EA199900509A1 - Способ герметизации микросхемы на кристаллодержателе - Google Patents

Способ герметизации микросхемы на кристаллодержателе

Info

Publication number
EA199900509A1
EA199900509A1 EA199900509A EA199900509A EA199900509A1 EA 199900509 A1 EA199900509 A1 EA 199900509A1 EA 199900509 A EA199900509 A EA 199900509A EA 199900509 A EA199900509 A EA 199900509A EA 199900509 A1 EA199900509 A1 EA 199900509A1
Authority
EA
Eurasian Patent Office
Prior art keywords
threshold
sealing
crystal holder
microcircuit
holder
Prior art date
Application number
EA199900509A
Other languages
English (en)
Inventor
Бенджамин Слагер
Original Assignee
Недкард
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Недкард filed Critical Недкард
Publication of EA199900509A1 publication Critical patent/EA199900509A1/ru

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C41/20—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. moulding inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C41/12—Spreading-out the material on a substrate, e.g. on the surface of a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/34—Component parts, details or accessories; Auxiliary operations
    • B29C41/36—Feeding the material on to the mould, core or other substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/001—Shaping in several steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B29K2101/10—Thermosetting resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

Способ герметизации микросхемы (10) на кристаллодержателе (12), посредством которого микросхему (10) располагают на кристаллодержателе (12), на кристаллодержателе (12) вокруг микросхемы (10) образуют порог (16а, 16b), в пространство, ограниченное порогом (16а, 16b), заливают герметизирующий материал (18) и полученную герметизированную структуру отверждают. На первом отдельном этапе на кристаллодержателе образуют только порог (16а, 16b) из термозатвердевающего материала при относительно высокой температуре и отверждают, по меньшей мере, частично, а на следующем втором этапе пространство, ограниченное порогом, заполняют тем же самым термозатвердевающим материалом при относительно низкой температуре.Международная заявка была опубликована вместе с отчетом о международном поиске.
EA199900509A 1996-11-29 1997-11-27 Способ герметизации микросхемы на кристаллодержателе EA199900509A1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1004651A NL1004651C2 (nl) 1996-11-29 1996-11-29 Werkwijze voor het inkapselen van een chip op een drager.
PCT/NL1997/000651 WO1998023427A1 (en) 1996-11-29 1997-11-27 Method for encapsulating a chip on a carrier

Publications (1)

Publication Number Publication Date
EA199900509A1 true EA199900509A1 (ru) 2000-04-24

Family

ID=19763957

Family Applications (1)

Application Number Title Priority Date Filing Date
EA199900509A EA199900509A1 (ru) 1996-11-29 1997-11-27 Способ герметизации микросхемы на кристаллодержателе

Country Status (6)

Country Link
US (1) US6399004B1 (ru)
EP (1) EP0942818A1 (ru)
AU (1) AU5415998A (ru)
EA (1) EA199900509A1 (ru)
NL (1) NL1004651C2 (ru)
WO (1) WO1998023427A1 (ru)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6399425B1 (en) * 1998-09-02 2002-06-04 Micron Technology, Inc. Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices
US7394153B2 (en) * 1999-12-17 2008-07-01 Osram Opto Semiconductors Gmbh Encapsulation of electronic devices
JP2003517182A (ja) * 1999-12-17 2003-05-20 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 有機ｌｅｄデバイスのカプセル封じ
JP4608182B2 (ja) * 2000-09-06 2011-01-05 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Ｏｌｅｄデバイスのカプセル化
US6737002B1 (en) * 2002-02-04 2004-05-18 Lockheed Martin Corporation Fabrication of plastic module with exposed backside contact
JP3893301B2 (ja) * 2002-03-25 2007-03-14 沖電気工業株式会社 半導体装置の製造方法および半導体モジュールの製造方法
ITTO20030978A1 (it) * 2003-12-05 2005-06-06 Ansaldo Segnalamento Ferroviario S P A Boa (balise) per segnalazione ferroviaria e metodo di realizzazione della boa stessa.
WO2007037055A1 (ja) * 2005-09-29 2007-04-05 Nec Corporation 半導体パッケージ、基板、この半導体パッケージ又は基板を用いた電子機器、半導体パッケージの反り矯正方法
EP1914809A1 (en) * 2006-10-20 2008-04-23 Tridonic Optoelectronics GmbH Cover for optoelectronic components
TWI483418B (zh) * 2009-04-09 2015-05-01 Lextar Electronics Corp 發光二極體封裝方法
TWI403005B (zh) * 2009-10-12 2013-07-21 Intematix Technology Ct Corp 發光二極體及其製作方法
JP2011176112A (ja) * 2010-02-24 2011-09-08 Renesas Electronics Corp 半導体集積回路及びその製造方法
DE102010028815A1 (de) 2010-05-10 2011-11-10 Nedcard B.V. Verfahren zum Verkapseln eines Chips
DE102010044470B4 (de) 2010-09-06 2018-06-28 Heraeus Noblelight Gmbh Verfahren zur Beschichtung eines optoelektronischen Chip-On-Board-Moduls, optoelektronisches Chip-On-Board-Modul und System damit
US9710745B1 (en) * 2012-02-09 2017-07-18 Dynamics Inc. Systems and methods for automated assembly of dynamic magnetic stripe communications devices
TWI548005B (zh) * 2014-01-24 2016-09-01 環旭電子股份有限公司 選擇性電子封裝模組的製造方法
CN107231760A (zh) * 2017-06-27 2017-10-03 北京计算机技术及应用研究所 一种电路板组件的高精度铸模灌封方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340347A (en) * 1964-10-12 1967-09-05 Corning Glass Works Enclosed electronic device
US3622419A (en) * 1969-10-08 1971-11-23 Motorola Inc Method of packaging an optoelectrical device
US3668299A (en) * 1971-04-29 1972-06-06 Beckman Instruments Inc Electrical circuit module and method of assembly
GB2096825A (en) * 1981-04-09 1982-10-20 Sibbald Alastair Chemical sensitive semiconductor field effect transducer
JPS61101054A (ja) * 1984-10-24 1986-05-19 Hitachi Micro Comput Eng Ltd 半導体装置およびその製造方法
US4812421A (en) * 1987-10-26 1989-03-14 Motorola, Inc. Tab-type semiconductor process
US4835120A (en) * 1987-01-12 1989-05-30 Debendra Mallik Method of making a multilayer molded plastic IC package
JPS63310140A (ja) * 1987-06-12 1988-12-19 Canon Inc 電子回路装置とその製造方法
JPH01128438A (ja) * 1987-11-12 1989-05-22 Nitto Denko Corp 封止材
GB8727902D0 (en) * 1987-11-28 1987-12-31 Emi Plc Thorn Method of forming a solid article
US4961886A (en) * 1988-06-09 1990-10-09 Dow Corning Corporation Method of controlling flow by a radiation formed dam
JPH02143436A (ja) * 1988-11-24 1990-06-01 Nec Corp フィルムキャリヤ半導体装置の樹脂封止方法
US5049526A (en) * 1989-06-07 1991-09-17 Motorola, Inc. Method for fabricating semiconductor device including package
US5344600A (en) * 1989-06-07 1994-09-06 Motorola, Inc. Method for encapsulating semiconductor devices with package bodies
JPH03257938A (ja) * 1990-03-08 1991-11-18 Fujitsu Ltd ベアチップ封止方法
JPH04201576A (ja) * 1990-11-30 1992-07-22 Sharp Corp サーマルヘツド及びその製造方法
JP2902497B2 (ja) * 1991-03-29 1999-06-07 東芝ライテック株式会社 混成集積回路基板の製造方法
JPH04303989A (ja) * 1991-03-30 1992-10-27 Toshiba Lighting & Technol Corp 厚膜回路基板
US5577319A (en) * 1995-03-31 1996-11-26 Motorola, Inc. Method of encapsulating a crystal oscillator

Also Published As

Publication number Publication date
NL1004651C2 (nl) 1998-06-03
EP0942818A1 (en) 1999-09-22
US6399004B1 (en) 2002-06-04
AU5415998A (en) 1998-06-22
WO1998023427A1 (en) 1998-06-04

Similar Documents

Publication Publication Date Title
EA199900509A1 (ru) Способ герметизации микросхемы на кристаллодержателе
DK306086A (da) Hermetisk motor-kompressorenhed til koelekredsloeb
IT1194027B (it) Mosfet di potenza dotato di una regione anodica
DE3580779D1 (de) Oelbestaendige silikondichtungsmasse mit niedrigem modul.
IT8123533A0 (it) Procedimento per la fabbricazione di mosfet di elevata potenza, con elevata densita'.
BR8407003A (pt) Processo e aparelho de injecao de combustivel
EA200000672A1 (ru) Кристалический терипаратид
PT73033B (en) External combustion engine with alternative stroke and method for operating same
KR890015364A (ko) 전도도 변조형 mosfet의 제조방법
DE3485273D1 (de) Holhraumresonatorvorrichtung zur leistungsverteilung und -zuschaltung.
BR8503054A (pt) Compressor de refrigeracao hermetico
AT386678B (de) Kaeltemaschine mit gekapseltem motorverdichter
DE58909301D1 (de) Hochfrequenz-Leistungsgenerator.
DE69313833T2 (de) Verringerung der Ausschaltszeit eines Ausgangsleistungstransistors
DK526783A (da) Forbedret stamme af clostridium acetobutylicum og fremgangsmaade til fremstilling af samme
EA199900326A1 (ru) Промежуточные соединения и способ получения оланзапина
EP0041360A3 (en) Resonant power module and method of operation thereof
MX157036A (es) Metodo para encapsular un material organico
EA199900027A1 (ru) Способ получения некоторых азациклогексапептидов
JPS5795672A (en) Field effect transistor with high breaking frequency
KR860700078A (ko) 에피택셜충의 바이어스 집적회로 및 그 방법
DE3584884D1 (de) Hochfrequenzpolarisator.
ES542189A0 (es) Un procedimiento no acuoso mejorado para tenir un material tingible a una temperatura elevada
PL213082A1 (pl) Kineskop z zabezpieczeniem antyimplozyjnym i sposob jego wykonania
DK159288C (da) Krumtapaksel til hermetisk koelekompressor