DE3371877D1 - Two piece casting wheel - Google Patents
Two piece casting wheelInfo
- Publication number
- DE3371877D1 DE3371877D1 DE8383105575T DE3371877T DE3371877D1 DE 3371877 D1 DE3371877 D1 DE 3371877D1 DE 8383105575 T DE8383105575 T DE 8383105575T DE 3371877 T DE3371877 T DE 3371877T DE 3371877 D1 DE3371877 D1 DE 3371877D1
- Authority
- DE
- Germany
- Prior art keywords
- casting wheel
- piece casting
- piece
- wheel
- casting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005266 casting Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/005—Continuous casting of metals, i.e. casting in indefinite lengths of wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/06—Continuous casting of metals, i.e. casting in indefinite lengths into moulds with travelling walls, e.g. with rolls, plates, belts, caterpillars
- B22D11/0637—Accessories therefor
- B22D11/068—Accessories therefor for cooling the cast product during its passage through the mould surfaces
- B22D11/0682—Accessories therefor for cooling the cast product during its passage through the mould surfaces by cooling the casting wheel
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
- Continuous Casting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39775582A | 1982-07-13 | 1982-07-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3371877D1 true DE3371877D1 (en) | 1987-07-09 |
Family
ID=23572488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8383105575T Expired DE3371877D1 (en) | 1982-07-13 | 1983-06-07 | Two piece casting wheel |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0098968B1 (enrdf_load_stackoverflow) |
JP (1) | JPS5921452A (enrdf_load_stackoverflow) |
AU (1) | AU560682B2 (enrdf_load_stackoverflow) |
CA (1) | CA1206320A (enrdf_load_stackoverflow) |
DE (1) | DE3371877D1 (enrdf_load_stackoverflow) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0620614B2 (ja) * | 1986-09-06 | 1994-03-23 | 川崎製鉄株式会社 | 急冷金属薄帯製造用の冷却ロ−ル |
FR2654372B1 (fr) * | 1989-11-16 | 1992-01-17 | Siderurgie Fse Inst Rech | Cylindre pour un dispositif de coulee continue sur un ou entre deux cylindres. |
JPH0755914Y2 (ja) * | 1990-03-10 | 1995-12-25 | 株式会社寺田製作所 | 製茶蒸機への蒸気供給量制御装置 |
GB9100151D0 (en) * | 1991-01-04 | 1991-02-20 | Davy Distington Ltd | Strip caster roll |
US7005326B1 (en) | 1998-06-24 | 2006-02-28 | Amkor Technology, Inc. | Method of making an integrated circuit package |
US7071541B1 (en) | 1998-06-24 | 2006-07-04 | Amkor Technology, Inc. | Plastic integrated circuit package and method and leadframe for making the package |
US6893900B1 (en) | 1998-06-24 | 2005-05-17 | Amkor Technology, Inc. | Method of making an integrated circuit package |
JP2000164788A (ja) | 1998-11-20 | 2000-06-16 | Anam Semiconductor Inc | 半導体パッケ―ジ用リ―ドフレ―ムとこれを用いた半導体パッケ―ジ及びその製造方法 |
KR20010037247A (ko) | 1999-10-15 | 2001-05-07 | 마이클 디. 오브라이언 | 반도체패키지 |
US6847103B1 (en) | 1999-11-09 | 2005-01-25 | Amkor Technology, Inc. | Semiconductor package with exposed die pad and body-locking leadframe |
US6639308B1 (en) | 1999-12-16 | 2003-10-28 | Amkor Technology, Inc. | Near chip size semiconductor package |
KR100583494B1 (ko) | 2000-03-25 | 2006-05-24 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지 |
KR20020058209A (ko) | 2000-12-29 | 2002-07-12 | 마이클 디. 오브라이언 | 반도체패키지 |
KR100393448B1 (ko) | 2001-03-27 | 2003-08-02 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 및 그 제조 방법 |
KR100369393B1 (ko) | 2001-03-27 | 2003-02-05 | 앰코 테크놀로지 코리아 주식회사 | 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법 |
US6597059B1 (en) | 2001-04-04 | 2003-07-22 | Amkor Technology, Inc. | Thermally enhanced chip scale lead on chip semiconductor package |
US7485952B1 (en) | 2001-09-19 | 2009-02-03 | Amkor Technology, Inc. | Drop resistant bumpers for fully molded memory cards |
US6900527B1 (en) | 2001-09-19 | 2005-05-31 | Amkor Technology, Inc. | Lead-frame method and assembly for interconnecting circuits within a circuit module |
US6630726B1 (en) | 2001-11-07 | 2003-10-07 | Amkor Technology, Inc. | Power semiconductor package with strap |
US6818973B1 (en) | 2002-09-09 | 2004-11-16 | Amkor Technology, Inc. | Exposed lead QFP package fabricated through the use of a partial saw process |
US7190062B1 (en) | 2004-06-15 | 2007-03-13 | Amkor Technology, Inc. | Embedded leadframe semiconductor package |
US6847099B1 (en) | 2003-02-05 | 2005-01-25 | Amkor Technology Inc. | Offset etched corner leads for semiconductor package |
US6794740B1 (en) | 2003-03-13 | 2004-09-21 | Amkor Technology, Inc. | Leadframe package for semiconductor devices |
DE60331698D1 (de) | 2003-04-02 | 2010-04-22 | Christopher Julian Travis | Numerisch gesteuerter Oszillator und Verfahren zum Erzeugen eines Ereignis-Taktes |
US7008825B1 (en) | 2003-05-27 | 2006-03-07 | Amkor Technology, Inc. | Leadframe strip having enhanced testability |
US7245007B1 (en) | 2003-09-18 | 2007-07-17 | Amkor Technology, Inc. | Exposed lead interposer leadframe package |
US6921967B2 (en) | 2003-09-24 | 2005-07-26 | Amkor Technology, Inc. | Reinforced die pad support structure |
US7138707B1 (en) | 2003-10-21 | 2006-11-21 | Amkor Technology, Inc. | Semiconductor package including leads and conductive posts for providing increased functionality |
US7144517B1 (en) | 2003-11-07 | 2006-12-05 | Amkor Technology, Inc. | Manufacturing method for leadframe and for semiconductor package using the leadframe |
US7211879B1 (en) | 2003-11-12 | 2007-05-01 | Amkor Technology, Inc. | Semiconductor package with chamfered corners and method of manufacturing the same |
US7057268B1 (en) | 2004-01-27 | 2006-06-06 | Amkor Technology, Inc. | Cavity case with clip/plug for use on multi-media card |
US7091594B1 (en) | 2004-01-28 | 2006-08-15 | Amkor Technology, Inc. | Leadframe type semiconductor package having reduced inductance and its manufacturing method |
US7202554B1 (en) | 2004-08-19 | 2007-04-10 | Amkor Technology, Inc. | Semiconductor package and its manufacturing method |
US7217991B1 (en) | 2004-10-22 | 2007-05-15 | Amkor Technology, Inc. | Fan-in leadframe semiconductor package |
CN102794418B (zh) * | 2012-08-24 | 2014-07-09 | 浙江正耀环保科技有限公司 | 非晶喷带机 |
JP2014091157A (ja) * | 2012-11-06 | 2014-05-19 | Saco Llc | 非晶質合金箔帯の製造装置および非晶質合金箔帯の製造方法 |
CN103586429B (zh) * | 2013-11-08 | 2015-05-27 | 青岛云路新能源科技有限公司 | 非晶结晶器 |
CN106735011A (zh) * | 2017-02-24 | 2017-05-31 | 佛山科学技术学院 | 可轴向分流的非晶结晶器铜套冷却结构 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3757847A (en) * | 1971-10-07 | 1973-09-11 | P Sofinsky | Roll mould with cooling system |
JPS5138014U (enrdf_load_stackoverflow) * | 1974-09-14 | 1976-03-22 | ||
JPS5148117U (enrdf_load_stackoverflow) * | 1974-10-07 | 1976-04-10 | ||
FR2297351A1 (fr) * | 1975-01-10 | 1976-08-06 | Fives Cail Babcock | Perfectionnements aux rouleaux, notamment du type a refroidissement interne pour la coulee continue |
FR2314788A1 (fr) * | 1975-06-17 | 1977-01-14 | Fives Cail Babcock | Perfectionnements aux rouleaux du type a refroidissement interne |
JPS5211932U (enrdf_load_stackoverflow) * | 1975-07-15 | 1977-01-27 | ||
JPS5250188U (enrdf_load_stackoverflow) * | 1975-10-07 | 1977-04-09 | ||
US4142571A (en) * | 1976-10-22 | 1979-03-06 | Allied Chemical Corporation | Continuous casting method for metallic strips |
US4307771A (en) * | 1980-01-25 | 1981-12-29 | Allied Corporation | Forced-convection-cooled casting wheel |
JPS5714444A (en) * | 1980-06-27 | 1982-01-25 | Hitachi Ltd | Thin sheet producing device |
-
1983
- 1983-06-01 AU AU15272/83A patent/AU560682B2/en not_active Ceased
- 1983-06-07 EP EP19830105575 patent/EP0098968B1/en not_active Expired
- 1983-06-07 DE DE8383105575T patent/DE3371877D1/de not_active Expired
- 1983-07-07 JP JP12406883A patent/JPS5921452A/ja active Granted
- 1983-07-12 CA CA000432290A patent/CA1206320A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5921452A (ja) | 1984-02-03 |
CA1206320A (en) | 1986-06-24 |
AU560682B2 (en) | 1987-04-16 |
EP0098968A1 (en) | 1984-01-25 |
EP0098968B1 (en) | 1987-06-03 |
JPH0218181B2 (enrdf_load_stackoverflow) | 1990-04-24 |
AU1527283A (en) | 1984-01-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8331 | Complete revocation |