_active Expired - Lifetime
- 1992-05-29 JP JP4161846A patent/JPH07114311B2/ja not_active Expired - Fee Related
- 1992-05-29 DE DE69201823T patent/DE69201823T2/de not_active Expired - Fee Related
- 1992-06-02 KR KR1019920009528A patent/KR960014473B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH07114311B2 (ja) | 1995-12-06 |
EP0517445A1 (de) | 1992-12-09 |
US5127991A (en) | 1992-07-07 |
CA2066947A1 (en) | 1992-12-04 |
KR930001758A (ko) | 1993-01-16 |
JPH06252530A (ja) | 1994-09-09 |
KR960014473B1 (ko) | 1996-10-15 |
DE69201823T2 (de) | 1995-10-12 |
TW205613B (de) | 1993-05-11 |
CA2066947C (en) | 1997-01-14 |
EP0517445B1 (de) | 1995-03-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |