DE60310055D1 - Wässrige beschichtungszusammensetzungen für leiterplatte - Google Patents
Wässrige beschichtungszusammensetzungen für leiterplatteInfo
- Publication number
- DE60310055D1 DE60310055D1 DE60310055T DE60310055T DE60310055D1 DE 60310055 D1 DE60310055 D1 DE 60310055D1 DE 60310055 T DE60310055 T DE 60310055T DE 60310055 T DE60310055 T DE 60310055T DE 60310055 D1 DE60310055 D1 DE 60310055D1
- Authority
- DE
- Germany
- Prior art keywords
- coating compositions
- surfactant
- circuit board
- printed circuit
- groups
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Paints Or Removers (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37149802P | 2002-04-11 | 2002-04-11 | |
US371498P | 2002-04-11 | ||
PCT/US2003/008838 WO2003087937A2 (en) | 2002-04-11 | 2003-03-24 | Waterborne printed circuit board coating compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60310055D1 true DE60310055D1 (de) | 2007-01-11 |
DE60310055T2 DE60310055T2 (de) | 2007-04-12 |
Family
ID=29250689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60310055T Expired - Fee Related DE60310055T2 (de) | 2002-04-11 | 2003-03-24 | Wässrige beschichtungszusammensetzungen für leiterplatte |
Country Status (9)
Country | Link |
---|---|
US (1) | US20030219656A1 (de) |
EP (1) | EP1493313B1 (de) |
AT (1) | ATE347248T1 (de) |
AU (1) | AU2003222042A1 (de) |
DE (1) | DE60310055T2 (de) |
DK (1) | DK1493313T3 (de) |
ES (1) | ES2278155T3 (de) |
TW (1) | TW200304933A (de) |
WO (1) | WO2003087937A2 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101020164B1 (ko) | 2003-07-17 | 2011-03-08 | 허니웰 인터내셔날 인코포레이티드 | 진보된 마이크로전자적 응용을 위한 평탄화 막, 및 이를제조하기 위한 장치 및 방법 |
JP4929784B2 (ja) * | 2006-03-27 | 2012-05-09 | 富士通株式会社 | 多層配線基板、半導体装置およびソルダレジスト |
CN111454596B (zh) * | 2019-01-18 | 2022-04-05 | 沈阳化工研究院有限公司 | 一种水性纳米防腐涂料及其制备方法 |
JP7255285B2 (ja) * | 2019-03-28 | 2023-04-11 | 株式会社レゾナック | 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法及び感光性樹脂組成物の製造方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3930072A (en) * | 1974-06-28 | 1975-12-30 | Universal Oil Prod Co | Stabilization of metal plating baths |
US4273851A (en) * | 1979-05-29 | 1981-06-16 | Richardson Graphics Company | Method of coating using photopolymerizable latex systems |
JPS6462375A (en) * | 1987-09-02 | 1989-03-08 | Arakawa Chem Ind | Liquid photosolder resist ink composition of alkali development type |
US5364736A (en) * | 1987-12-07 | 1994-11-15 | Morton International, Inc. | Photoimageable compositions |
US5723261A (en) * | 1989-11-30 | 1998-03-03 | Tamura Kaken Co., Ltd. | Photopolymerizable composition |
JPH04136857A (ja) * | 1990-09-28 | 1992-05-11 | Hitachi Ltd | 光硬化性レジスト組成物およびこれを用いたプリント回路板の製造方法およびプリント回路板 |
GB2261664A (en) * | 1991-10-22 | 1993-05-26 | Coates Brothers Plc | Coating compositions |
US6020436A (en) * | 1993-03-09 | 2000-02-01 | The Chromaline Corporation | Photosensitive resin composition |
JP2877659B2 (ja) * | 1993-05-10 | 1999-03-31 | 日本化薬株式会社 | レジストインキ組成物及びその硬化物 |
TW270123B (de) * | 1993-07-02 | 1996-02-11 | Ciba Geigy | |
JP3134037B2 (ja) * | 1995-01-13 | 2001-02-13 | 太陽インキ製造株式会社 | メラミンの有機酸塩を用いた熱硬化性もしくは光硬化性・熱硬化性コーティング組成物 |
US5545510A (en) * | 1995-03-28 | 1996-08-13 | Mac Dermid, Inc. | Photodefinable dielectric composition useful in the manufacture of printed circuits |
DE69619575T2 (de) * | 1995-04-13 | 2002-09-12 | Mitsui Chemicals, Inc. | Epoxyacrylatharze und ihre Verwendungen |
US5853957A (en) * | 1995-05-08 | 1998-12-29 | Tamura Kaken Co., Ltd | Photosensitive resin compositions, cured films thereof, and circuit boards |
JP2718007B2 (ja) * | 1995-06-06 | 1998-02-25 | 太陽インキ製造株式会社 | アルカリ現像可能な一液型フォトソルダーレジスト組成物及びそれを用いたプリント配線板の製造方法 |
WO1996041240A1 (en) * | 1995-06-07 | 1996-12-19 | W.R. Grace & Co.-Conn. | Water photoresist emulsions and methods of preparation thereof |
JP3276833B2 (ja) * | 1995-12-13 | 2002-04-22 | 太陽インキ製造株式会社 | 光硬化性・熱硬化性艶消しレジストインキ組成物 |
US6207346B1 (en) * | 1997-04-09 | 2001-03-27 | Advanced Coatings International | Waterborne photoresists made from urethane acrylates |
US6680347B1 (en) * | 1999-10-05 | 2004-01-20 | Cognis Corporation | Self-dispersible epoxide/surfactant coating compositions |
TW538318B (en) * | 2000-11-03 | 2003-06-21 | Ind Tech Res Inst | Photo-sensitive composition |
-
2003
- 2003-03-24 US US10/394,587 patent/US20030219656A1/en not_active Abandoned
- 2003-03-24 DK DK03718025T patent/DK1493313T3/da active
- 2003-03-24 AT AT03718025T patent/ATE347248T1/de not_active IP Right Cessation
- 2003-03-24 WO PCT/US2003/008838 patent/WO2003087937A2/en active IP Right Grant
- 2003-03-24 EP EP03718025A patent/EP1493313B1/de not_active Expired - Lifetime
- 2003-03-24 ES ES03718025T patent/ES2278155T3/es not_active Expired - Lifetime
- 2003-03-24 AU AU2003222042A patent/AU2003222042A1/en not_active Abandoned
- 2003-03-24 DE DE60310055T patent/DE60310055T2/de not_active Expired - Fee Related
- 2003-03-27 TW TW092106965A patent/TW200304933A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
DE60310055T2 (de) | 2007-04-12 |
AU2003222042A8 (en) | 2003-10-27 |
EP1493313A2 (de) | 2005-01-05 |
ES2278155T3 (es) | 2007-08-01 |
TW200304933A (en) | 2003-10-16 |
WO2003087937A2 (en) | 2003-10-23 |
EP1493313B1 (de) | 2006-11-29 |
DK1493313T3 (da) | 2007-03-26 |
WO2003087937A3 (en) | 2004-03-11 |
AU2003222042A1 (en) | 2003-10-27 |
ATE347248T1 (de) | 2006-12-15 |
US20030219656A1 (en) | 2003-11-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |