DK1005083T3 - Elektronisk effektkomponent, som omfatter en afkölingsanordning - Google Patents

Elektronisk effektkomponent, som omfatter en afkölingsanordning

Info

Publication number
DK1005083T3
DK1005083T3 DK99402890T DK99402890T DK1005083T3 DK 1005083 T3 DK1005083 T3 DK 1005083T3 DK 99402890 T DK99402890 T DK 99402890T DK 99402890 T DK99402890 T DK 99402890T DK 1005083 T3 DK1005083 T3 DK 1005083T3
Authority
DK
Denmark
Prior art keywords
cooling device
power component
electronic power
array
thermal transfer
Prior art date
Application number
DK99402890T
Other languages
English (en)
Inventor
Michel Mermet-Guyennet
Christian Schaeffer
Original Assignee
Alstom Holdings
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alstom Holdings filed Critical Alstom Holdings
Application granted granted Critical
Publication of DK1005083T3 publication Critical patent/DK1005083T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Control Of Electric Motors In General (AREA)
DK99402890T 1998-11-27 1999-11-22 Elektronisk effektkomponent, som omfatter en afkölingsanordning DK1005083T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9815155A FR2786656B1 (fr) 1998-11-27 1998-11-27 Composant electronique de puissance comportant des moyens de refroidissement
EP99402890A EP1005083B1 (fr) 1998-11-27 1999-11-22 Composant électronique de puissance comportant des moyens de refroidissement

Publications (1)

Publication Number Publication Date
DK1005083T3 true DK1005083T3 (da) 2004-11-22

Family

ID=9533441

Family Applications (1)

Application Number Title Priority Date Filing Date
DK99402890T DK1005083T3 (da) 1998-11-27 1999-11-22 Elektronisk effektkomponent, som omfatter en afkölingsanordning

Country Status (13)

Country Link
US (1) US6344686B1 (da)
EP (1) EP1005083B1 (da)
JP (1) JP2000164780A (da)
KR (1) KR100603880B1 (da)
CN (1) CN1146041C (da)
AT (1) ATE271259T1 (da)
AU (1) AU755407B2 (da)
CA (1) CA2290802C (da)
DE (1) DE69918644T2 (da)
DK (1) DK1005083T3 (da)
ES (1) ES2222674T3 (da)
FR (1) FR2786656B1 (da)
PT (1) PT1005083E (da)

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WO2001050526A1 (en) * 1999-12-30 2001-07-12 Intel Corporation Optimized driver layout for integrated circuits with staggered bond pads
US6773963B2 (en) * 2002-01-16 2004-08-10 Intel Corporation Apparatus and method for containing excess thermal interface material
US6903929B2 (en) * 2003-03-31 2005-06-07 Intel Corporation Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink
US6934154B2 (en) * 2003-03-31 2005-08-23 Intel Corporation Micro-channel heat exchangers and spreaders
JP4491244B2 (ja) * 2004-01-07 2010-06-30 三菱電機株式会社 電力半導体装置
US7327024B2 (en) * 2004-11-24 2008-02-05 General Electric Company Power module, and phase leg assembly
US7353859B2 (en) * 2004-11-24 2008-04-08 General Electric Company Heat sink with microchannel cooling for power devices
JP4478049B2 (ja) * 2005-03-15 2010-06-09 三菱電機株式会社 半導体装置
DE102005050028A1 (de) 2005-10-14 2007-04-19 Robert Bosch Gmbh Elektrische Vorrichtung, insbesondere zur Ansteuerung einer motorisch und/oder generatorisch betreibbaren elektrischen Maschine
US20070158050A1 (en) * 2006-01-06 2007-07-12 Julian Norley Microchannel heat sink manufactured from graphite materials
US7973387B2 (en) * 2007-06-08 2011-07-05 Continental Automotive Systems Us, Inc. Insulated gate bipolar transistor
US7898807B2 (en) * 2009-03-09 2011-03-01 General Electric Company Methods for making millichannel substrate, and cooling device and apparatus using the substrate
US8232637B2 (en) * 2009-04-30 2012-07-31 General Electric Company Insulated metal substrates incorporating advanced cooling
CN103339455A (zh) * 2010-10-28 2013-10-02 Spx冷却技术公司 热交换器散热片、用于使这种热交换器散热片成型的辊轧成型模具组件以及成型方法
JP5891707B2 (ja) * 2011-10-28 2016-03-23 富士通株式会社 半導体装置とその製造方法
KR101692490B1 (ko) 2015-08-11 2017-01-04 주식회사 세미파워렉스 액체냉각구조를 갖는 전력반도체 모듈
EP3410478A1 (en) * 2017-05-29 2018-12-05 Mitsubishi Electric R & D Centre Europe B.V. Power module and method for manufacturing the power module
KR102869892B1 (ko) 2023-11-20 2025-10-14 주식회사 세미파워렉스 일체형 냉각구조를 갖는 전력반도체모듈 및 그 제조방법

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US3663184A (en) * 1970-01-23 1972-05-16 Fairchild Camera Instr Co Solder bump metallization system using a titanium-nickel barrier layer
US3652903A (en) * 1971-02-01 1972-03-28 Gen Electric Fluid cooled pressure assembly
DE2160001C2 (de) * 1971-12-03 1974-01-10 Siemens Ag, 1000 Berlin U. 8000 Muenchen Halbleiteranordnung, insbesondere Thyristorbaugruppe
DE2813529A1 (de) * 1978-03-29 1979-10-04 Siemens Ag Anordnung zur beidseitigen kuehlung von halbleiterbauelementen
US4392153A (en) * 1978-05-01 1983-07-05 General Electric Company Cooled semiconductor power module including structured strain buffers without dry interfaces
US4520305A (en) * 1983-08-17 1985-05-28 Cauchy Charles J Thermoelectric generating system
US4774630A (en) * 1985-09-30 1988-09-27 Microelectronics Center Of North Carolina Apparatus for mounting a semiconductor chip and making electrical connections thereto
US4758926A (en) * 1986-03-31 1988-07-19 Microelectronics And Computer Technology Corporation Fluid-cooled integrated circuit package
US4879629A (en) * 1988-10-31 1989-11-07 Unisys Corporation Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation
JP2891432B2 (ja) * 1989-12-27 1999-05-17 田中電子工業株式会社 半導体材料の接続方法，それに用いる接続材料及び半導体装置
US5168537A (en) * 1991-06-28 1992-12-01 Digital Equipment Corporation Method and apparatus for coupling light between an optoelectronic device and a waveguide
US5323292A (en) * 1992-10-06 1994-06-21 Hewlett-Packard Company Integrated multi-chip module having a conformal chip/heat exchanger interface
FR2701600B1 (fr) * 1993-02-10 1995-09-08 Gec Alsthom Transport Sa Dispositif de refroidissement de composants electriques de puissance.
DE4311839A1 (de) * 1993-04-15 1994-10-20 Siemens Ag Mikrokühleinrichtung für eine Elektronik-Komponente
JP3152834B2 (ja) * 1993-06-24 2001-04-03 株式会社東芝 電子回路装置
US5829516A (en) * 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
US5504378A (en) * 1994-06-10 1996-04-02 Westinghouse Electric Corp. Direct cooled switching module for electric vehicle propulsion system
US5774334A (en) * 1994-08-26 1998-06-30 Hitachi, Ltd. Low thermal resistant, fluid-cooled semiconductor module
JPH08241943A (ja) * 1995-03-07 1996-09-17 Fuji Electric Co Ltd パワー半導体素子用の液冷式冷却体
FR2737608A1 (fr) * 1995-08-02 1997-02-07 Alsthom Cge Alcatel Dispositif electronique de puissance pourvu de moyens ameliores d'evacuation de la chaleur
US5831336A (en) * 1996-07-25 1998-11-03 International Business Machines Corporation Ternary solder for the enhancement of C-4 fatigue life
US5790376A (en) * 1996-11-06 1998-08-04 Compaq Computer Corporation Heat dissipating pad structure for an electronic component
JP2914342B2 (ja) * 1997-03-28 1999-06-28 日本電気株式会社 集積回路装置の冷却構造

Also Published As

Publication number Publication date
EP1005083B1 (fr) 2004-07-14
CA2290802A1 (fr) 2000-05-27
CN1146041C (zh) 2004-04-14
CA2290802C (fr) 2008-08-05
FR2786656A1 (fr) 2000-06-02
JP2000164780A (ja) 2000-06-16
FR2786656B1 (fr) 2001-01-26
AU755407B2 (en) 2002-12-12
ATE271259T1 (de) 2004-07-15
US6344686B1 (en) 2002-02-05
AU5961099A (en) 2000-06-01
ES2222674T3 (es) 2005-02-01
KR100603880B1 (ko) 2006-07-24
DE69918644D1 (de) 2004-08-19
CN1258934A (zh) 2000-07-05
EP1005083A1 (fr) 2000-05-31
KR20000035714A (ko) 2000-06-26
PT1005083E (pt) 2004-10-29
DE69918644T2 (de) 2005-07-21

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