DK3808879T3 - Fremgangsmåde til kontrol af defektdensitet i et monokrystallinsk siliciumsubstrat - Google Patents
Fremgangsmåde til kontrol af defektdensitet i et monokrystallinsk siliciumsubstrat Download PDFInfo
- Publication number
- DK3808879T3 DK3808879T3 DK19820517.1T DK19820517T DK3808879T3 DK 3808879 T3 DK3808879 T3 DK 3808879T3 DK 19820517 T DK19820517 T DK 19820517T DK 3808879 T3 DK3808879 T3 DK 3808879T3
- Authority
- DK
- Denmark
- Prior art keywords
- silicon substrate
- monocrystalline silicon
- defect density
- controlling defect
- controlling
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
- H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B13/00—Single-crystal growth by zone-melting; Refining by zone-melting
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018112062A JP7006517B2 (ja) | 2018-06-12 | 2018-06-12 | シリコン単結晶基板中の欠陥密度の制御方法 |
| PCT/JP2019/019004 WO2019239762A1 (ja) | 2018-06-12 | 2019-05-13 | シリコン単結晶基板中の欠陥密度の制御方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK3808879T3 true DK3808879T3 (da) | 2023-05-01 |
Family
ID=68842170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK19820517.1T DK3808879T3 (da) | 2018-06-12 | 2019-05-13 | Fremgangsmåde til kontrol af defektdensitet i et monokrystallinsk siliciumsubstrat |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP3808879B1 (https=) |
| JP (1) | JP7006517B2 (https=) |
| CN (1) | CN112334608B (https=) |
| DK (1) | DK3808879T3 (https=) |
| TW (1) | TWI801586B (https=) |
| WO (1) | WO2019239762A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021186944A1 (ja) * | 2020-03-17 | 2021-09-23 | 信越半導体株式会社 | シリコン単結晶基板中のドナー濃度の制御方法 |
| JP7264100B2 (ja) * | 2020-04-02 | 2023-04-25 | 信越半導体株式会社 | シリコン単結晶基板中のドナー濃度の制御方法 |
| WO2026049048A1 (ja) * | 2024-09-02 | 2026-03-05 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3211874B2 (ja) | 1997-10-29 | 2001-09-25 | サンケン電気株式会社 | 半導体装置の製造方法 |
| JP4288797B2 (ja) | 1998-11-05 | 2009-07-01 | 株式会社デンソー | 半導体装置の製造方法 |
| JP2001068477A (ja) * | 1999-08-27 | 2001-03-16 | Komatsu Electronic Metals Co Ltd | エピタキシャルシリコンウエハ |
| JP2001067477A (ja) * | 1999-08-27 | 2001-03-16 | Matsushita Electric Ind Co Ltd | 個人識別システム |
| JP3726622B2 (ja) * | 2000-02-25 | 2005-12-14 | 株式会社Ｓｕｍｃｏ | 半導体シリコンウエーハの製造方法 |
| JP4670224B2 (ja) * | 2003-04-01 | 2011-04-13 | 株式会社Sumco | シリコンウェーハの製造方法 |
| JP2006054350A (ja) * | 2004-08-12 | 2006-02-23 | Komatsu Electronic Metals Co Ltd | 窒素ドープシリコンウェーハとその製造方法 |
| JP5104314B2 (ja) | 2005-11-14 | 2012-12-19 | 富士電機株式会社 | 半導体装置およびその製造方法 |
| CN103946985B (zh) | 2011-12-28 | 2017-06-23 | 富士电机株式会社 | 半导体装置及半导体装置的制造方法 |
| JP6047456B2 (ja) * | 2013-07-16 | 2016-12-21 | 信越半導体株式会社 | 拡散ウェーハの製造方法 |
| JP6036670B2 (ja) * | 2013-12-10 | 2016-11-30 | 信越半導体株式会社 | シリコン単結晶基板の欠陥濃度評価方法 |
| JP6075307B2 (ja) * | 2014-02-20 | 2017-02-08 | 信越半導体株式会社 | シリコン単結晶中の炭素濃度評価方法及び半導体デバイスの製造方法 |
| JP6083412B2 (ja) * | 2014-04-01 | 2017-02-22 | 信越半導体株式会社 | 再結合ライフタイムの制御方法及びシリコン基板の製造方法 |
| JP6447351B2 (ja) * | 2015-05-08 | 2019-01-09 | 株式会社Sumco | シリコンエピタキシャルウェーハの製造方法およびシリコンエピタキシャルウェーハ |
-
2018
- 2018-06-12 JP JP2018112062A patent/JP7006517B2/ja active Active
-
2019
- 2019-05-13 WO PCT/JP2019/019004 patent/WO2019239762A1/ja not_active Ceased
- 2019-05-13 DK DK19820517.1T patent/DK3808879T3/da active
- 2019-05-13 CN CN201980039589.7A patent/CN112334608B/zh active Active
- 2019-05-13 EP EP19820517.1A patent/EP3808879B1/en active Active
- 2019-05-21 TW TW108117522A patent/TWI801586B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019214488A (ja) | 2019-12-19 |
| EP3808879B1 (en) | 2023-03-01 |
| TWI801586B (zh) | 2023-05-11 |
| WO2019239762A1 (ja) | 2019-12-19 |
| JP7006517B2 (ja) | 2022-01-24 |
| EP3808879A1 (en) | 2021-04-21 |
| EP3808879A4 (en) | 2022-03-02 |
| CN112334608B (zh) | 2022-07-26 |
| CN112334608A (zh) | 2021-02-05 |
| TW202002116A (zh) | 2020-01-01 |
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