NL1004651C2 - Werkwijze voor het inkapselen van een chip op een drager. - Google Patents

Werkwijze voor het inkapselen van een chip op een drager. Download PDF

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Publication number
NL1004651C2
NL1004651C2 NL1004651A NL1004651A NL1004651C2 NL 1004651 C2 NL1004651 C2 NL 1004651C2 NL 1004651 A NL1004651 A NL 1004651A NL 1004651 A NL1004651 A NL 1004651A NL 1004651 C2 NL1004651 C2 NL 1004651C2
Authority
NL
Netherlands
Prior art keywords
dam
carrier
chip
temperature
encapsulating
Prior art date
Application number
NL1004651A
Other languages
English (en)
Dutch (nl)
Inventor
Benjamin Slager
Original Assignee
Nedcard
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nedcard filed Critical Nedcard
Priority to NL1004651A priority Critical patent/NL1004651C2/nl
Priority to AU54159/98A priority patent/AU5415998A/en
Priority to US09/319,004 priority patent/US6399004B1/en
Priority to EP97947998A priority patent/EP0942818A1/en
Priority to EA199900509A priority patent/EA199900509A1/ru
Priority to PCT/NL1997/000651 priority patent/WO1998023427A1/en
Application granted granted Critical
Publication of NL1004651C2 publication Critical patent/NL1004651C2/nl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C41/20—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. moulding inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C41/12—Spreading-out the material on a substrate, e.g. on the surface of a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/34—Component parts, details or accessories; Auxiliary operations
    • B29C41/36—Feeding the material on to the mould, core or other substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/001—Shaping in several steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B29K2101/10—Thermosetting resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
NL1004651A 1996-11-29 1996-11-29 Werkwijze voor het inkapselen van een chip op een drager. NL1004651C2 (nl)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL1004651A NL1004651C2 (nl) 1996-11-29 1996-11-29 Werkwijze voor het inkapselen van een chip op een drager.
AU54159/98A AU5415998A (en) 1996-11-29 1997-11-27 Method for encapsulating a chip on a carrier
US09/319,004 US6399004B1 (en) 1996-11-29 1997-11-27 Method for encapsulating a chip on a carrier
EP97947998A EP0942818A1 (en) 1996-11-29 1997-11-27 Method for encapsulating a chip on a carrier
EA199900509A EA199900509A1 (ru) 1996-11-29 1997-11-27 Способ герметизации микросхемы на кристаллодержателе
PCT/NL1997/000651 WO1998023427A1 (en) 1996-11-29 1997-11-27 Method for encapsulating a chip on a carrier

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1004651 1996-11-29
NL1004651A NL1004651C2 (nl) 1996-11-29 1996-11-29 Werkwijze voor het inkapselen van een chip op een drager.

Publications (1)

Publication Number Publication Date
NL1004651C2 true NL1004651C2 (nl) 1998-06-03

Family

ID=19763957

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1004651A NL1004651C2 (nl) 1996-11-29 1996-11-29 Werkwijze voor het inkapselen van een chip op een drager.

Country Status (6)

Country Link
US (1) US6399004B1 (ru)
EP (1) EP0942818A1 (ru)
AU (1) AU5415998A (ru)
EA (1) EA199900509A1 (ru)
NL (1) NL1004651C2 (ru)
WO (1) WO1998023427A1 (ru)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6399425B1 (en) * 1998-09-02 2002-06-04 Micron Technology, Inc. Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices
US7394153B2 (en) * 1999-12-17 2008-07-01 Osram Opto Semiconductors Gmbh Encapsulation of electronic devices
US6949880B1 (en) * 1999-12-17 2005-09-27 Osram Opto Semiconductors Gmbh Encapsulation for organic LED device
US7255823B1 (en) * 2000-09-06 2007-08-14 Institute Of Materials Research And Engineering Encapsulation for oled devices
US6737002B1 (en) * 2002-02-04 2004-05-18 Lockheed Martin Corporation Fabrication of plastic module with exposed backside contact
JP3893301B2 (ja) * 2002-03-25 2007-03-14 沖電気工業株式会社 半導体装置の製造方法および半導体モジュールの製造方法
ITTO20030978A1 (it) * 2003-12-05 2005-06-06 Ansaldo Segnalamento Ferroviario S P A Boa (balise) per segnalazione ferroviaria e metodo di realizzazione della boa stessa.
US20090289350A1 (en) * 2005-09-29 2009-11-26 Nec Corporation Semiconductor package, substrate, electronic device using such semiconductor package or substrate, and method for correcting warping of semiconductor package
EP1914809A1 (en) * 2006-10-20 2008-04-23 Tridonic Optoelectronics GmbH Cover for optoelectronic components
TWI483418B (zh) * 2009-04-09 2015-05-01 Lextar Electronics Corp 發光二極體封裝方法
TWI403005B (zh) * 2009-10-12 2013-07-21 Intematix Technology Ct Corp 發光二極體及其製作方法
JP2011176112A (ja) * 2010-02-24 2011-09-08 Renesas Electronics Corp 半導体集積回路及びその製造方法
DE102010028815A1 (de) 2010-05-10 2011-11-10 Nedcard B.V. Verfahren zum Verkapseln eines Chips
DE102010044470B4 (de) 2010-09-06 2018-06-28 Heraeus Noblelight Gmbh Verfahren zur Beschichtung eines optoelektronischen Chip-On-Board-Moduls, optoelektronisches Chip-On-Board-Modul und System damit
US9710745B1 (en) * 2012-02-09 2017-07-18 Dynamics Inc. Systems and methods for automated assembly of dynamic magnetic stripe communications devices
TWI548005B (zh) * 2014-01-24 2016-09-01 環旭電子股份有限公司 選擇性電子封裝模組的製造方法
CN107231760A (zh) * 2017-06-27 2017-10-03 北京计算机技术及应用研究所 一种电路板组件的高精度铸模灌封方法

Citations (8)

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Publication number Priority date Publication date Assignee Title
JPS61101054A (ja) * 1984-10-24 1986-05-19 Hitachi Micro Comput Eng Ltd 半導体装置およびその製造方法
JPS63310140A (ja) * 1987-06-12 1988-12-19 Canon Inc 電子回路装置とその製造方法
EP0319175A2 (en) * 1987-11-28 1989-06-07 THORN EMI plc Method of forming a solid article
JPH02143436A (ja) * 1988-11-24 1990-06-01 Nec Corp フィルムキャリヤ半導体装置の樹脂封止方法
US4961886A (en) * 1988-06-09 1990-10-09 Dow Corning Corporation Method of controlling flow by a radiation formed dam
JPH04201576A (ja) * 1990-11-30 1992-07-22 Sharp Corp サーマルヘツド及びその製造方法
JPH04302457A (ja) * 1991-03-29 1992-10-26 Toshiba Lighting & Technol Corp 混成集積回路基板の製造方法
JPH04303989A (ja) * 1991-03-30 1992-10-27 Toshiba Lighting & Technol Corp 厚膜回路基板

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US3340347A (en) * 1964-10-12 1967-09-05 Corning Glass Works Enclosed electronic device
US3622419A (en) * 1969-10-08 1971-11-23 Motorola Inc Method of packaging an optoelectrical device
US3668299A (en) * 1971-04-29 1972-06-06 Beckman Instruments Inc Electrical circuit module and method of assembly
GB2096825A (en) * 1981-04-09 1982-10-20 Sibbald Alastair Chemical sensitive semiconductor field effect transducer
US4812421A (en) * 1987-10-26 1989-03-14 Motorola, Inc. Tab-type semiconductor process
US4835120A (en) * 1987-01-12 1989-05-30 Debendra Mallik Method of making a multilayer molded plastic IC package
JPH01128438A (ja) * 1987-11-12 1989-05-22 Nitto Denko Corp 封止材
US5344600A (en) * 1989-06-07 1994-09-06 Motorola, Inc. Method for encapsulating semiconductor devices with package bodies
US5049526A (en) * 1989-06-07 1991-09-17 Motorola, Inc. Method for fabricating semiconductor device including package
JPH03257938A (ja) * 1990-03-08 1991-11-18 Fujitsu Ltd ベアチップ封止方法
US5577319A (en) * 1995-03-31 1996-11-26 Motorola, Inc. Method of encapsulating a crystal oscillator

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61101054A (ja) * 1984-10-24 1986-05-19 Hitachi Micro Comput Eng Ltd 半導体装置およびその製造方法
JPS63310140A (ja) * 1987-06-12 1988-12-19 Canon Inc 電子回路装置とその製造方法
EP0319175A2 (en) * 1987-11-28 1989-06-07 THORN EMI plc Method of forming a solid article
US4961886A (en) * 1988-06-09 1990-10-09 Dow Corning Corporation Method of controlling flow by a radiation formed dam
JPH02143436A (ja) * 1988-11-24 1990-06-01 Nec Corp フィルムキャリヤ半導体装置の樹脂封止方法
JPH04201576A (ja) * 1990-11-30 1992-07-22 Sharp Corp サーマルヘツド及びその製造方法
JPH04302457A (ja) * 1991-03-29 1992-10-26 Toshiba Lighting & Technol Corp 混成集積回路基板の製造方法
JPH04303989A (ja) * 1991-03-30 1992-10-27 Toshiba Lighting & Technol Corp 厚膜回路基板

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PATENT ABSTRACTS OF JAPAN vol. 010, no. 283 (E - 440) 26 September 1986 (1986-09-26) *
PATENT ABSTRACTS OF JAPAN vol. 013, no. 150 (E - 742) 12 April 1989 (1989-04-12) *
PATENT ABSTRACTS OF JAPAN vol. 014, no. 387 (E - 0967) 21 August 1990 (1990-08-21) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 538 (M - 1335) 9 November 1992 (1992-11-09) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 128 (E - 1333) 18 March 1993 (1993-03-18) *

Also Published As

Publication number Publication date
WO1998023427A1 (en) 1998-06-04
US6399004B1 (en) 2002-06-04
EP0942818A1 (en) 1999-09-22
EA199900509A1 (ru) 2000-04-24
AU5415998A (en) 1998-06-22

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VD1 Lapsed due to non-payment of the annual fee

Effective date: 20030601