DK3084043T3 - Fremgangsmåde til elektrolytisk overflademodifikation af flade metal-arbejdsemne i kobber-sulfat behandlingsvæske indeholdende sulfatmetalater - Google Patents

Fremgangsmåde til elektrolytisk overflademodifikation af flade metal-arbejdsemne i kobber-sulfat behandlingsvæske indeholdende sulfatmetalater Download PDF

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Publication number
DK3084043T3
DK3084043T3 DK14823977.5T DK14823977T DK3084043T3 DK 3084043 T3 DK3084043 T3 DK 3084043T3 DK 14823977 T DK14823977 T DK 14823977T DK 3084043 T3 DK3084043 T3 DK 3084043T3
Authority
DK
Denmark
Prior art keywords
metal
workpiece
treatment liquid
copper
metal workpiece
Prior art date
Application number
DK14823977.5T
Other languages
Danish (da)
English (en)
Inventor
Andreas Seidel
Fabian Distelrath
Thomas Booz
Original Assignee
Schlenk Metallfolien Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlenk Metallfolien Gmbh & Co Kg filed Critical Schlenk Metallfolien Gmbh & Co Kg
Application granted granted Critical
Publication of DK3084043T3 publication Critical patent/DK3084043T3/da

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0628—In vertical cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0664—Isolating rolls
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0692—Regulating the thickness of the coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
DK14823977.5T 2013-12-19 2014-12-18 Fremgangsmåde til elektrolytisk overflademodifikation af flade metal-arbejdsemne i kobber-sulfat behandlingsvæske indeholdende sulfatmetalater DK3084043T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013022030.0A DE102013022030B4 (de) 2013-12-19 2013-12-19 Verfahren zur elektrolytischen Oberflächenmodifizierung von flächigen Metallwerkstücken in sulfatometallhaltigen Kupfersulfat-Behandlungsflüssigkeiten, flächiges Metallwerkstück und dessen Verwendung
PCT/EP2014/078569 WO2015091863A1 (fr) 2013-12-19 2014-12-18 Procédé de modification de surface électrolytique de pièces métalliques plates dans des liquides de traitement au sulfate de cuivre contenant du sulfatométallate

Publications (1)

Publication Number Publication Date
DK3084043T3 true DK3084043T3 (da) 2018-06-25

Family

ID=52282713

Family Applications (1)

Application Number Title Priority Date Filing Date
DK14823977.5T DK3084043T3 (da) 2013-12-19 2014-12-18 Fremgangsmåde til elektrolytisk overflademodifikation af flade metal-arbejdsemne i kobber-sulfat behandlingsvæske indeholdende sulfatmetalater

Country Status (7)

Country Link
US (1) US20160319448A1 (fr)
EP (1) EP3084043B1 (fr)
JP (1) JP2017501308A (fr)
KR (1) KR20160100319A (fr)
DE (1) DE102013022030B4 (fr)
DK (1) DK3084043T3 (fr)
WO (1) WO2015091863A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021134524A1 (de) 2021-12-23 2023-06-29 Tdk Electronics Ag Gekoppeltes Ätz- und Abscheideverfahren

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3666636A (en) * 1969-06-19 1972-05-30 Udylite Corp Electrolytic codeposition of fine particles with copper
US4097342A (en) * 1975-05-16 1978-06-27 Alcan Research And Development Limited Electroplating aluminum stock
FR2646174B1 (fr) * 1989-04-25 1992-04-30 Pechiney Aluminium Procede et dispositif de revetement en continu de substrats conducteurs de l'electricite par electrolyse a grande vitesse
AT406385B (de) * 1996-10-25 2000-04-25 Andritz Patentverwaltung Verfahren und vorrichtung zum elektrolytischen beizen von metallischen bändern
DE19951325C2 (de) * 1999-10-20 2003-06-26 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von elektrisch isolierendem Folienmaterial sowie Anwendungen des Verfahrens
JP4799887B2 (ja) * 2005-03-24 2011-10-26 石原薬品株式会社 電気銅メッキ浴、並びに銅メッキ方法
CN101892502B (zh) * 2010-07-27 2012-02-01 华南理工大学 一种铜-铬-钼三元合金镀层及其制备方法

Also Published As

Publication number Publication date
EP3084043A1 (fr) 2016-10-26
US20160319448A1 (en) 2016-11-03
DE102013022030B4 (de) 2017-10-05
KR20160100319A (ko) 2016-08-23
WO2015091863A1 (fr) 2015-06-25
DE102013022030A1 (de) 2015-06-25
EP3084043B1 (fr) 2018-05-30
JP2017501308A (ja) 2017-01-12

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