EP0177316B1 - Verfahren zur Herstellung eines Düsenkörpers für einen Tintenstrahldrucker - Google Patents

Verfahren zur Herstellung eines Düsenkörpers für einen Tintenstrahldrucker Download PDF

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Publication number
EP0177316B1
EP0177316B1 EP85306956A EP85306956A EP0177316B1 EP 0177316 B1 EP0177316 B1 EP 0177316B1 EP 85306956 A EP85306956 A EP 85306956A EP 85306956 A EP85306956 A EP 85306956A EP 0177316 B1 EP0177316 B1 EP 0177316B1
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EP
European Patent Office
Prior art keywords
substrate
nozzle
layer
subjecting
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP85306956A
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English (en)
French (fr)
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EP0177316A2 (de
EP0177316A3 (en
Inventor
Masayoshi Miura
Kenji Akami
Gen Oda
Tamotsu Kojima
Hiroshi Naito
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Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP20340684A external-priority patent/JPS6179668A/ja
Priority claimed from JP16240385A external-priority patent/JPS6221551A/ja
Priority claimed from JP17791185A external-priority patent/JPS6239252A/ja
Priority claimed from JP19629085A external-priority patent/JPS6255154A/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of EP0177316A2 publication Critical patent/EP0177316A2/de
Publication of EP0177316A3 publication Critical patent/EP0177316A3/en
Application granted granted Critical
Publication of EP0177316B1 publication Critical patent/EP0177316B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1606—Coating the nozzle area or the ink chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/02—Air-assisted ejection

Definitions

  • the present invention relates generally to ink jet printers, and more specifically to a method of making a nozzle for an ink jet print head of the type wherein liquid is discharged through axially aligned rear and front channels under the combined effects of electric field and air pressure gradients.
  • An ink jet print head of the type as shown and described in United States Patent 4,403,234 comprises a front nozzle member secured to a housing to define a laminar airflow chamber.
  • the housing is formed with a rear channel axially aligned with a front channel provided in the front nozzle member.
  • the rear channel is connected by an electrically conductive pipe to a liquid supply to create a meniscus at the exit end of the rear channel.
  • the conductive pipe is connected to a signal source to charge the liquid in the rear channel with respect to the front channel so that an electric field gradient is established between the meniscus and the front channel.
  • the airflow chamber is connected to a pressurized air supply to produce an air pressure gradient between the exit ends of the rear and front channels. Owing to the combined effects of the field and pressure gradients, the meniscus is pulled forward and ejected through the front channel to a writing surface.
  • the meniscus is very sensitive to disturbance generated when the print head scans across the writing surface and becomes unstable when it returns to the original shape after efection of a droplet.
  • Patents Abstracts of Japan, Vol. 9, No. 57 shows an ink jet printer of the type concerned in the present application where an air supply is turned sharply prior to passage through an outlet and an electric field is in use applied in the region where the ink drop meniscus is formed.
  • EP-A-109755 is concerned with manufacture of a nozzle for an ink jet printing head using etching techniques.
  • a method for fabricating a nozzle member of an ink jet print head comprising the steps of:
  • the two-step etching process in the process of the invention is advantageous in reducing the time taken to produce the projecting nozzle since it minimizes deviations in nozzle-opening size which might occur as a result of the tendency of the substrate material to erode sideways on a single substrate.
  • the bore at the rear of the nozzle opening can be appropriately dimensioned so that its transverse cross-section is larger than that of the nozzle opening and hence to reduce the resistance it offers to liquid passing therethrough.
  • the print head 1 comprises a front nozzle panel 2 having a front channel 3.
  • the front nozzle plate 2 is formed of insulative material and secured to a rear housing 4 of insulative material.
  • the rear housing is formed with a liquid chamber 5 to hold ink therein supplied from an ink container 6 through electrically conductive pipe 6a.
  • the liquid chamber 5 is defined at the front with a rear nozzle plate 7 having a projecting nozzle 8.
  • a rear channel 9 extends from the liquid chamber 5 through the projecting nozzle 8 in axial alignment with the front channel 3 to allow ink in liquid chamber 5 to lead therethrough to form a meniscus at the extreme end.
  • Front nozzle plate 2 defines with rear nozzle plate 7 a disc-like, laminar airflow chamber 10a of an air chamber 10 and define with rear housing 4 an annular portion 10b.
  • a ring electrode 11 encircling the front channel 3 is secured to the outer surface of front nozzle plate 2.
  • a voltage is applied across electrode 11 and pipe 6a from a signal source 12 to establish an electric field gradient between electrode 11 and the liquid in rear channel 9.
  • a pressurized air supply source 13 is connected by a pipe 14 to the air chamber 10 to generate an airflow in the annular air chamber portion 10b to cause it to spiral in a laminar flow through the disk-like chamber portion 10a to front channel 3 and thence to the outside.
  • the airstream makes a sharp turn at the entry to front channel 3 creating a sharp pressure gradient along a path between the front ends of rear channel 9 and front channel 3.
  • Pressurized air is also supplied through a regulator valve 15 to the ink container 6. Valve 15 is adjusted so that in the absence of a voltage on electrode 11 the liquid pressure in rear channel 9 is statically balanced with the combined forces of air pressure acting on the meniscus and its surface tension.
  • the liquid in rear channel 9 is electrostatically charged and pulled forward under the influence of electric field gradient.
  • the liquid is elongated into a pencil-like shape under the pressure of air ejected through the front channel 3 and ejected to a writing surface.
  • the projecting nozzle 8 has an outer diameter slightly smaller than the diameter of front channel 3 and extends forward from the nozzle plate 7 by a distance B. Airstream is narrowed as it passes through the space between the front and rear channels and creates a dead air region immediately adjacent the front end of rear channel 9.
  • the liquid in rear channel 9 wets the front surface of the nozzle 8 and tends to disperse outward. However, further dispersion of the liquid beyond the outer edge of rear nozzle 8 is prevented by a force exerted thereupon by the airstream moving past that outer edge, causing the liquid to slightly bulge forward.
  • the high pressure in the dead air region causes the meniscus at the front end of rear channel 9 to assume a convexed shape as shown at 8a and stabilizes it against external disturbance.
  • the meniscus When the ring electrode 11 is impressed with a voltage, the meniscus is elongated rapidly, forming a slope portion 8b extending from the outer edge of rear nozzle 8 to a narrow, pencil-like portion 8c, as shown at Fig. 3.
  • the formation of convexed meniscus 8a concentrates the electric field thereon and reduces the minimum voltage required to tear it apart into droplets. Because of the presence of the dead air region, the meniscus quickly returns to the original state after ejection of ink.
  • the front surface of the nozzle 8 may be roughened to present a small angle of wet to liquid to allow the meniscus to easily wet the front surface of nozzle 8.
  • the small wet angle reduces the response time of the print head and increases the amount of liquid to be ejected per unit time.
  • the print head of the present invention operates with a minimum pulse duration which is 1/10 of the minimum pulse duration of the prior art and is immune to vibrations in a range which is ten times greater than the prior art.
  • FIGs. 4A to 4F Various preferred forms of the rear nozzle plate are shown in Figs. 4A to 4F.
  • the variations shown at Figs. 4A to 4D are advantageous to further increase meniscus stability and improve meniscus response characteristic. This is accomplished by increasing the contact area of the rear nozzle front end face with liquid.
  • the rear channel 9 has a front portion passing through nozzle 8 and a rear portion passing through nozzle plate 7.
  • the rear channel 9 has a front portion 9A' having a part-spherical surface and a cylindrical rear portion 9A".
  • the rear channel 9 in Fig. 4B has a frusto-conically shaped front portion 9B' and a rear portion 9B".
  • rear channel 9 in Fig. 4C has a front portion 9C' having a larger transverse cross-sectional area than a rear portion 9C". This increases the amount of liquid to be contained in the nozzle 8.
  • the rear channel 9, Fig. 4D has a front portion 9D' having a staircase cross-section and a cylindrical rear portion 9D", the staircase portion increasing its diameter with distance away from the rear portion 9D".
  • the liquid being ejected forms a large angle of wet contact with the surface of the front portions 9A', 9B' as compared with the embodiment of Fig. 1 and is thus given a greater liquid retaining force with which the meniscus is more stabilized against external vibrations which might otherwise cause it to break.
  • front portions 9C' and 9D' serve as reservoirs to hold a greater amount of liquid therein to increase liquid ejection capability.
  • rear nozzle 8 is formed with an annular groove 80 to entrap liquid which might spill over the edge of the nozzle if an excessive amount of force is externally applied to the print head.
  • the annular groove may be provided around the nozzle 8 as shown at 81 in of Fig. 4F.
  • Illustrated at 21 in Fig. 5A is a photosensitive glass which is composed of a SiO2-Al2O3-Li2O glass containing CeO2 and Ag2O.
  • a photomask 22 having a plurality of ring-shaped opaque portions 22a (only one of which is shown for simplicity) in a transparent area 22b is placed on the upper surface of the glass 21.
  • the photosensitive glass 21 is subject to an imagewise radiation of ultraviolet light through the mask 22 to cause portions 21b underlying the transparent portion 22b to provide the following reaction: Ce3+ + Ag+ + ultraviolet light - Ce4+ + Ag0
  • the glass is then subject to a primary heat treatment so that the silver content of the compound becomes colloidal and then subject to a secondary heat treatment to form crystals Li2O-SiO2 around silver colloids.
  • the Li2O-SiO2 crystals are etched away to a predetermined depth. This leaves an upper portion of the amorphous region to serve as a rear nozzle 21a as shown in Fig. 5B.
  • This etching process is preferably accomplished by applying a layer of hydrofluoric acid resistant material to the lower surface of the glass and submerging it into an aqueous hydrofluoric acid solution.
  • Suitable material for the hydrofluoric acid resistant layer is a paraffin-containing material available from Sou Denshi Kogyo Kabushi Kaisha under the trademark of "Electron Wax”. The wax is applied at a temperature of 70°C and removed by immersing it in a trichloroethylene solution agitated at an ultrasonic frequency.
  • a photoresist layer 24 is coated on the lower surface of the glass 21 and a photomask 25 having a plurality of opaque portions 25a is placed on the photoresist 24 so that opaque portion 25 aligns with corresponding the nozzle 21a.
  • the diameter of the opaque portion 25a is greater than the inner diameter of, but smaller than the outer diameter of, the nozzle 21a.
  • the photoresist is exposed to ultraviolet imagewise radiation through the mask 25.
  • Unexposed portions are etched to form a plurality of holes 24a each being concentrical with the nozzle 21a as shown at Fig. 5D.
  • a hydrofluoric acid resistant layer 26 is then formed over the entire upper surface of the glass 21 so that it fills the space within the projecting nozzle 21a as shown in Fig. 5D.
  • the glass substrate is immersed in an aqueous hydrofluoric acid solution to etch the portions of the glass above the hole 24a to thereby produce a bore 27 extending across the thickness of the glass 21.
  • the photoresist 24 is removed after it is carbonized in a plasma and the layer 26 is removed by immersing the glass in a trichloroethylene solution agitated at an ultrasonic frequency (Fig. 5E).
  • the glass be flooded with ultraviolet light and heat-treated in a manner similar to that described in connection with the step of Fig. 5A to crystallize the amorphous channel portions 21a. This crystallization process causes the whole glass 21 to homogenize as shown at Fig. 5G and increases its mechanical strength. The glass 21 is then cut into individual nozzle plates.
  • nozzle portion 21a and hole 27 are created by etching the glass in opposite directions.
  • the amorphous region of the glass has a tendency to erode at a rate substantially 1/20 of the rate at which the crystalline region erodes
  • the method of the invention keeps the glass 21 from being subject to a prolonged single etching process and thus prevents it from being excessively eroded sideways.
  • the hole 27 has a depth of 130 micrometers.
  • the nozzle 21a has a sufficient rigidity to retain its shape for an extended period of time.
  • the glass-formed nozzle plate 7 has another advantage in that it is chemically resistant to ink and free from swelling.
  • a light-shielding layer 16 is provided between the lower surface of glass 21 and photoresist 24 as shown in Fig. 6.
  • the light-shielding layer 16 is formed by vacuum-evaporating a hydrofluoric acid resistant material such as gold on the glass until it attains a thickness of 1 to 2 micrometers.
  • the photoresist 24 is removed followed by the removal of gold layer 16 using aqua regia.
  • the lower surface of glass 21 is roughened by etching as shown in Fig. 7A.
  • the photoresist layer 24 is applied on the roughened surface (Fig. 7B). Most of the ultraviolet light penetrating the photoresist 24 is reflected at the roughened surface, whereby the light entering the undesired portion of the photoresist 24 is negligible.
  • the roughened surface presents an increase in contact area between the glass 21 and photoresist 24 so that the latter is firmly adhered to glass 21.
  • Figs. 8A to 8F illustrate a further manufacturing process in which the step of Fig. 5A is initially performed to crystallize portions of a glass substrate 41 that surround a cylindical amorphous portion.
  • the step shown at Fig. 8A follows. This step is similar to the step of Fig. 5B with the exception that the etching process is carried out on opposite surfaces of the glass substrate 41 to form a pair of nozzles 41a and 41b. Since the upper nozzle 41a is produced out of the region which is located closer to the photomask than is the lower nozzle 41b, the former has a more sharply defined boundary with the sourrounding area than the latter.
  • Fig. 8A illustrate a further manufacturing process in which the step of Fig. 5A is initially performed to crystallize portions of a glass substrate 41 that surround a cylindical amorphous portion.
  • the step shown at Fig. 8A follows. This step is similar to the step of Fig. 5B with the exception that the etching
  • the upper surface of substrate 41 is entirely coated with a hydrofluoric acid resistant layer 42 so that it fills the space within the nozzle 41a.
  • the lower surface is coated with a layer 43 over areas outside of the lower nozzle 41b.
  • the layer 43 may be formed of the same wax as used in Fig. 5D.
  • the lower nozzle portion 41b has a greater surface roughness on its side wall than on its upper face. The difference in surface roughness prevents the paraffin layer 43 from spreading beyond the upper edge of the nozzle portion 41b.
  • the substrate is then immersed in an aqueous hydrofluoric acid solution of 5% concentration which is maintained at a temperature lower than 34°C to create a hole 41c within the amorphous cylinder that extends between nozzles 41a and 41b (Fig.
  • etching solution tends to permeate through the boundary between the nozzle 41b and surrounding layer 43 to cause erosion to occur along that boundary.
  • the substrate can be etched for a period of 35 minutes at a solution temperature of 20°C to remove a volume to a depth of 170 micrometers with a diameter of about 50 micrometers. Due to sideways erosion, the hole 41c is tapered upward.
  • Layers 42 and 43 are removed in a solution of trichloroethylene agitated at ultrasonic frequency (Fig. 8D).
  • the lower surface of the substrate is lapped to present a flat surface (Fig. 8E).
  • the substrate 41 is then subject to ultraviolet radiation and then heated in the same manner as in Fig. 5G to crystallize the amorphous region (Fig. 8F).
  • the hydrofluoric acid resistant layer 43 may alternatively be formed of epoxy resin adhesive which is a mixture of Epicoat 828 as a principal component and Epicure Z as a curing agent (both being the trademarks of Shell Chemicals).
  • the photosensitive glass substrate 41 is heated to a temperature of 40°C to apply Epicoat 828 to a thickness of 5 micrometers and then allowed to half-cure for a period of 50 hours at room temperature to prevent intrusion of Epicoat into the nozzle 41b. This is followed by a full curing process in which the substrate is maintained at a temperature of 70°C for a period of 60 minutes.
  • the epoxy resin layer 43 can be removed in an oxygen plasma environment. In comparison with the method involving the use of the wax, the epoxy resin layer 43 is favored in terms of its excellent adherence to the underlying glass substrate and strength. Due to the high strength, undesired erosion around the nozzle 41b can be minimized.
  • the ultraviolet imagewise radiation process is performed only on one surface of the photosensitive glass substrate, whereas in the previous methods the radiation process is performed on opposite sides of a substrate.
  • the process of Figs. 8A to 8E eliminates misregistration which might occur between the two photomasks used on opposite sides of the substrate.
  • nozzle opening 41c is precisely aligned with the nozzle opening 41d in the nozzle 41a.
  • the method of the present invention ensures quantity manufacture of nozzle plates with a precisely dimensioned nozzle opening. Furthermore, the second etching process can be effected for a desired length of time to take advantage of the sideway etching tendency of the photosensitive glass substrate so that the transverse cross-section of the rear hole 41c can be made greater than that of the nozzle opening 41d to reduce its flow resistance to liquid.
  • the configuration of the ink meniscus on the projecting nozzle 8 is affected by the electric field distribution, the viscosity of the ink of typically oily material, the transient pressure variations in the projecting nozzle 8 and in the air chamber 10 and the size of the meniscus which is affected by the voltages applied to the electrodes.
  • the ink tends to be deflected out of the intended trajectory as it is discharged from the projecting nozzle 8. This results in a buildup of an ink layer on the walls adjacent to the projecting nozzle 8. Since the ink is conductive, the electric field will be seriously deformed to worsen the out-of-the-path deflection problem.
  • portions of the adjacent walls where the ink particles are likely to hit be rendered ink-repellant. Since the tendency of a material to become wet depends on the roughness of its surface, it is effective to polish a portion 2a of the front nozzle plate 2 surrounding the front channel 3 to a mirror-finish.
  • Figs. 10A to 10C are illustrations of preferred embodiments for eliminating the deflection problem.
  • the inner surface of the front nozzle plate 2 is coated with a thin layer 50 of an ink-repellant material (which is also oil-repellant) such as ethylene tetrafluoride resin which is typically available as Teflon, a trademark of Du Pont, or a fluorine-containing polymer available as a mixture of liquids known under the trademark Fluorad FC-721 and FC-77 of 3M Corporation. Due to the reduced wetness, any amount of ink deposited on layer 50 is expelled to the outside by the air passing over the surface of the layer 50.
  • an ink-repellant material which is also oil-repellant
  • ethylene tetrafluoride resin which is typically available as Teflon, a trademark of Du Pont
  • fluorine-containing polymer available as a mixture of liquids known under the trademark Fluorad FC-721 and FC-77 of 3M Corporation. Due to the reduced wetness,
  • Fig. 10B the fluorine-containing polymer liquid mentioned above is sprayed on the inner surface of the front nozzle member 2 so that an ink-repellant layer 51 is formed on the inner wall of a forwardly tapered front channel 3 as well as on the inner surface of the member 2. Since Fluorad has a surface tension of 11 to 12 dynes/cm, a satisfactory level of repulsiveness can be obtained.
  • an ink-repellant layer 52 formed of a mixture of fluorine-containing diamine and epoxy resin. Specifically, after forming a coat, the mixture is cured by heating it at 150°C for 1 to 5 hours.
  • the same level of repulsiveness as ethylene tetrafluoride can be obtained. Since the outer wall of the projecting nozzle 8 and the area surrounding the foot of the nozzle 8 have a surface roughness greater than that of the front end of the projecting nozzle 8 due to the etching process mentioned previously, the repellant layer 52 can be easily formed excepting the front end of the nozzle. In the embodiment of Fig. 10B, the ink tends to extend to the perimetry of the front end face of the projecting nozzle 8 due to the low wet contact angle with glass with which it is formed. Therefore, a relatively large meniscus 53 will thus be formed. An electrode 54 may be provided on the rear surface of the rear nozzle member 7.
  • An ink-repellant layer 55 may also be formed on the front end face of the projecting nozzle 8 as shown in Fig. 10C. This layer is formed by spraying the fluorine-containing polymer liquid mentioned above. Due to repelling action, the ink is confined within the inner perimetry of the coat on the front end face, a relatively small meniscus 56 will be formed. Because of an increased field concentration on the meniscus 56 a lower threshold voltage is required for dischaging the ink through nozzle 8 than is required with the previous embodiment.
  • Front nozzle member 2 is preferably coated with an ink-repellant layer 57 which extends outwardly to enclose the electrode 11. The front-wall coating is to repel the ink particles which might return to the front member 2 by turbulence caused by the air ejected at high speeds from the channel 3.
  • Ink-repellant material is successfully deposited on the front and rear nozzle plates by means of apparatus shown in Figs. 11A and 11B.
  • a mount 60 includes an annular groove 61 on the upper surface in which a seal 62 is fitted.
  • Mount 60 is formed with a negative pressure chamber 63 which communicates through a pipe 64 to a suction pump 65.
  • Nozzle member 2 or 7 is placed on the mount 60.
  • Seal 62 provides an air-tight sealing contact to allow air to be admitted into the chamber 63 exclusively through the channel 3 (or 9).
  • the speed of the air passing through the channel is controlled by a pressure regulator 66 located in the pipe 64.
  • Ink-repellant material is sprayed by a spray gun 67 to the nozzle member to form an ink-repellant layer 69 thereon. Due to the air flowing in the same direction as the direction of movement of the sprayed particles, the latter is carried by the air and forms a thin film on the inner wall of the channel. Otherwise, the sprayed material would clog the channel.
  • a mount 70 has an annular groove 71 in which is provided a seal 72 and a positive pressure chamber 73.
  • a holding member 74 is detachably secured to the mount 70 by screws 75 to hold the nozzle plate in between. Holding member 74 is formed with a window 76.
  • Chamber 73 is connected by a pipe 77 to a pressure pump 78 to produce a positive pressure in the chamber 73 and eject air to the outside through the channel of the nozzle member, the speed of airflow in the channel being controlled by a pressure regulator 79.
  • Ink-repellant material is sprayed by a spray gun 80 to form an ink-repellant layer 81 within the window 76. Since the direction of movement of air through the channel is opposite to the direction of movement of the sprayed material, the latter is deposited only on the surface portion of the nozzle plate and is prevented from clogging the channel.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Claims (17)

  1. Verfahren zur Herstellung eines Düsenelements für einen Tintenstrahldruckkopf, welches folgende Stufen umfaßt:
    a) Ätzen einer ersten Oberfläche eines Substrats auf eine vorbestimmte Tiefe nach einem ersten Muster unter Bildung einer überstehenden Düse mit einer darin ausgebildeten Düsenöffnung, wobei das Substrat aus einem lichtempfindlichen Glas besteht; und
    b) Ätzen einer zweiten gegenüberliegenden Oberfläche des Substrats auf eine vorbestimmte Tiefe unter Bildung eines Kanals, der sich zur Düsenöffnung erstreckt und mit dieser axial ausgerichtet ist.
  2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Stufe (b) folgende Schritte aufweist:
    b₁) Auftragen einer ersten Schicht aus einem Ätzmittel beständigem Material auf der ersten Oberfläche, so daß dieses Material die Düsenöffnung ausfüllt und Ausbilden einer zweiten Schicht aus einem Ätzmittel beständigem Material auf der zweiten Oberfläche mit der Ausnahme eines Bereichs, der mit der Düsenöffnung ausgerichtet ist; und
    b₂) Eintauchen des Substrats in eine Lösung aus einem Ätzmittel.
  3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Stufe (a) während einer Zeitdauer, die kürzer ist als die Zeit zur Durchführung der Stufe (b), durchgeführt wird.
  4. Verfahren nach Anspruch 1, 2 oder 3, dadurch gekennzeichnet, daß die Stufe (a) folgende Schritte aufweist:
    a₁) Unterwerfung einer ersten Oberfläche aus einem lichtempfindlichen Glassubstrat einer ersten bildweisen ultravioletten Strahlung;
    a₂) Erhitzen des Substrats zur Kristallisierung der der Strahlung ausgesetzten Bereiche davon, so daß ein nicht belichteter Bereich davon einen amorphen Hohlzylinder ausbildet, der sich von der ersten Oberfläche zu einer zweiten, gegenüberliegenden Oberfläche des Substrats erstreckt; und
    a₃) Unterwerfen der ersten Oberfläche des Substrates einer Behandlung mit einer Lösung aus einem Ätzmittel zur Entfernung der kristallisierten Bereiche von der ersten Oberfläche auf eine vorbestimmte Tiefe, damit ein Teil des amorphen Hohlzylinders aus dem Substrat überstehen kann, und die Stufe (b) folgende Schritte aufweist:
    b₁) Auftragen einer Fotoresistschicht auf die zweite Oberfläche des Substrats;
    b₂) Unterwerfung der Fotoresistschicht einer zweiten bildweisen ultravioletten Strahlung;
    b₃) Unterwerfung der Fotoresistschicht einer Behandlung mit einer Lösung aus einem Ätzmittel zur Entfernung des Bereichs der Fotoresistschicht, der nicht der zweiten bildweisen Bestrahlung ausgesetzt ist;
    b₄) Unterwerfung des Substrats auf der Seite der zweiten Oberfläche einer Behandlung mit einer Lösung aus einem Ätzmittel zur Entfernung des Inneren des Hohlzylinders; und
    b₅) Entfernung der Fotoresistschicht vom Substrat.
  5. Verfahren nach Anspruch 4, dadurch gekennzeichnet, daß der Schritt (a₃) während einer Zeitdauer, die kürzer ist als die zeit zur Durchführung des Schritts (b₄), durchgeführt wird.
  6. Verfahren nach Anspruch 4 oder 5, dadurch gekennzeichnet, daß der Schritt (a₁) folgendes ausweist:
    Aufbringen einer ersten Fotomaske mit einem ringförmigen, undurchsichtigen Bereich; und
    Belichten des Substrats mit ultraviolettem Licht durch die erste Fotomaske und
    die Stufe (b₂) folgendes aufweist:
    Aufbringen einer zweiten Fotomaske auf die Fotoresistschicht, wobei die zweite Fotomaske einen kreisförmigen, undurchsichtigen Bereich aufweist, der kleiner als der äußere Umfang des ringförmigen undurchsichtigen Bereichs und größer als der innere Umfang des ringförmigen, undurchsichtigen Bereichs ist; und
    Belichten dieser Fotoresistschicht mit ultraviolettem Licht durch die zweite Fotomaske.
  7. Verfahren nach Anspruch 4, 5 oder 6, dadurch gekennzeichnet, daß der Schritt (b₄) folgendes aufweist:
    Auftragen einer zweiten Schicht aus einem Ätzmittel beständigen Material auf das Substrat auf die Seite der ersten Oberfläche, so daß es das Innere des herausragenden amorphen Teils ausfüllt:
    Eintauchen des Substrats in die Lösung aus dem Ätzmittel zur Entfernung des sich durch die zweite Schicht erstreckenden Inneren, und weiterhin
    Entfernen der zweiten Schicht von dem Substrat.
  8. Verfahren nach einem der Ansprüche 4 bis 7, welches noch weiterhin die Schritte des Aussetzens des Substrats einer ultravioletten Strahlung nach Stufe (b₅) und des Erhitzens des Substrats zur Kristallisierung des amorphen Zylinders aufweist.
  9. Verfahren nach einem der Ansprüche 4 bis 8, welches noch den Schritt des Auftragens einer hellen Schutzschicht auf das Substrat auf die zweite Seite vor der Stufe (b₁) aufweist.
  10. Verfahren nach einem der Ansprüche 4 bis 8, welches weiterhin die Stufe des Aufrauhens der zweiten Oberfläche des Substrats vor der Stufe (b₁) aufweist.
  11. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Stufe (a) folgende Schritte aufweist:
    a₁) Aussetzen einer ersten Oberfläche eines lichtempfindlichen Glassubstrats einer ersten bildweisen ultravioletten Strahlung;
    a₂) Erhitzen des Substrats zum Auskristallisieren der der Strahlung ausgesetzten Bereiche, so daß der nicht belichtete Bereich einen amorphen Hohlzylinder ausbildet, der sich von der ersten Oberfläche bis zu einer zweiten Oberfläche des Substrats erstreckt; und
    a₃) Unterwerfung der ersten und zweiten Oberfläche des Substrats einer Behandlung mit einer Lösung aus einem Ätzmittel zur Ätzung der kristallisierten Bereiche der ersten Oberfläche auf eine vorbestimmte Tiefe, damit ein erster Teil des amorphen Hohlzylinders aus der ersten Oberfläche herausragen kann und Ätzung der kristallisierten Bereiche der zweiten Oberfläche auf eine vorbestimmte Tiefe, damit ein zweiter Teil des amorphen Hohlzylinders aus der zweiten Oberfläche herausragen kann;
    und die Stufe (b) die Schritte umfaßt:
    b₁) Auftragen einer Schicht aus einem Ätzmittel beständigem Material auf die Außenseite der geätzten zweiten Oberfläche des herausragenden zweiten Teils;
    b₂) Unterwerfung der zweiten Oberfläche des Substrats einer Behandlung mit einer Lösung aus einem Ätzmittel zur Entfernung des Inneren des Hohlzylinders, der sich von der zweiten Oberfläche bis zur ersten Oberfläche erstreckt; und
    b₃) Entfernung der Schicht von dem Substrat.
  12. Verfahren nach Anspruch 11, dadurch gekennzeichnet, daß der Schritt (b₂) folgendes aufweist:
    Auftragen einer zweiten Schicht aus einem Ätzmittel beständigem Material auf die gesamte Fläche des Substrats im Hinblick auf die Seite der ersten Oberfläche, so daß dieses das Innere des hervorstehenden ersten Teils ausfüllt; und
    Eintauchen dieses Substrats in eine Lösung aus einem Ätzmittel zur Entfernung des Inneren von der zweiten Oberfläche zur zweiten Schicht.
  13. Verfahren nach Anspruch 11 oder 12, dadurch gekennzeichnet, daß der Schritt (a₃) für eine Zeitdauer, die kürzer ist als die Zeit zur Durchführung des Schritts (b₂), durchgeführt wird.
  14. Verfahren nach Anspruch 11, 12 oder 13, welches weiterhin den Schritt des Läppens des Substrats auf der Seite der zweiten Oberfläche auf eine vorbestimmte Tiefe aufweist.
  15. Verfahren nach Anspruch 11, 12, 13 oder 14, welches weiterhin das Aussetzen des Substrats einer ultravioletten Strahlung nach dem Schritt (b₃) und das Erhitzen des Substrats zur Auskristallisierung des amorphen Zylinders umfaßt.
  16. Verfahren nach einem der Ansprüche 1 bis 15, dadurch gekennzeichnet, daß ein flüssigkeitsabweisendes Material auf eine Oberfläche des Düsenelements gesprüht wird und ein Luftstrom durch den Kanal des Düsenelements in gleicher Richtung wie die Richtung der Bewegung des gesprühten Materials geführt wird.
  17. Verfahren nach einem der Ansprüche 1 bis 15, dadurch gekennzeichnet, daß ein flüssigkeitsabweisendes Material auf eine Oberfläche das Düsenelements gesprüht wird und ein Luftstrom durch den Kanal des Düsenelements in entgegengesetzter Richtung zur Richtung der Bewegung des gesprühten Materials geführt wird.
EP85306956A 1984-09-28 1985-09-30 Verfahren zur Herstellung eines Düsenkörpers für einen Tintenstrahldrucker Expired - Lifetime EP0177316B1 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP20340684A JPS6179668A (ja) 1984-09-28 1984-09-28 インクジエツト記録ヘツド
JP203406/84 1984-09-28
JP16240385A JPS6221551A (ja) 1985-07-23 1985-07-23 インクジエツト記録ヘツド
JP162403/85 1985-07-23
JP177911/85 1985-08-13
JP17791185A JPS6239252A (ja) 1985-08-13 1985-08-13 インクジエツト記録用ノズル板の表面処理方法
JP19629085A JPS6255154A (ja) 1985-09-05 1985-09-05 インクジエツト記録ヘツド
JP196290/85 1985-09-05

Related Child Applications (1)

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EP0177316A2 EP0177316A2 (de) 1986-04-09
EP0177316A3 EP0177316A3 (en) 1987-06-16
EP0177316B1 true EP0177316B1 (de) 1991-06-19

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EP85306956A Expired - Lifetime EP0177316B1 (de) 1984-09-28 1985-09-30 Verfahren zur Herstellung eines Düsenkörpers für einen Tintenstrahldrucker
EP19890117232 Expired - Lifetime EP0355862B1 (de) 1984-09-28 1985-09-30 Tintenstrahldrucker

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1329341C (en) * 1988-10-19 1994-05-10 Rosemary Bridget Albinson Method of forming adherent fluorosilane layer on a substrate and ink jet recording head containing such a layer
GB8906379D0 (en) * 1989-03-20 1989-05-04 Am Int Providing a surface with solvent-wettable and solvent-non wettable zones
DE3918472A1 (de) * 1989-06-06 1990-12-13 Siemens Ag Hydrophobierungsmittel und anwendungsverfahren, insbesondere bei tintenstrahldruckkoepfen
US5574486A (en) * 1993-01-13 1996-11-12 Tektronix, Inc. Ink jet print heads and methos for preparing them
US6243112B1 (en) 1996-07-01 2001-06-05 Xerox Corporation High density remote plasma deposited fluoropolymer films
US9895885B2 (en) 2012-12-20 2018-02-20 Hewlett-Packard Development Company, L.P. Fluid ejection device with particle tolerant layer extension
CN104853923B (zh) * 2012-12-20 2016-08-24 惠普发展公司，有限责任合伙企业 具有颗粒耐受层延伸部的流体喷射装置

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US3921916A (en) * 1974-12-31 1975-11-25 Ibm Nozzles formed in monocrystalline silicon
EP0109755A2 (de) * 1982-11-23 1984-05-30 Hewlett-Packard Company Tintenstrahldüsenöffnungsplatte mit integrierten Separatoren

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DE3048259A1 (de) * 1980-12-20 1982-07-29 Philips Patentverwaltung Gmbh, 2000 Hamburg "duese fuer tintenstrahldrucker"
DE3269768D1 (en) * 1981-01-21 1986-04-17 Matsushita Electric Ind Co Ltd Ink jet printing head utilizing pressure and potential gradients
JPS5816856A (ja) * 1981-07-24 1983-01-31 Fuji Photo Film Co Ltd インクジエツト用ノズルヘツド
JPS59192576A (ja) * 1983-04-18 1984-10-31 Matsushita Electric Ind Co Ltd インクジエツト記録装置

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US3921916A (en) * 1974-12-31 1975-11-25 Ibm Nozzles formed in monocrystalline silicon
EP0109755A2 (de) * 1982-11-23 1984-05-30 Hewlett-Packard Company Tintenstrahldüsenöffnungsplatte mit integrierten Separatoren

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DE3586998T2 (de) 1993-07-22
EP0355862A1 (de) 1990-02-28
DE3583275D1 (de) 1991-07-25
EP0355862B1 (de) 1993-01-13
EP0177316A2 (de) 1986-04-09
EP0177316A3 (en) 1987-06-16
DE3586998D1 (de) 1993-02-25

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