DE69703419D1 - Flexible, flammhemmende fotopolymerisierbare Zusammensetzung zur Beschichtung von Leiterplatten - Google Patents

Flexible, flammhemmende fotopolymerisierbare Zusammensetzung zur Beschichtung von Leiterplatten

Info

Publication number
DE69703419D1
DE69703419D1 DE69703419T DE69703419T DE69703419D1 DE 69703419 D1 DE69703419 D1 DE 69703419D1 DE 69703419 T DE69703419 T DE 69703419T DE 69703419 T DE69703419 T DE 69703419T DE 69703419 D1 DE69703419 D1 DE 69703419D1
Authority
DE
Germany
Prior art keywords
flexible
printed circuit
flame retardant
circuit boards
photopolymerizable composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69703419T
Other languages
English (en)
Other versions
DE69703419T2 (de
Inventor
Thomas Eugene Dueber
Frank Leonard Schadt
Yueh-Ling Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE69703419D1 publication Critical patent/DE69703419D1/de
Application granted granted Critical
Publication of DE69703419T2 publication Critical patent/DE69703419T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
DE1997603419 1996-08-02 1997-07-03 Flexible, flammhemmende fotopolymerisierbare Zusammensetzung zur Beschichtung von Leiterplatten Expired - Fee Related DE69703419T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69161696A 1996-08-02 1996-08-02

Publications (2)

Publication Number Publication Date
DE69703419D1 true DE69703419D1 (de) 2000-12-07
DE69703419T2 DE69703419T2 (de) 2001-06-21

Family

ID=24777257

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1997603419 Expired - Fee Related DE69703419T2 (de) 1996-08-02 1997-07-03 Flexible, flammhemmende fotopolymerisierbare Zusammensetzung zur Beschichtung von Leiterplatten

Country Status (3)

Country Link
EP (1) EP0822448B1 (de)
JP (1) JP3904166B2 (de)
DE (1) DE69703419T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000081428A (ja) * 1998-09-07 2000-03-21 Pola Chem Ind Inc 被膜の強度の評価法
US7141614B2 (en) 2001-10-30 2006-11-28 Kaneka Corporation Photosensitive resin composition and photosensitive films and laminates made by using the same
US7579134B2 (en) * 2005-03-15 2009-08-25 E. I. Dupont De Nemours And Company Polyimide composite coverlays and methods and compositions relating thereto
JP2007010794A (ja) * 2005-06-28 2007-01-18 Hitachi Chem Co Ltd 感光性樹脂組成物及び感光性エレメント
TW200728908A (en) * 2006-01-25 2007-08-01 Kaneka Corp Photosensitive dry film resist, printed wiring board using same, and method for producing printed wiring board
JP2008015384A (ja) * 2006-07-07 2008-01-24 Kaneka Corp 感光性ドライフィルムレジスト及びこれを用いたプリント配線板、並びに感光性ドライフィルムレジストの製造方法
US7527915B2 (en) * 2006-07-19 2009-05-05 E. I. Du Pont De Nemours And Company Flame retardant multi-layer photoimagable coverlay compositions and methods relating thereto
JP5378213B2 (ja) * 2007-07-05 2013-12-25 株式会社カネカ 感光性ドライフィルムレジスト材料、及びこれを用いたプリント配線板、並びにプリント配線板の製造方法
JP2012194534A (ja) * 2011-02-28 2012-10-11 Fujifilm Corp 感光性組成物、感光性ソルダーレジスト組成物及び感光性ソルダーレジストフィルム、並びに、永久パターン、その形成方法及びプリント基板
CN112063209A (zh) * 2020-08-31 2020-12-11 岳刚 光聚合法合成光固化丙烯酸酯pcb保护涂料
CN116463016A (zh) * 2023-04-17 2023-07-21 南通煜源科技有限公司 一种耐热型uv阻燃涂料

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1116919A (en) * 1976-10-27 1982-01-26 Joseph E. Gervay Flame retardant radiation sensitive element of photopolymerizable composition containing halogen and an acrylonitrile containing polymeric binder
JPH0288615A (ja) * 1988-09-27 1990-03-28 Mitsubishi Rayon Co Ltd 難燃性液状感光性樹脂組成物
JPH0527433A (ja) * 1990-11-30 1993-02-05 Mitsubishi Rayon Co Ltd 難燃性感光性樹脂組成物
DE69321103T2 (de) * 1992-02-24 1999-03-11 Du Pont Flexible, wässrig entwickelbare, durch licht abblidbare dauerhafte ueberzugsmittel fuer gedruckte schaltungen
TW369557B (en) * 1994-04-07 1999-09-11 Du Pont Pliable, aqueous processable, photoimageable permanent coatings for printed circuits

Also Published As

Publication number Publication date
JPH10115919A (ja) 1998-05-06
EP0822448B1 (de) 2000-11-02
EP0822448A1 (de) 1998-02-04
DE69703419T2 (de) 2001-06-21
JP3904166B2 (ja) 2007-04-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee