EP0098968B1 - Two piece casting wheel - Google Patents

Two piece casting wheel Download PDF

Info

Publication number
EP0098968B1
EP0098968B1 EP19830105575 EP83105575A EP0098968B1 EP 0098968 B1 EP0098968 B1 EP 0098968B1 EP 19830105575 EP19830105575 EP 19830105575 EP 83105575 A EP83105575 A EP 83105575A EP 0098968 B1 EP0098968 B1 EP 0098968B1
Authority
EP
European Patent Office
Prior art keywords
wheel
core
rim
casting
recited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP19830105575
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0098968A1 (en
Inventor
Boleslaw Ludwik Budzyn
Charles Elwood Carlson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Allied Corp
AlliedSignal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23572488&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP0098968(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Allied Corp, AlliedSignal Inc filed Critical Allied Corp
Publication of EP0098968A1 publication Critical patent/EP0098968A1/en
Application granted granted Critical
Publication of EP0098968B1 publication Critical patent/EP0098968B1/en
Expired legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/005—Continuous casting of metals, i.e. casting in indefinite lengths of wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/06—Continuous casting of metals, i.e. casting in indefinite lengths into moulds with travelling walls, e.g. with rolls, plates, belts, caterpillars
    • B22D11/0637—Accessories therefor
    • B22D11/068—Accessories therefor for cooling the cast product during its passage through the mould surfaces
    • B22D11/0682—Accessories therefor for cooling the cast product during its passage through the mould surfaces by cooling the casting wheel

Definitions

  • Figs. 2 and 3 show a preferred embodiment of the casting wheel of the invention wherein the coolant means is comprised generally of hub shaft member 1 and two flange members 12.
  • hub shaft member 1 has a concentric axis of rotation 28 and two axial end portions 2.
  • the end portions delimit axial coolant chambers 3 and 4, and at least one, but preferably a plurality of coolant supply passages 5 and 6 communicate radially from chambers 3 and 4, respectively.
  • An annular wheel core member 7, concentrically connected to hub shaft 1, is adapted to rotate therewith and provides two axially facing side portions 9.
  • a plurality of axially extending channels 8 are formed aboutthe outer peripheral surface 11 of the core, and a cylindrical, axially extending wheel rim 10 is mounted thereon.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
  • Continuous Casting (AREA)
EP19830105575 1982-07-13 1983-06-07 Two piece casting wheel Expired EP0098968B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39775582A 1982-07-13 1982-07-13
US397755 1982-07-13

Publications (2)

Publication Number Publication Date
EP0098968A1 EP0098968A1 (en) 1984-01-25
EP0098968B1 true EP0098968B1 (en) 1987-06-03

Family

ID=23572488

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19830105575 Expired EP0098968B1 (en) 1982-07-13 1983-06-07 Two piece casting wheel

Country Status (5)

Country Link
EP (1) EP0098968B1 (enrdf_load_stackoverflow)
JP (1) JPS5921452A (enrdf_load_stackoverflow)
AU (1) AU560682B2 (enrdf_load_stackoverflow)
CA (1) CA1206320A (enrdf_load_stackoverflow)
DE (1) DE3371877D1 (enrdf_load_stackoverflow)

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6844615B1 (en) 2003-03-13 2005-01-18 Amkor Technology, Inc. Leadframe package for semiconductor devices
US6846704B2 (en) 2001-03-27 2005-01-25 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
US6873032B1 (en) 2001-04-04 2005-03-29 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US6873041B1 (en) 2001-11-07 2005-03-29 Amkor Technology, Inc. Power semiconductor package with strap
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US6953988B2 (en) 2000-03-25 2005-10-11 Amkor Technology, Inc. Semiconductor package
US6965157B1 (en) 1999-11-09 2005-11-15 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6998702B1 (en) 2001-09-19 2006-02-14 Amkor Technology, Inc. Front edge chamfer feature for fully-molded memory cards
US7005326B1 (en) 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US7045882B2 (en) 2000-12-29 2006-05-16 Amkor Technology, Inc. Semiconductor package including flip chip
US7057268B1 (en) 2004-01-27 2006-06-06 Amkor Technology, Inc. Cavity case with clip/plug for use on multi-media card
US7057280B2 (en) 1998-11-20 2006-06-06 Amkor Technology, Inc. Leadframe having lead locks to secure leads to encapsulant
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
US7115445B2 (en) 1999-10-15 2006-10-03 Amkor Technology, Inc. Semiconductor package having reduced thickness
US7138707B1 (en) 2003-10-21 2006-11-21 Amkor Technology, Inc. Semiconductor package including leads and conductive posts for providing increased functionality
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7170150B2 (en) 2001-03-27 2007-01-30 Amkor Technology, Inc. Lead frame for semiconductor package
US7190062B1 (en) 2004-06-15 2007-03-13 Amkor Technology, Inc. Embedded leadframe semiconductor package
US7202554B1 (en) 2004-08-19 2007-04-10 Amkor Technology, Inc. Semiconductor package and its manufacturing method
US7211471B1 (en) 2002-09-09 2007-05-01 Amkor Technology, Inc. Exposed lead QFP package fabricated through the use of a partial saw process
US7211879B1 (en) 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US7217991B1 (en) 2004-10-22 2007-05-15 Amkor Technology, Inc. Fan-in leadframe semiconductor package
US7245007B1 (en) 2003-09-18 2007-07-17 Amkor Technology, Inc. Exposed lead interposer leadframe package
US7485952B1 (en) 2001-09-19 2009-02-03 Amkor Technology, Inc. Drop resistant bumpers for fully molded memory cards
US7598598B1 (en) 2003-02-05 2009-10-06 Amkor Technology, Inc. Offset etched corner leads for semiconductor package

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0620614B2 (ja) * 1986-09-06 1994-03-23 川崎製鉄株式会社 急冷金属薄帯製造用の冷却ロ−ル
FR2654372B1 (fr) * 1989-11-16 1992-01-17 Siderurgie Fse Inst Rech Cylindre pour un dispositif de coulee continue sur un ou entre deux cylindres.
JPH0755914Y2 (ja) * 1990-03-10 1995-12-25 株式会社寺田製作所 製茶蒸機への蒸気供給量制御装置
GB9100151D0 (en) * 1991-01-04 1991-02-20 Davy Distington Ltd Strip caster roll
US6639308B1 (en) 1999-12-16 2003-10-28 Amkor Technology, Inc. Near chip size semiconductor package
DE60331698D1 (de) 2003-04-02 2010-04-22 Christopher Julian Travis Numerisch gesteuerter Oszillator und Verfahren zum Erzeugen eines Ereignis-Taktes
CN102794418B (zh) * 2012-08-24 2014-07-09 浙江正耀环保科技有限公司 非晶喷带机
JP2014091157A (ja) * 2012-11-06 2014-05-19 Saco Llc 非晶質合金箔帯の製造装置および非晶質合金箔帯の製造方法
CN103586429B (zh) * 2013-11-08 2015-05-27 青岛云路新能源科技有限公司 非晶结晶器
CN106735011A (zh) * 2017-02-24 2017-05-31 佛山科学技术学院 可轴向分流的非晶结晶器铜套冷却结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757847A (en) * 1971-10-07 1973-09-11 P Sofinsky Roll mould with cooling system
JPS5138014U (enrdf_load_stackoverflow) * 1974-09-14 1976-03-22
JPS5148117U (enrdf_load_stackoverflow) * 1974-10-07 1976-04-10
FR2297351A1 (fr) * 1975-01-10 1976-08-06 Fives Cail Babcock Perfectionnements aux rouleaux, notamment du type a refroidissement interne pour la coulee continue
FR2314788A1 (fr) * 1975-06-17 1977-01-14 Fives Cail Babcock Perfectionnements aux rouleaux du type a refroidissement interne
JPS5211932U (enrdf_load_stackoverflow) * 1975-07-15 1977-01-27
JPS5250188U (enrdf_load_stackoverflow) * 1975-10-07 1977-04-09
US4142571A (en) * 1976-10-22 1979-03-06 Allied Chemical Corporation Continuous casting method for metallic strips
US4307771A (en) * 1980-01-25 1981-12-29 Allied Corporation Forced-convection-cooled casting wheel
JPS5714444A (en) * 1980-06-27 1982-01-25 Hitachi Ltd Thin sheet producing device

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7005326B1 (en) 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US7057280B2 (en) 1998-11-20 2006-06-06 Amkor Technology, Inc. Leadframe having lead locks to secure leads to encapsulant
US7115445B2 (en) 1999-10-15 2006-10-03 Amkor Technology, Inc. Semiconductor package having reduced thickness
US6965157B1 (en) 1999-11-09 2005-11-15 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6953988B2 (en) 2000-03-25 2005-10-11 Amkor Technology, Inc. Semiconductor package
US7045882B2 (en) 2000-12-29 2006-05-16 Amkor Technology, Inc. Semiconductor package including flip chip
US6846704B2 (en) 2001-03-27 2005-01-25 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
US7170150B2 (en) 2001-03-27 2007-01-30 Amkor Technology, Inc. Lead frame for semiconductor package
US6873032B1 (en) 2001-04-04 2005-03-29 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US6998702B1 (en) 2001-09-19 2006-02-14 Amkor Technology, Inc. Front edge chamfer feature for fully-molded memory cards
US7485952B1 (en) 2001-09-19 2009-02-03 Amkor Technology, Inc. Drop resistant bumpers for fully molded memory cards
US6873041B1 (en) 2001-11-07 2005-03-29 Amkor Technology, Inc. Power semiconductor package with strap
US7211471B1 (en) 2002-09-09 2007-05-01 Amkor Technology, Inc. Exposed lead QFP package fabricated through the use of a partial saw process
US7598598B1 (en) 2003-02-05 2009-10-06 Amkor Technology, Inc. Offset etched corner leads for semiconductor package
US6844615B1 (en) 2003-03-13 2005-01-18 Amkor Technology, Inc. Leadframe package for semiconductor devices
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US7245007B1 (en) 2003-09-18 2007-07-17 Amkor Technology, Inc. Exposed lead interposer leadframe package
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US7138707B1 (en) 2003-10-21 2006-11-21 Amkor Technology, Inc. Semiconductor package including leads and conductive posts for providing increased functionality
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7211879B1 (en) 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US7057268B1 (en) 2004-01-27 2006-06-06 Amkor Technology, Inc. Cavity case with clip/plug for use on multi-media card
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
US7190062B1 (en) 2004-06-15 2007-03-13 Amkor Technology, Inc. Embedded leadframe semiconductor package
US7202554B1 (en) 2004-08-19 2007-04-10 Amkor Technology, Inc. Semiconductor package and its manufacturing method
US7217991B1 (en) 2004-10-22 2007-05-15 Amkor Technology, Inc. Fan-in leadframe semiconductor package

Also Published As

Publication number Publication date
JPS5921452A (ja) 1984-02-03
CA1206320A (en) 1986-06-24
AU560682B2 (en) 1987-04-16
EP0098968A1 (en) 1984-01-25
DE3371877D1 (en) 1987-07-09
JPH0218181B2 (enrdf_load_stackoverflow) 1990-04-24
AU1527283A (en) 1984-01-19

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