DK0992214T3 - Pulsoximeter og sensor optimeret til lav mætning - Google Patents

Pulsoximeter og sensor optimeret til lav mætning

Info

Publication number
DK0992214T3
DK0992214T3 DK99125853T DK99125853T DK0992214T3 DK 0992214 T3 DK0992214 T3 DK 0992214T3 DK 99125853 T DK99125853 T DK 99125853T DK 99125853 T DK99125853 T DK 99125853T DK 0992214 T3 DK0992214 T3 DK 0992214T3
Authority
DK
Denmark
Prior art keywords
light source
red
variations
perturbation
pulse oximeter
Prior art date
Application number
DK99125853T
Other languages
Danish (da)
English (en)
Inventor
Paul D Mannheimer
James R Cascani
Steve L Nierlich
Stephen J Ruskewicz
Original Assignee
Nellcor Puritan Bennett Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nellcor Puritan Bennett Inc filed Critical Nellcor Puritan Bennett Inc
Application granted granted Critical
Publication of DK0992214T3 publication Critical patent/DK0992214T3/da

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
    • A61B5/1455—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters
    • A61B5/1464—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters specially adapted for foetal tissue
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
    • A61B5/14542—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue for measuring blood gases
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/02—Details of sensors specially adapted for in-vivo measurements
    • A61B2562/0233—Special features of optical sensors or probes classified in A61B5/00
    • A61B2562/0242—Special features of optical sensors or probes classified in A61B5/00 for varying or adjusting the optical path length in the tissue
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/72—Signal processing specially adapted for physiological signals or for diagnostic purposes
    • A61B5/7203—Signal processing specially adapted for physiological signals or for diagnostic purposes for noise prevention, reduction or removal
    • A61B5/7207—Signal processing specially adapted for physiological signals or for diagnostic purposes for noise prevention, reduction or removal of noise induced by motion artifacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
DK99125853T 1994-04-01 1995-03-31 Pulsoximeter og sensor optimeret til lav mætning DK0992214T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/221,911 US5421329A (en) 1994-04-01 1994-04-01 Pulse oximeter sensor optimized for low saturation

Publications (1)

Publication Number Publication Date
DK0992214T3 true DK0992214T3 (da) 2005-05-17

Family

ID=22829941

Family Applications (2)

Application Number Title Priority Date Filing Date
DK99125853T DK0992214T3 (da) 1994-04-01 1995-03-31 Pulsoximeter og sensor optimeret til lav mætning
DK95915494T DK0754007T3 (da) 1994-04-01 1995-03-31 Pulsoximetrisensor optimeret til lav mætning

Family Applications After (1)

Application Number Title Priority Date Filing Date
DK95915494T DK0754007T3 (da) 1994-04-01 1995-03-31 Pulsoximetrisensor optimeret til lav mætning

Country Status (18)

Country Link
US (3) US5421329A (es)
EP (2) EP0754007B1 (es)
JP (1) JPH10500323A (es)
KR (1) KR100376649B1 (es)
CN (1) CN1100514C (es)
AT (2) ATE286670T1 (es)
AU (1) AU705934B2 (es)
BR (1) BR9507265A (es)
CA (1) CA2186225C (es)
DE (2) DE69518235T2 (es)
DK (2) DK0992214T3 (es)
ES (2) ES2148509T3 (es)
FI (1) FI963921A (es)
GR (1) GR3034711T3 (es)
NO (1) NO964143L (es)
NZ (1) NZ283905A (es)
PT (2) PT992214E (es)
WO (1) WO1995026676A1 (es)

Families Citing this family (174)

* Cited by examiner, † Cited by third party
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DE4442855B4 (de) * 1994-12-01 2004-04-01 Gerhard Dipl.-Ing. Rall Verwendung einer Pulsoxymetrie-Sensoreinrichtung
US5685301A (en) * 1995-06-16 1997-11-11 Ohmeda Inc. Apparatus for precise determination of operating characteristics of optical devices contained in a monitoring probe
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AU3721997A (en) * 1996-07-19 1998-02-10 Alexander K. Mills Device for noninvasive determination of blood parameters
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EP0754007A1 (en) 1997-01-22
DE69533927D1 (de) 2005-02-17
EP0992214A2 (en) 2000-04-12
US6272363B1 (en) 2001-08-07
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US5782237A (en) 1998-07-21
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ATE195063T1 (de) 2000-08-15
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FI963921A (fi) 1996-11-28
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EP0992214B1 (en) 2005-01-12
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