AU560682B2 - Two piece chilled casting wheel - Google Patents

Two piece chilled casting wheel

Info

Publication number
AU560682B2
AU560682B2 AU15272/83A AU1527283A AU560682B2 AU 560682 B2 AU560682 B2 AU 560682B2 AU 15272/83 A AU15272/83 A AU 15272/83A AU 1527283 A AU1527283 A AU 1527283A AU 560682 B2 AU560682 B2 AU 560682B2
Authority
AU
Australia
Prior art keywords
piece
casting wheel
chilled casting
chilled
wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU15272/83A
Other languages
English (en)
Other versions
AU1527283A (en
Inventor
Boleslaw Ludwik Budzyn
Charles Elwood Carlson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Allied Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23572488&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU560682(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Allied Corp filed Critical Allied Corp
Publication of AU1527283A publication Critical patent/AU1527283A/en
Application granted granted Critical
Publication of AU560682B2 publication Critical patent/AU560682B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/005—Continuous casting of metals, i.e. casting in indefinite lengths of wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/06—Continuous casting of metals, i.e. casting in indefinite lengths into moulds with travelling walls, e.g. with rolls, plates, belts, caterpillars
    • B22D11/0637—Accessories therefor
    • B22D11/068—Accessories therefor for cooling the cast product during its passage through the mould surfaces
    • B22D11/0682—Accessories therefor for cooling the cast product during its passage through the mould surfaces by cooling the casting wheel

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
  • Continuous Casting (AREA)
AU15272/83A 1982-07-13 1983-06-01 Two piece chilled casting wheel Ceased AU560682B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39775582A 1982-07-13 1982-07-13
US397755 1982-07-13

Publications (2)

Publication Number Publication Date
AU1527283A AU1527283A (en) 1984-01-19
AU560682B2 true AU560682B2 (en) 1987-04-16

Family

ID=23572488

Family Applications (1)

Application Number Title Priority Date Filing Date
AU15272/83A Ceased AU560682B2 (en) 1982-07-13 1983-06-01 Two piece chilled casting wheel

Country Status (5)

Country Link
EP (1) EP0098968B1 (enrdf_load_stackoverflow)
JP (1) JPS5921452A (enrdf_load_stackoverflow)
AU (1) AU560682B2 (enrdf_load_stackoverflow)
CA (1) CA1206320A (enrdf_load_stackoverflow)
DE (1) DE3371877D1 (enrdf_load_stackoverflow)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0620614B2 (ja) * 1986-09-06 1994-03-23 川崎製鉄株式会社 急冷金属薄帯製造用の冷却ロ−ル
FR2654372B1 (fr) * 1989-11-16 1992-01-17 Siderurgie Fse Inst Rech Cylindre pour un dispositif de coulee continue sur un ou entre deux cylindres.
JPH0755914Y2 (ja) * 1990-03-10 1995-12-25 株式会社寺田製作所 製茶蒸機への蒸気供給量制御装置
GB9100151D0 (en) * 1991-01-04 1991-02-20 Davy Distington Ltd Strip caster roll
US7005326B1 (en) 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
JP2000164788A (ja) 1998-11-20 2000-06-16 Anam Semiconductor Inc 半導体パッケ―ジ用リ―ドフレ―ムとこれを用いた半導体パッケ―ジ及びその製造方法
KR20010037247A (ko) 1999-10-15 2001-05-07 마이클 디. 오브라이언 반도체패키지
US6847103B1 (en) 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6639308B1 (en) 1999-12-16 2003-10-28 Amkor Technology, Inc. Near chip size semiconductor package
KR100583494B1 (ko) 2000-03-25 2006-05-24 앰코 테크놀로지 코리아 주식회사 반도체패키지
KR20020058209A (ko) 2000-12-29 2002-07-12 마이클 디. 오브라이언 반도체패키지
KR100393448B1 (ko) 2001-03-27 2003-08-02 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
KR100369393B1 (ko) 2001-03-27 2003-02-05 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
US6597059B1 (en) 2001-04-04 2003-07-22 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package
US7485952B1 (en) 2001-09-19 2009-02-03 Amkor Technology, Inc. Drop resistant bumpers for fully molded memory cards
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US6630726B1 (en) 2001-11-07 2003-10-07 Amkor Technology, Inc. Power semiconductor package with strap
US6818973B1 (en) 2002-09-09 2004-11-16 Amkor Technology, Inc. Exposed lead QFP package fabricated through the use of a partial saw process
US7190062B1 (en) 2004-06-15 2007-03-13 Amkor Technology, Inc. Embedded leadframe semiconductor package
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US6794740B1 (en) 2003-03-13 2004-09-21 Amkor Technology, Inc. Leadframe package for semiconductor devices
DE60331698D1 (de) 2003-04-02 2010-04-22 Christopher Julian Travis Numerisch gesteuerter Oszillator und Verfahren zum Erzeugen eines Ereignis-Taktes
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US7245007B1 (en) 2003-09-18 2007-07-17 Amkor Technology, Inc. Exposed lead interposer leadframe package
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US7138707B1 (en) 2003-10-21 2006-11-21 Amkor Technology, Inc. Semiconductor package including leads and conductive posts for providing increased functionality
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7211879B1 (en) 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US7057268B1 (en) 2004-01-27 2006-06-06 Amkor Technology, Inc. Cavity case with clip/plug for use on multi-media card
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
US7202554B1 (en) 2004-08-19 2007-04-10 Amkor Technology, Inc. Semiconductor package and its manufacturing method
US7217991B1 (en) 2004-10-22 2007-05-15 Amkor Technology, Inc. Fan-in leadframe semiconductor package
CN102794418B (zh) * 2012-08-24 2014-07-09 浙江正耀环保科技有限公司 非晶喷带机
JP2014091157A (ja) * 2012-11-06 2014-05-19 Saco Llc 非晶質合金箔帯の製造装置および非晶質合金箔帯の製造方法
CN103586429B (zh) * 2013-11-08 2015-05-27 青岛云路新能源科技有限公司 非晶结晶器
CN106735011A (zh) * 2017-02-24 2017-05-31 佛山科学技术学院 可轴向分流的非晶结晶器铜套冷却结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757847A (en) * 1971-10-07 1973-09-11 P Sofinsky Roll mould with cooling system
JPS5138014U (enrdf_load_stackoverflow) * 1974-09-14 1976-03-22
JPS5148117U (enrdf_load_stackoverflow) * 1974-10-07 1976-04-10
FR2297351A1 (fr) * 1975-01-10 1976-08-06 Fives Cail Babcock Perfectionnements aux rouleaux, notamment du type a refroidissement interne pour la coulee continue
FR2314788A1 (fr) * 1975-06-17 1977-01-14 Fives Cail Babcock Perfectionnements aux rouleaux du type a refroidissement interne
JPS5211932U (enrdf_load_stackoverflow) * 1975-07-15 1977-01-27
JPS5250188U (enrdf_load_stackoverflow) * 1975-10-07 1977-04-09
US4142571A (en) * 1976-10-22 1979-03-06 Allied Chemical Corporation Continuous casting method for metallic strips
US4307771A (en) * 1980-01-25 1981-12-29 Allied Corporation Forced-convection-cooled casting wheel
JPS5714444A (en) * 1980-06-27 1982-01-25 Hitachi Ltd Thin sheet producing device

Also Published As

Publication number Publication date
JPS5921452A (ja) 1984-02-03
CA1206320A (en) 1986-06-24
EP0098968A1 (en) 1984-01-25
DE3371877D1 (en) 1987-07-09
EP0098968B1 (en) 1987-06-03
JPH0218181B2 (enrdf_load_stackoverflow) 1990-04-24
AU1527283A (en) 1984-01-19

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Legal Events

Date Code Title Description
MK14 Patent ceased section 143(a) (annual fees not paid) or expired