EP0174977A4 - Deposition regulee de materiau par arc sous vide, procede et appareil. - Google Patents

Deposition regulee de materiau par arc sous vide, procede et appareil.

Info

Publication number
EP0174977A4
EP0174977A4 EP19850901674 EP85901674A EP0174977A4 EP 0174977 A4 EP0174977 A4 EP 0174977A4 EP 19850901674 EP19850901674 EP 19850901674 EP 85901674 A EP85901674 A EP 85901674A EP 0174977 A4 EP0174977 A4 EP 0174977A4
Authority
EP
European Patent Office
Prior art keywords
cathode
active surface
anode
electric arc
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP19850901674
Other languages
German (de)
English (en)
Other versions
EP0174977A1 (fr
Inventor
Subbiah Ramalingam
Cai Bao Chinese Aeronautica Qi
Kyunghoon Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Minnesota
Original Assignee
University of Minnesota
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Minnesota filed Critical University of Minnesota
Publication of EP0174977A1 publication Critical patent/EP0174977A1/fr
Publication of EP0174977A4 publication Critical patent/EP0174977A4/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Un procédé et un appareil pour une déposition par arc sous vide de matériau sur la surface d'un objet (32) utilise une chambre à vide (12) logeant la surface active de la cathode (24) et une anode (34). Une alimentation connectée à l'anode (34) et à la cathode (24) crée un arc éléctrique. La trace de l'arc est régulée au moyen d'un champ magnétique formé au moyen d'un aimant permanent (56) que l'on déplace dans un parcours fermé par rapport à la cathode. Un solénoïde (68) modifie le champ magnétique principal produit sur la surface active de la cathode (24).
EP19850901674 1984-03-02 1985-02-27 Deposition regulee de materiau par arc sous vide, procede et appareil. Ceased EP0174977A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58584584A 1984-03-02 1984-03-02
US585845 1984-03-02

Publications (2)

Publication Number Publication Date
EP0174977A1 EP0174977A1 (fr) 1986-03-26
EP0174977A4 true EP0174977A4 (fr) 1987-02-12

Family

ID=24343205

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19850901674 Ceased EP0174977A4 (fr) 1984-03-02 1985-02-27 Deposition regulee de materiau par arc sous vide, procede et appareil.

Country Status (4)

Country Link
EP (1) EP0174977A4 (fr)
JP (1) JPS61501328A (fr)
CA (1) CA1247043A (fr)
WO (1) WO1985003954A1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4627904A (en) * 1984-05-17 1986-12-09 Varian Associates, Inc. Magnetron sputter device having separate confining magnetic fields to separate targets and magnetically enhanced R.F. bias
US4657619A (en) * 1985-11-29 1987-04-14 Donnell Kevin P O Diverter magnet arrangement for plasma processing system
JP2571948B2 (ja) * 1986-04-04 1997-01-16 リージェンツ オブ ザ ユニバーシティ オブ ミネソタ 耐火性金属化合物のアークコーティング
NL8601824A (nl) * 1986-07-11 1988-02-01 Hauzer Holding Werkwijze en inrichting voor het met een geleidend plasmakanaal ontsteken van een boog.
EP0285745B1 (fr) * 1987-03-06 1993-05-26 Balzers Aktiengesellschaft Procédé et dispositifs de déposition sous vide utilisant une décharge électrique
CA1301239C (fr) * 1987-03-16 1992-05-19 Hans Veltrop Methode et agencement permettant de deplacer mecaniquement un dispositif generateur de champ magnetique dans un dispositif d'evaporation cathodique a decharge d'arc
US5298136A (en) * 1987-08-18 1994-03-29 Regents Of The University Of Minnesota Steered arc coating with thick targets
JPH0674497B2 (ja) * 1987-11-25 1994-09-21 株式会社神戸製鋼所 セラミックス硬質膜被覆方法
GB9615548D0 (en) 1996-07-24 1996-09-04 Univ Nanyang Cathode arc source and graphite target
US6036828A (en) * 1997-08-30 2000-03-14 United Technologies Corporation Apparatus for steering the arc in a cathodic arc coater
JP4000764B2 (ja) * 2000-09-18 2007-10-31 日新電機株式会社 真空アーク蒸発装置
CZ296094B6 (cs) * 2000-12-18 2006-01-11 Shm, S. R. O. Zarízení pro odparování materiálu k povlakování predmetu
US6936145B2 (en) * 2002-02-28 2005-08-30 Ionedge Corporation Coating method and apparatus
EP3133634B1 (fr) * 2015-08-09 2020-09-30 ISA Installations-, Steuerungs- und Automatisierungssystem GmbH Dispositif d'amorçage d'une decharge en arc sous vide et son procede d'utilisation
CN115074678B (zh) * 2022-06-20 2023-05-16 肇庆市科润真空设备有限公司 不锈钢薄板连续镀膜用的多弧靶机构及pvd镀膜装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU307666A1 (ru) * 1968-09-09 1979-01-08 Sablev L P Электродуговой испаритель металлов
US3625848A (en) * 1968-12-26 1971-12-07 Alvin A Snaper Arc deposition process and apparatus
SU363375A1 (ru) * 1970-03-20 1979-01-10 Sablev L P Электродуговой испаритель металлов
US3783231A (en) * 1972-03-22 1974-01-01 V Gorbunov Apparatus for vacuum-evaporation of metals under the action of an electric arc
US3956093A (en) * 1974-12-16 1976-05-11 Airco, Inc. Planar magnetron sputtering method and apparatus
SU711787A1 (ru) * 1978-06-17 1980-10-07 Предприятие П/Я В-8851 Электродуговой испаритель металлов
US4444643A (en) * 1982-09-03 1984-04-24 Gartek Systems, Inc. Planar magnetron sputtering device
US4448799A (en) * 1983-04-21 1984-05-15 Multi-Arc Vacuum Systems Inc. Arc-initiating trigger apparatus and method for electric arc vapor deposition coating systems
US4448659A (en) * 1983-09-12 1984-05-15 Vac-Tec Systems, Inc. Method and apparatus for evaporation arc stabilization including initial target cleaning

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
See also references of WO8503954A1 *
SOVIET INVENTIONS ILLUSTRATED, week D15, 20th May 1981; & SU-A-711 787 (L.P. SABLEV) 17-06-1978 *

Also Published As

Publication number Publication date
WO1985003954A1 (fr) 1985-09-12
JPS61501328A (ja) 1986-07-03
JPH0548298B2 (fr) 1993-07-21
CA1247043A (fr) 1988-12-20
EP0174977A1 (fr) 1986-03-26

Similar Documents

Publication Publication Date Title
US4673477A (en) Controlled vacuum arc material deposition, method and apparatus
JP4467787B2 (ja) イオンソース装置
EP0225680B1 (fr) Procédé pour le dépôt en phase vapeur à l'aide d'arc électrique
US5298136A (en) Steered arc coating with thick targets
CA1247043A (fr) Methode et dispositif de chargement d'une surface a l'arc sous vide
US6413387B1 (en) Cathode arc source for metallic and dielectric coatings
US5972185A (en) Cathodic arc vapor deposition apparatus (annular cathode)
US6036828A (en) Apparatus for steering the arc in a cathodic arc coater
JPH01234562A (ja) 陰極アーク放電蒸発装置
US5215640A (en) Method and arrangement for stabilizing an arc between an anode and a cathode particularly for vacuum coating devices
KR20140143352A (ko) 여과된 음극 아크 증착 장치 및 방법
JP2007505997A (ja) 長方形フィルター真空プラズマ源及び真空プラズマ流の制御方法
US6110540A (en) Plasma apparatus and method
US5441624A (en) Triggered vacuum anodic arc
JPH0676773A (ja) 低圧放電の発生及び点弧方法並びに真空加工装置及び該装置の陰極チェンバ
JP4989026B2 (ja) 磁界発生装置付き真空アークソース
EP0544831B1 (fr) Dispositiv de pulverisation cathodique et procede de pulverisation cathodique d'amelioration de l'uniformite de repartition du flux ionique sur un substrat
US6361663B1 (en) Vacuum arc evaporator
JP4689843B2 (ja) 矩形陰極アーク源およびアークスポットの指向方法
US6391164B1 (en) Deposition of coatings and thin films using a vacuum arc with a non-consumable hot anode
JP3287163B2 (ja) アーク式蒸発源
JP3406769B2 (ja) イオンプレーティング装置
JP3555033B2 (ja) 負圧又は真空中において材料蒸気によつて基板を被覆する装置
JP2857743B2 (ja) 薄膜形成装置および薄膜形成方法
JPH05263213A (ja) 熱プラズマ発生法および製膜装置

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH DE FR GB LI LU NL SE

RIN1 Information on inventor provided before grant (corrected)

Inventor name: KIM, KYUNGHOON

Inventor name: RAMALINGAM, SUBBIAH

17P Request for examination filed

Effective date: 19860213

RIN1 Information on inventor provided before grant (corrected)

Inventor name: KIM, KYUNGHOON

Inventor name: CAI, BAOGI

Inventor name: RAMALINGAM, SUBBIAH

A4 Supplementary search report drawn up and despatched

Effective date: 19870212

17Q First examination report despatched

Effective date: 19900920

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 19930524

RIN1 Information on inventor provided before grant (corrected)

Inventor name: CAI, BAOGI

Inventor name: KIM, KYUNGHOON

Inventor name: RAMALINGAM, SUBBIAH