ES2154849T3 - Composicion fotosensible. - Google Patents

Composicion fotosensible.

Info

Publication number
ES2154849T3
ES2154849T3 ES96941630T ES96941630T ES2154849T3 ES 2154849 T3 ES2154849 T3 ES 2154849T3 ES 96941630 T ES96941630 T ES 96941630T ES 96941630 T ES96941630 T ES 96941630T ES 2154849 T3 ES2154849 T3 ES 2154849T3
Authority
ES
Spain
Prior art keywords
compositions
photosensitive
photosensible
composition
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96941630T
Other languages
English (en)
Inventor
Heinrich Meyer
Desmaison Gonzalo Urrutia
Gilles Meunier
Rosangela Pirri
Francis Verzaro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2154849T3 publication Critical patent/ES2154849T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)

Abstract

LA INVENCION SE REFIERE A COMPOSICIONES FOTOSENSIBLES CAPACES DE SER REVELADAS COMO POSITIVOS. LAS COMPOSICIONES NORMALES MUESTRAN UNA FOTOSENSIBILIDAD NO SUFICIENTE O NO SON ADECUADAS PARA USARSE EN SUPERFICIES DE COBRE, POR EJEMPLO PLACAS DE CIRCUITOS IMPRESOS, YA QUE LAS PARTES DE LAS CAPAS ILUMINADAS DE LA COMPOSICION NO PUEDEN EXTRAERSE POR COMPLETO DURANTE EL REVELADO, DE TAL FORMA QUE SE PRODUCEN PROBLEMAS DURANTE LA METALIZACION O ESTAMPACION SUBSIGUIENTES. EN LAS COMPOSICIONES FOTOSENSIBLES CONFORME A LA INVENCION NO SE OBSERVAN ESTOS INCONVENIENTES. SE DESCRIBEN DIFERENTES COMPOSICIONES QUE CONTIENEN GENERADORES FOTO-ACIDOS Y UNA RESINA POLIMERICA CON GRUPOS LATERALES QUE PUEDEN ESCINDIRSE CON ACIDOS, LA CUAL ESTA COMPUESTA MEDIANTE POLIMERIZACION POR AL MENOS TRES DIFERENTES MONOMEROS DE ACRILATO O METACRILATO.
ES96941630T 1995-11-28 1996-11-27 Composicion fotosensible. Expired - Lifetime ES2154849T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19546140A DE19546140C2 (de) 1995-11-28 1995-11-28 Photoempfindliche Zusammensetzung

Publications (1)

Publication Number Publication Date
ES2154849T3 true ES2154849T3 (es) 2001-04-16

Family

ID=7779769

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96941630T Expired - Lifetime ES2154849T3 (es) 1995-11-28 1996-11-27 Composicion fotosensible.

Country Status (8)

Country Link
EP (1) EP0864119B1 (es)
JP (1) JP3789137B2 (es)
AT (1) ATE199187T1 (es)
CA (1) CA2238833A1 (es)
DE (2) DE19546140C2 (es)
ES (1) ES2154849T3 (es)
TW (1) TW495647B (es)
WO (1) WO1997020254A1 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6800422B2 (en) * 2001-05-11 2004-10-05 Shipley Company, L.L.C. Thick film photoresists and methods for use thereof
GR1004058B (el) * 2001-05-31 2002-11-15 Φωτοπολυμερικα υλικα με βιοσυμβατες λιθογραφικες απαιτησεις καταλληλα για σχηματοποιηση επιστρωσεων πολλαπλων βioμοριων
JP2006145853A (ja) * 2004-11-19 2006-06-08 Jsr Corp 感放射線性樹脂組成物およびメッキ造形物の製造方法
EP3182203A1 (en) * 2015-12-18 2017-06-21 Heraeus Precious Metals North America Daychem LLC A combination of nit derivatives with sensitizers
JP7402015B2 (ja) * 2019-11-05 2023-12-20 東京応化工業株式会社 化学増幅型ポジ型感光性樹脂組成物、感光性ドライフィルム、感光性ドライフィルムの製造方法、パターン化されたレジスト膜の製造方法、鋳型付き基板の製造方法及びめっき造形物の製造方法
TWI849024B (zh) * 2018-12-26 2024-07-21 日商東京應化工業股份有限公司 化學增幅型正型感光性樹脂組成物、感光性乾薄膜、感光性乾薄膜之製造方法、圖型化阻劑膜之製造方法、附鑄型基板之製造方法及鍍敷造形物之製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5045431A (en) * 1990-04-24 1991-09-03 International Business Machines Corporation Dry film, aqueous processable photoresist compositions
JPH0539444A (ja) * 1990-11-30 1993-02-19 Hitachi Chem Co Ltd ポジ型感光性アニオン電着塗料樹脂組成物、これを用いた電着塗装浴、電着塗装法及びプリント回路板の製造方法
US5372912A (en) * 1992-12-31 1994-12-13 International Business Machines Corporation Radiation-sensitive resist composition and process for its use
US5374500A (en) * 1993-04-02 1994-12-20 International Business Machines Corporation Positive photoresist composition containing photoacid generator and use thereof

Also Published As

Publication number Publication date
TW495647B (en) 2002-07-21
DE19546140A1 (de) 1997-06-05
CA2238833A1 (en) 1997-06-05
EP0864119A1 (de) 1998-09-16
DE19546140C2 (de) 1998-08-06
JP3789137B2 (ja) 2006-06-21
EP0864119B1 (de) 2001-02-14
DE59606441D1 (de) 2001-03-22
JP2000500883A (ja) 2000-01-25
ATE199187T1 (de) 2001-02-15
WO1997020254A1 (de) 1997-06-05

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