EP0104231A1 - Diffuseur thermique a auto-positionnement - Google Patents

Diffuseur thermique a auto-positionnement

Info

Publication number
EP0104231A1
EP0104231A1 EP83901297A EP83901297A EP0104231A1 EP 0104231 A1 EP0104231 A1 EP 0104231A1 EP 83901297 A EP83901297 A EP 83901297A EP 83901297 A EP83901297 A EP 83901297A EP 0104231 A1 EP0104231 A1 EP 0104231A1
Authority
EP
European Patent Office
Prior art keywords
heat spreader
lead frame
mold cavity
heat
extending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP83901297A
Other languages
German (de)
English (en)
Other versions
EP0104231A4 (fr
Inventor
William L. Hunter
Paul R. Theobald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of EP0104231A1 publication Critical patent/EP0104231A1/fr
Publication of EP0104231A4 publication Critical patent/EP0104231A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Definitions

  • This invention relates generally to heat spreaders and, more particularly, to a heat spreader adapted for insertion into a mold cavity prior to plastic encapsulation with a semiconductor device.
  • Metal heat spreaders of various shapes and designs have been commonly used to spread or conduct heat away from a metal lead frame which is electrically connected to an integrated circuit die.
  • One application of such heat spreaders has been to physically attach the heat spreader to the metal lead frame wherein both the heat spreader and lead frame are encapsulated in plastic.
  • a heat spreader is used to spread heat in a relatively uniform manner throughout plastic and is not used for contact to an external heat sink.
  • heat spreaders have an exposed surface, poor adhesion between plastic and metal may allow moisture to enter into the package. Exposed metal surfaces may also result in a fragile structure.
  • a disadvantage with heat spreaders that are directly connected to a metal lead frame is that achieving the physical connection requires a separate manufacturing step.
  • a further disadvantage with such heat spreaders is the fact that capacitance exists between the heat spreader which acts as one long conducting surface or plate and the lead frame which acts as another conducting surface or plate. Since the lead frame has different voltages at various points during operation and the distance separating the two conducting surfaces is small, a large capacitance is created between the two surfaces. For some applications the capacitance does not present a significant problem. However, in many high speed circuits, such as a microprocessor, the capacitance can be a severe problem. Another problem is the variation in capacitance from part to part which results from variation in the position of the heat spreader with respect to the lead frame. As a result of the variation of capacitance from part to part, a heat spreader configuration may be acceptable for some parts but be unacceptable for other parts having different lead frame configurations.
  • an object of the present invention is to provide an improved heat spreader which is self- positioning in a mold cavity prior to plastic encapsulation.
  • Another object of the present invention is to provide an improved heat spreader having a configuration in which capacitance between the heat spreader and a lead frame is minimized.
  • Another object of the present invention is to provide an improved heat spreader having substantially the same amount of capacitance between itself and a lead frame from part to part.
  • a further object of the present invention is to provide an improved heat spreader which is anodized and self-positioning in a mold cavity prior to plastic encapsulation.
  • Yet another object of the present invention is to provide an improved heat spreader for use in a semiconductor package having a low thermal impedance.
  • a self- positioning heat spreader adapted for insertion into a mold cavity prior to encapsulation with an encapsulant such as plastic.
  • the heat spreader is placed into the mold cavity and is parallel to a first surface of a metal lead frame which has a semiconductor die connected to a second surface.
  • the heat spreader has a frame with notches at opposite ends to reduce capacitance and which define bifurcated limbs which are sized to extend to within a predetermined tolerance of the end walls of the mold cavity.
  • the inner edges of each limb complement the portion of the lead frame which overlays the limb.
  • a pair of spaced-apart lateral standoffs extend from each side of the heat spreader to within a predetermined tolerance of the side walls of the mold cavity. At least a pair of feet extend a predetermined distance below the lead frame, and a central portion extends to within a predetermined tolerance of the bottom surface of the lead frame. At least one .surface of the heat spreader is covered with an insulation such as anodization to prevent electrical contact between the heat spreader and the lead frame.
  • FIG. 1 illustrates a top plan view of a self- positioning heat spreader constructed in accordance with the preferred embodiment of the present invention
  • FIG. 2 illustrates a side elevational view of the heat spreader of FIG. 1 ; and
  • FIG. 3 illustrates a cross sectional view of a heat spreader according to this invention taken substantially on line 3-3 of FIG. 1.
  • FIG. 1 Shown in FIG. 1 is a heat spreader 10 constructed in accordance with the preferred embodiment.
  • Heat spreader 10 may be inserted into either a lower or an upper half of a mold cavity (not shown). Although a lower thermal impedance may be obtained when heat spreader 10 is utilized in an upper half of a mold cavity, heat spreader 10 is typically utilized in a lower half of a mold cavity.
  • an upper half of a mold cavity containing a lead frame (not shown) which is connected to a semiconductor die is positioned within the lower half of the mold cavity.
  • the semiconductor die has electrical wires extending therefrom to the lead frame.
  • Both halves of the mold cavity are filled with an encapsulant, such as molten plastic, to form an encapsulated semiconductor device.
  • an encapsulant such as molten plastic
  • heat spreader 10 comprises an elongated heat conductive frame 12 which is metal, such as aluminum, and is completely anodized or insulated. Although heat spreader 10 is preferably metal, heat spreader 10 may be fabricated from any other material which has a greater heat conductivity than the encapsulant. While it will be understood that heat conductive frame 12 is preferably elongated, a substantially square frame may also be used. At the two ends of frame 12 is a notch 14 and and a notch 16, respectively. A pair of bifurcated limbs 18 and 20 surround notch 14 and a pair of bifurcated limbs 22 and 24 surround notch 16. Limbs 18 and 20 terminate with an end edge 26 and an end edge 28, respectively.
  • Limbs 22 and 24 terminate with an end edge 30 and an end edge 32, respectively.
  • Limbs 18 and 20 have an inner edge 34 and an inner edge 36, respectively, and limbs 22 and 24 have an inner edge 38 and an inner edge 40, respectively.
  • Lateral standoffs 42, 44, 46 and 48 extend from the outer sides of limbs 18, 20, 22 and 24, respectively.
  • X. l m a predetermined distance from the lower surface of heat spreader 10 are feet 50, 52, 54 and 56.
  • a central portio 58 extends from the top surface of heat spreader 10 to within a predetermined tolerance of the bottom surface of a lead frame (not shown).
  • Feet 50, 52, 54 and 56 help position and support hea spreader 10 from the floor of the mold cavity.
  • a primary purpose of feet 50, 52, 54 and 56 is to elevate elongated frame 12 from the bottom surface of the mold cavity.
  • heat spreader 10 does not have an exposed surface as a heat sink would and is essentially totally encapsulated. Complete encapsulation is important since plastic does not always strongly adhere to metal. When a metal surface of heat spreader 10 is exposed, moisture can often enter the metal-plastic interface. Further, heat spreader 10 may be inadvertently pulled out or just come out of the plastic if exposed.
  • Feet 50, 52, 54 and 56 therefore extend below heat spreader 10 a predetermined distance to insure that the lower surface of heat spreader 10 is totally encapsulated in plastic.
  • four distinct feet have been shown in a preferred form, either as few as two or more than four feet may be used. When only two feet are used, both feet are positioned toward the opposite end of heat spreader 10 from the end in which the encapsulant enters. The flow of encapsulant allows the end having no feet to be sligthly raised from the mold cavity.
  • central portion 58 The purpose of central portion 58 is to put only a portion of metal heat spreader 10 in close proximity to the lead frame.
  • the reason for putting only a portion of heat spreader 10 in close proximity to the lead frame is to minimize the capacitance which exists between the two conducting surfaces. Such capacitance increases as the the distance or thickness of the plastic dielectric
  • Lateral standoffs 42, 44, 46 and 48 are essential for heat spreader 10 to be self-positioning into the mold cavity. Lateral standoffs extend into within a first predetermined tolerance of the side walls of the cavity so that when heat spreader 10 is dropped into the cavity, heat spreader 10 is substantially parallel to the lead frame. Further, when plastic is flowing through the mold cavity, heat spreader 10 will not be able to move sideways. Ends 26, 28, 30 and 32 are also sized to extend to within a second predetermined tolearance of the end walls of the mold cavity. Similarly, when plastic flows into the mold cavity, heat spreader 10 will not be able to move lengthwise since limbs 18, 20, 22 and 24 are firmly wedged against the end walls of the mold cavity.
  • Notches 14 and 16 serve a two-fold purpose- Firstly, by reducing the amount of metal associated with frame 12, the amount of unwanted capacitance between frame 12 and the lead frame is reduced. In some applications, the integrated circuit which is used with the lead frame is very capacitance sensitive. Therefore, a reduction in conducting surface area is often essential to minimize capacitance between heat spreader 10 and the lead frame. Secondly, notches 14 and 16 are very helpful in allowing plastic to freely flow into the mold cavity at either end. If metal extended all the way across ends 26 and 28 and ends 30 and 32, plastic flow would be obstructed when entering the mold cavity and flow problems could result.
  • heat spreader 10 Another important feature of heat spreader 10 is the design of inner edges 34, 36, 38 and 40 which are made to complement or conform to the portion of the lead frame which overlays limbs 18, 20, 22 and 24, respectively.
  • Th lead frame has a particular design and contour and often has a radial design from a centrally located integrated circuit die.
  • heat spreader 10 By making heat spreader 10 follow the same contour, the variation in heat spreader-lead frame capacitance from unit to unit is substantially reduced.
  • inner edges 34, 36, 38 and 40 are centered between two adjacent leads of a lead frame design. As a result, the heat spreader-lead frame capacitance variatio is further reduced.
  • all semiconductor devices utilizing a particular lead frame design will have substantially the same heat spreader-lead frame capacitance.
  • a further feature of heat spreader 10 is the utilization of tapered edges 59, 60, 62 and 64 from end edges 26, 28 30 and 32, respectively.
  • the purpose of tapering end edges 26, 28, 30 and 32 is to allow more plastic to exist around the corners of the integrated circuit packaqe and have a more durable part. Because integrated circuits can receive physical abuse during handling, this feature tends to increase the integrity of the package.
  • heat spreader 10 An additional feature of heat spreader 10 is the utilization of ribs 66 and 68 extending from the upper surface of heat spreader 10 to within a predetermined tolerance of the bottom surface of the lead frame. Although in the preferred form two ribs are shown, one or more ribs may be used. Further, the positioning of ribs 66 and 68 is not critical and ribs 66 and 68 may be located at any distance from notches 14 and 16 and central
  • Ribs 66 and 68 function to keep the plastic which is flowing in the mold cavity from twisting or moving limbs 18, 20, 22 and 24 up against the lead frame. Therefore , the use of a rib would be more significant if positioned on the end of the mold cavity where plastic is entering. However, if the manufacture of central portion 58 is within the specified predetermined tolerance, ribs 66 and 68 are not essential to heat spreader 10.
  • FIG. 2 Shown in FIG. 2 is a side elevational view of heat spreader 10. As previously noted, the positioning of ribs 66 and 68 and feet 52 and 56 with respect to central portion 58 is not critical. However, in the preferred form, all ribs, feet, limbs and standoffs are substantially symmetrical with central portion 58. Shown in FIG. 3 is a cross sectional view of heat spreader 10 taken substantially on line 3-3 of FIG. 1. An additional feature of heat spreader 10 now made apparent is a channel 70 which exists under central portion 58 and extends through notch 14 and notch 16.
  • Inner inclined edges 72 and 74 elevate an inner section 76 of elongated frame 12 to within a predetermined tolerance of the bottom surface of the metal lead frame so that inner section 76 is higher than sides 78 and 80.
  • Side 78 is the side which includes limbs 20 and 24, and side 80 is the side which includes limbs 18 and 22.
  • the purpose- for elevating inner section 76 is to place a substantial amount of metal heat spreader 10 as close as possible to a lead frame to further reduce the thermal impedance. Also, by elevating inner section 76, plastic may flow into the mold cavity more freely.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

Diffuseur thermique (10) à auto-positionnement dans une cavité de moule avant son encapsulation dans du plastique. Afin de réduire au minimum la capacitance entre le diffuseur thermique (10) et un châssis conducteur métallique sur lequel est montée une puce à semiconducteurs, le diffuseur thermique (10) possède un châssis avec des entailles (14 et 16) aux extrémités opposées qui définissent des branches bifurquées (18, 20, 22 et 24). Des saillies latérales d'écartement (42, 44, 46 et 48) s'étendent de chaque côté (78 et 80), et des pieds (50, 52, 54 et 56) s'étendent d'une surface de fond. Une partie centrale (58) s'étend sur une distance prédéterminée d'une surface supérieure pour être alignée avec le châssis conducteur. Les saillies latérales (42, 44, 46 et 48), les branches (18, 20, 22 et 24) et les pieds (50, 52, 54 et 56) sont dimensionnés de manière à positionner et retenir le diffuseur thermique (10) lors de son insertion dans la cavité de moule. Chaque branche bifurquée (18, 20, 22 et 24) possède un bord intérieur (34, 36, 38 et 40) qui s'adapte ou est complémentaire à la partie du châssis conducteur qui chevauche la branche dans le plastique encapsulé.
EP19830901297 1982-04-05 1983-03-11 Diffuseur thermique a auto-positionnement. Withdrawn EP0104231A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US36511482A 1982-04-05 1982-04-05
US365114 1982-04-05

Publications (2)

Publication Number Publication Date
EP0104231A1 true EP0104231A1 (fr) 1984-04-04
EP0104231A4 EP0104231A4 (fr) 1985-10-30

Family

ID=23437521

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19830901297 Withdrawn EP0104231A4 (fr) 1982-04-05 1983-03-11 Diffuseur thermique a auto-positionnement.

Country Status (6)

Country Link
EP (1) EP0104231A4 (fr)
JP (1) JPS59500541A (fr)
KR (1) KR840004828A (fr)
CA (1) CA1201817A (fr)
IT (1) IT1164597B (fr)
WO (1) WO1983003712A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2597261B1 (fr) * 1986-04-11 1988-10-14 Aix Les Bains Composants Boitier d'encapsulation de circuits integres a dissipation thermique amelioree, et procede de fabrication
JP3322429B2 (ja) * 1992-06-04 2002-09-09 新光電気工業株式会社 半導体装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6901240A (fr) * 1968-01-26 1969-07-29
US3585272A (en) * 1969-10-01 1971-06-15 Fairchild Camera Instr Co Semiconductor package of alumina and aluminum
GB1239634A (fr) * 1968-10-02 1971-07-21
US3868725A (en) * 1971-10-14 1975-02-25 Philips Corp Integrated circuit lead structure
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
DE2818080A1 (de) * 1977-04-26 1978-11-09 Tokyo Shibaura Electric Co Verkapselte halbleitereinrichtung
JPS56146263A (en) * 1980-04-16 1981-11-13 Nec Corp Manufacture of semiconductor device
EP0047195A2 (fr) * 1980-08-06 1982-03-10 Societe Pour L'etude Et La Fabrication De Circuits Integres Speciaux - E.F.C.I.S. Boitier plastique pour circuits intégrés

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2004768C3 (de) * 1968-07-30 1979-09-06 N.V. Philips' Gloeilampenfabrieken, Eindhoven (Niederlande) Halbleiterbauelement
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base
JPS53126275A (en) * 1977-04-11 1978-11-04 Hitachi Ltd Semiconductor device
US4132856A (en) * 1977-11-28 1979-01-02 Burroughs Corporation Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby
JPS55134951A (en) * 1979-04-10 1980-10-21 Toshiba Corp Semiconductor device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6901240A (fr) * 1968-01-26 1969-07-29
GB1239634A (fr) * 1968-10-02 1971-07-21
US3585272A (en) * 1969-10-01 1971-06-15 Fairchild Camera Instr Co Semiconductor package of alumina and aluminum
US3868725A (en) * 1971-10-14 1975-02-25 Philips Corp Integrated circuit lead structure
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
DE2818080A1 (de) * 1977-04-26 1978-11-09 Tokyo Shibaura Electric Co Verkapselte halbleitereinrichtung
JPS56146263A (en) * 1980-04-16 1981-11-13 Nec Corp Manufacture of semiconductor device
EP0047195A2 (fr) * 1980-08-06 1982-03-10 Societe Pour L'etude Et La Fabrication De Circuits Integres Speciaux - E.F.C.I.S. Boitier plastique pour circuits intégrés

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENTS ABSTRACTS OF JAPAN, vol. 6, no. 25 (E-94) [903], February 13, 1982; & JP - A - 56 146 263 (NIPPON DENKI K.K.) 13-11-1981 *
See also references of WO8303712A1 *

Also Published As

Publication number Publication date
KR840004828A (ko) 1984-10-24
EP0104231A4 (fr) 1985-10-30
WO1983003712A1 (fr) 1983-10-27
CA1201817A (fr) 1986-03-11
IT1164597B (it) 1987-04-15
JPS59500541A (ja) 1984-03-29
IT8348015A0 (it) 1983-03-29

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 19831203

AK Designated contracting states

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Inventor name: THEOBALD, PAUL R.

Inventor name: HUNTER, WILLIAM L.