DK1493313T3 - Vandbårne overtrækningssammensætninger for printplader - Google Patents
Vandbårne overtrækningssammensætninger for printpladerInfo
- Publication number
- DK1493313T3 DK1493313T3 DK03718025T DK03718025T DK1493313T3 DK 1493313 T3 DK1493313 T3 DK 1493313T3 DK 03718025 T DK03718025 T DK 03718025T DK 03718025 T DK03718025 T DK 03718025T DK 1493313 T3 DK1493313 T3 DK 1493313T3
- Authority
- DK
- Denmark
- Prior art keywords
- printed circuit
- coating compositions
- surfactant
- circuit boards
- circuit board
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Paints Or Removers (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37149802P | 2002-04-11 | 2002-04-11 | |
PCT/US2003/008838 WO2003087937A2 (fr) | 2002-04-11 | 2003-03-24 | Compositions aqueuses de revetement de cartes a circuit imprime |
Publications (1)
Publication Number | Publication Date |
---|---|
DK1493313T3 true DK1493313T3 (da) | 2007-03-26 |
Family
ID=29250689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK03718025T DK1493313T3 (da) | 2002-04-11 | 2003-03-24 | Vandbårne overtrækningssammensætninger for printplader |
Country Status (9)
Country | Link |
---|---|
US (1) | US20030219656A1 (fr) |
EP (1) | EP1493313B1 (fr) |
AT (1) | ATE347248T1 (fr) |
AU (1) | AU2003222042A1 (fr) |
DE (1) | DE60310055T2 (fr) |
DK (1) | DK1493313T3 (fr) |
ES (1) | ES2278155T3 (fr) |
TW (1) | TW200304933A (fr) |
WO (1) | WO2003087937A2 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1802603A (zh) | 2003-07-17 | 2006-07-12 | 霍尼韦尔国际公司 | 用于高级微电子应用的平面化薄膜及其生产装置和方法 |
JP4929784B2 (ja) * | 2006-03-27 | 2012-05-09 | 富士通株式会社 | 多層配線基板、半導体装置およびソルダレジスト |
CN111454596B (zh) * | 2019-01-18 | 2022-04-05 | 沈阳化工研究院有限公司 | 一种水性纳米防腐涂料及其制备方法 |
JP7255285B2 (ja) * | 2019-03-28 | 2023-04-11 | 株式会社レゾナック | 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法及び感光性樹脂組成物の製造方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3930072A (en) * | 1974-06-28 | 1975-12-30 | Universal Oil Prod Co | Stabilization of metal plating baths |
US4273851A (en) * | 1979-05-29 | 1981-06-16 | Richardson Graphics Company | Method of coating using photopolymerizable latex systems |
JPS6462375A (en) * | 1987-09-02 | 1989-03-08 | Arakawa Chem Ind | Liquid photosolder resist ink composition of alkali development type |
US5364736A (en) * | 1987-12-07 | 1994-11-15 | Morton International, Inc. | Photoimageable compositions |
US5723261A (en) * | 1989-11-30 | 1998-03-03 | Tamura Kaken Co., Ltd. | Photopolymerizable composition |
JPH04136857A (ja) * | 1990-09-28 | 1992-05-11 | Hitachi Ltd | 光硬化性レジスト組成物およびこれを用いたプリント回路板の製造方法およびプリント回路板 |
GB2261664A (en) * | 1991-10-22 | 1993-05-26 | Coates Brothers Plc | Coating compositions |
US6020436A (en) * | 1993-03-09 | 2000-02-01 | The Chromaline Corporation | Photosensitive resin composition |
JP2877659B2 (ja) * | 1993-05-10 | 1999-03-31 | 日本化薬株式会社 | レジストインキ組成物及びその硬化物 |
TW270123B (fr) * | 1993-07-02 | 1996-02-11 | Ciba Geigy | |
JP3134037B2 (ja) * | 1995-01-13 | 2001-02-13 | 太陽インキ製造株式会社 | メラミンの有機酸塩を用いた熱硬化性もしくは光硬化性・熱硬化性コーティング組成物 |
US5545510A (en) * | 1995-03-28 | 1996-08-13 | Mac Dermid, Inc. | Photodefinable dielectric composition useful in the manufacture of printed circuits |
EP0737701B1 (fr) * | 1995-04-13 | 2002-03-06 | Mitsui Chemicals, Inc. | Résines époxy acrylate et leurs utilisations |
US5853957A (en) * | 1995-05-08 | 1998-12-29 | Tamura Kaken Co., Ltd | Photosensitive resin compositions, cured films thereof, and circuit boards |
JP2718007B2 (ja) * | 1995-06-06 | 1998-02-25 | 太陽インキ製造株式会社 | アルカリ現像可能な一液型フォトソルダーレジスト組成物及びそれを用いたプリント配線板の製造方法 |
WO1996041240A1 (fr) * | 1995-06-07 | 1996-12-19 | W.R. Grace & Co.-Conn. | Emulsions aqueuses photosensibles et procedes de fabrication |
JP3276833B2 (ja) * | 1995-12-13 | 2002-04-22 | 太陽インキ製造株式会社 | 光硬化性・熱硬化性艶消しレジストインキ組成物 |
US6207346B1 (en) * | 1997-04-09 | 2001-03-27 | Advanced Coatings International | Waterborne photoresists made from urethane acrylates |
US6680347B1 (en) * | 1999-10-05 | 2004-01-20 | Cognis Corporation | Self-dispersible epoxide/surfactant coating compositions |
TW538318B (en) * | 2000-11-03 | 2003-06-21 | Ind Tech Res Inst | Photo-sensitive composition |
-
2003
- 2003-03-24 US US10/394,587 patent/US20030219656A1/en not_active Abandoned
- 2003-03-24 WO PCT/US2003/008838 patent/WO2003087937A2/fr active IP Right Grant
- 2003-03-24 AU AU2003222042A patent/AU2003222042A1/en not_active Abandoned
- 2003-03-24 EP EP03718025A patent/EP1493313B1/fr not_active Expired - Lifetime
- 2003-03-24 DE DE60310055T patent/DE60310055T2/de not_active Expired - Fee Related
- 2003-03-24 AT AT03718025T patent/ATE347248T1/de not_active IP Right Cessation
- 2003-03-24 ES ES03718025T patent/ES2278155T3/es not_active Expired - Lifetime
- 2003-03-24 DK DK03718025T patent/DK1493313T3/da active
- 2003-03-27 TW TW092106965A patent/TW200304933A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
AU2003222042A1 (en) | 2003-10-27 |
WO2003087937A2 (fr) | 2003-10-23 |
DE60310055T2 (de) | 2007-04-12 |
DE60310055D1 (de) | 2007-01-11 |
EP1493313A2 (fr) | 2005-01-05 |
WO2003087937A3 (fr) | 2004-03-11 |
EP1493313B1 (fr) | 2006-11-29 |
ES2278155T3 (es) | 2007-08-01 |
TW200304933A (en) | 2003-10-16 |
US20030219656A1 (en) | 2003-11-27 |
ATE347248T1 (de) | 2006-12-15 |
AU2003222042A8 (en) | 2003-10-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69800652D1 (de) | Flexible, flammhemmende fotopolymerisierbare Zusammensetzung zur Beschichtung von Leiterplatten | |
MY129757A (en) | Positive type photosensitive epoxy resin composition and printed circuit board using the same | |
ATE390450T1 (de) | Harzzusammensetzung für leiterplatte und lack, prepreg und metallplattiertes laminat unter verwendung davon | |
ATE268015T1 (de) | Durch licht und wärme aushärtbare harzzusammensetzung, aus dieser hergestellte lichtempfindliche trockenfolie und verfahren zur bildung eines musters damit | |
ATE163021T1 (de) | Verfahren zur beschichtung von leiterplatten | |
BR0205331A (pt) | Dispositivo de conexão de quadro de circuito impresso, em ângulo reto, método e artigos de fabricação | |
WO2004037866A3 (fr) | Photoresists contenant un composant sulfonamide | |
DE69724169D1 (de) | Wärmehärtbare Harzmischung, gehärtetes Produkt, mit Metall bedeckter Schichtstoff und Leiterplatte | |
DE60236550D1 (de) | Verfahren zur Herstellung einer gedruckten Leiterplatte mit verschlossenen Durchgangslöchern und besagte gedruckte Leiterplatte | |
EA200100329A1 (ru) | Некруговые соединительные отверстия для печатных плат | |
ATE199201T1 (de) | Verbinden von innenschichten in der leiterplattenherstellung | |
EP0943963A3 (fr) | Compositions photoimageables aux propriétés de décapage en solutions alcalines aqueuses améliorées | |
DK1493313T3 (da) | Vandbårne overtrækningssammensætninger for printplader | |
DE59700993D1 (de) | Einrichtung zur Behandlung von Gegenständen insbesondere Galvanisiereinrichtung für Leiterplatten | |
SE9800709D0 (sv) | Ledare | |
TW200516126A (en) | Adhesive composition for semiconductor devices, coverlay films, adhesive sheets and copper-clad polyimide films using the composition | |
MX9804234A (es) | Mascara soldada para fabricar tableros de circuitos impresos. | |
DE69703419D1 (de) | Flexible, flammhemmende fotopolymerisierbare Zusammensetzung zur Beschichtung von Leiterplatten | |
DE69411613D1 (de) | Härtbare Mehrfachzusammensetzung und Verwendung | |
DE59500120D1 (de) | Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtun g für Leiterplatten | |
DK0799558T3 (da) | Fremgangsmåde til påføring af en beskyttende belægning på komponenterne på et elektronisk kort | |
MY147672A (en) | Coating composition | |
KR900014937A (ko) | 광경화성 디알릴프탈레이트 수지조성물과 그것을 사용한 프린트회로판과 그의 제조방법 | |
ES2154849T3 (es) | Composicion fotosensible. | |
ATE323595T1 (de) | Trennplatten-verbundkomponente zur herstellung von leiterplattenkomponenten und verfahren zur herstellung einer solchen verbundkomponente |