EP0149662A1 - Verfahren zur metallisierung eines festen körpers. - Google Patents
Verfahren zur metallisierung eines festen körpers.Info
- Publication number
- EP0149662A1 EP0149662A1 EP84902802A EP84902802A EP0149662A1 EP 0149662 A1 EP0149662 A1 EP 0149662A1 EP 84902802 A EP84902802 A EP 84902802A EP 84902802 A EP84902802 A EP 84902802A EP 0149662 A1 EP0149662 A1 EP 0149662A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- solid body
- metal
- metallizing
- metallization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001465 metallisation Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims description 22
- 239000007787 solid Substances 0.000 title claims description 15
- 239000000126 substance Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 230000003197 catalytic effect Effects 0.000 claims abstract description 4
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract 17
- 239000002184 metal Substances 0.000 claims abstract 17
- 239000003054 catalyst Substances 0.000 claims abstract 8
- 150000003839 salts Chemical class 0.000 claims abstract 5
- 150000002736 metal compounds Chemical class 0.000 claims abstract 3
- 229910000846 In alloy Inorganic materials 0.000 claims abstract 2
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000005388 borosilicate glass Substances 0.000 claims description 2
- 239000005361 soda-lime glass Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims 4
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 1
- 230000000737 periodic effect Effects 0.000 claims 1
- 230000007062 hydrolysis Effects 0.000 abstract description 2
- 238000006460 hydrolysis reaction Methods 0.000 abstract description 2
- 230000002787 reinforcement Effects 0.000 abstract description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 2
- 229910052738 indium Inorganic materials 0.000 abstract 2
- 229910052725 zinc Inorganic materials 0.000 abstract 2
- 239000011701 zinc Substances 0.000 abstract 2
- 229910001297 Zn alloy Inorganic materials 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000035784 germination Effects 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 210000004127 vitreous body Anatomy 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000002318 adhesion promoter Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
Definitions
- the invention relates to a method for metallizing a solid body according to the preamble of patent claim 1.
- Solid bodies are metallized in order to change, improve and / or expand their functional properties, for example the electrical conductivity, the corrosion resistance, the wear resistance and / or also decorative properties. With such metallizations, their adhesive strength is generally of great importance. Layer adhesion can be caused, for example, by a relatively weak interaction between layer and substrate material (so-called Van der Waals forces), by chemical bonds or by mechanical anchoring and / or by a combination of these contributions.
- the layer adhesion can be improved.
- adhesion-promoting intermediate layers in the form of adhesives or vapor deposition and / or sputter layers are deposited.
- Better layer adhesion is achieved by roughening the substrate, e.g. by a grinding process and / or by swelling and roughening of the surface by chemical etching and / or by embedding foreign substances which can be removed in the adhesion promoter.
- Adhesion promoters consist of a material that differs from the substrate and the desired coating, so that unsuitable properties occur or the desired layer properties are restricted.
- Adhesion promoter made of adhesive layers the thermal resilience of the coated body.
- Uneconomical coating processes are required for inorganic adhesion promoters. Roughening of the substrate surfaces is a problem wherever very fine metallization structures are required or where special optical properties (reflection, gloss) are required.
- the object of the invention is to provide a generic method which, in particular, is a cost-effective method enables very fine structurable and adhesive metallization on glassy and / or glass-like bodies and in which a reaming of the surface of the body and the deposition of a special adhesion promoter is avoided.
- a disk-shaped body made of soda-lime glass is steamed with a first layer of an indium-tin alloy layer with a thickness of 120 nm in a cathode sputtering system after the currently used cleaning and degreasing methods.
- Example 2 Treatment in a palladium chloride solution and subsequent thorough rinsing in demineralized water produces a catalytic seed layer on which a very uniform copper layer can be deposited in a currently commercially available chemical copper bath. After annealing, it is galvanically reinforced with copper. With the help of a currently customary photoresist and etching process, 1mm wide strips are prepared, which require a tensile force of 0.2 N for vertical peeling.
- Example 2 Example 2:
- a borosilicate glass pane is pretreated as in Example 1 and vapor-deposited with an indium-tin alloy layer. By a per process in air, the layer is converted into a translucent layer by oxidation. After gas phase pickling and subsequent hydrolysis, a catalytic seed layer is formed with palladium chloride solution. After deposition of a 0.3 ⁇ m thick copper layer from a currently commercially available chemical copper bath, tempering is carried out in the absence of oxygen. After galvanic reinforcement of the layer and a peeling strip preparation according to Example 1, a peel strength of 0.45 N / mm is measured.
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
- Surface Treatment Of Glass (AREA)
- Physical Vapour Deposition (AREA)
- Electroplating Methods And Accessories (AREA)
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT84902802T ATE40904T1 (de) | 1983-07-21 | 1984-07-18 | Verfahren zur metallisierung eines festen koerpers. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3326253 | 1983-07-21 | ||
DE19833326253 DE3326253A1 (de) | 1983-07-21 | 1983-07-21 | Verfahren zur metallisierung eines festen koerpers |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0149662A1 true EP0149662A1 (de) | 1985-07-31 |
EP0149662B1 EP0149662B1 (de) | 1989-02-22 |
Family
ID=6204509
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP84108494A Pending EP0132784A3 (de) | 1983-07-21 | 1984-07-18 | Verfahren zur Metallisierung eines festen Körpers |
EP84902802A Expired EP0149662B1 (de) | 1983-07-21 | 1984-07-18 | Verfahren zur metallisierung eines festen körpers |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP84108494A Pending EP0132784A3 (de) | 1983-07-21 | 1984-07-18 | Verfahren zur Metallisierung eines festen Körpers |
Country Status (6)
Country | Link |
---|---|
US (1) | US4692356A (de) |
EP (2) | EP0132784A3 (de) |
JP (1) | JPS60501858A (de) |
DE (2) | DE3326253A1 (de) |
DK (1) | DK42585A (de) |
WO (1) | WO1985000623A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3518766A1 (de) * | 1985-05-24 | 1986-11-27 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur metallisierung eines substrates |
DE3536821A1 (de) * | 1985-10-16 | 1987-04-16 | Standard Elektrik Lorenz Ag | Verfahren zur herstellung einer stromlos abgeschiedenen, loetbaren metallschicht |
DE3705251A1 (de) * | 1987-02-19 | 1988-09-01 | Standard Elektrik Lorenz Ag | Verfahren zur herstellung einer stromlos abgeschiedenen, loetbaren metallschicht |
US4965101A (en) * | 1987-12-10 | 1990-10-23 | Swiss Aluminium Ltd. | Ceramic foam for filters for cleaning exhaust gases of diesel engines |
DE4035362A1 (de) * | 1990-11-07 | 1992-05-14 | Licentia Gmbh | Verfahren zum herstellen einer fluessigkristall-anzeigevorrichtung |
DE4138214A1 (de) * | 1991-11-21 | 1993-05-27 | Daimler Benz Ag | Verfahren zur metallisierung von aluminiumnitridkeramik |
DE4220621A1 (de) * | 1992-06-24 | 1994-01-05 | Daimler Benz Ag | Verfahren zum stromlos chemischen Erzeugen einer strukturierten Metallschicht |
US20050242656A1 (en) * | 2004-04-30 | 2005-11-03 | Hogan Scott A | Plated covers for vehicle wheel assemblies |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3427197A (en) * | 1965-01-27 | 1969-02-11 | Lockheed Aircraft Corp | Method for plating thin titanium films |
DE1621367A1 (de) * | 1967-10-18 | 1971-05-06 | Telefunken Patent | Verfahren zum Aktivieren einer Metallisierungsschicht |
US3889017A (en) * | 1971-02-02 | 1975-06-10 | Ppg Industries Inc | Chemical filming solution and process for plating therewith |
US4307168A (en) * | 1977-05-05 | 1981-12-22 | Eastman Kodak Company | Amplification of developed electrographic image patterns |
US4322457A (en) * | 1978-01-25 | 1982-03-30 | Western Electric Co., Inc. | Method of selectively depositing a metal on a surface |
US4354911A (en) * | 1981-08-07 | 1982-10-19 | Western Electric Company Inc. | Method of selectively depositing a metal on a surface by means of sputtering |
US4444848A (en) * | 1982-01-04 | 1984-04-24 | Western Electric Co., Inc. | Adherent metal coatings on rubber-modified epoxy resin surfaces |
-
1983
- 1983-07-21 DE DE19833326253 patent/DE3326253A1/de not_active Withdrawn
-
1984
- 1984-07-18 EP EP84108494A patent/EP0132784A3/de active Pending
- 1984-07-18 JP JP59502863A patent/JPS60501858A/ja active Pending
- 1984-07-18 US US06/703,679 patent/US4692356A/en not_active Expired - Fee Related
- 1984-07-18 WO PCT/EP1984/000223 patent/WO1985000623A1/de active IP Right Grant
- 1984-07-18 DE DE8484902802T patent/DE3476820D1/de not_active Expired
- 1984-07-18 EP EP84902802A patent/EP0149662B1/de not_active Expired
-
1985
- 1985-01-31 DK DK42585A patent/DK42585A/da not_active Application Discontinuation
Non-Patent Citations (1)
Title |
---|
See references of WO8500623A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE3476820D1 (en) | 1989-03-30 |
JPS60501858A (ja) | 1985-10-31 |
EP0132784A2 (de) | 1985-02-13 |
DE3326253A1 (de) | 1985-01-31 |
DK42585D0 (da) | 1985-01-31 |
WO1985000623A1 (en) | 1985-02-14 |
DK42585A (da) | 1985-03-22 |
EP0149662B1 (de) | 1989-02-22 |
US4692356A (en) | 1987-09-08 |
EP0132784A3 (de) | 1985-03-20 |
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