DK0807258T3 - Prøveindretning til elektroniske plane moduler - Google Patents

Prøveindretning til elektroniske plane moduler

Info

Publication number
DK0807258T3
DK0807258T3 DK96902914T DK96902914T DK0807258T3 DK 0807258 T3 DK0807258 T3 DK 0807258T3 DK 96902914 T DK96902914 T DK 96902914T DK 96902914 T DK96902914 T DK 96902914T DK 0807258 T3 DK0807258 T3 DK 0807258T3
Authority
DK
Denmark
Prior art keywords
probe
drive
surface area
drives
needle
Prior art date
Application number
DK96902914T
Other languages
English (en)
Inventor
Manfred Buks
Peter Schaller
Ger Jens Kr
Original Assignee
Ita Ingenieurb Ro F R Testaufg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ita Ingenieurb Ro F R Testaufg filed Critical Ita Ingenieurb Ro F R Testaufg
Application granted granted Critical
Publication of DK0807258T3 publication Critical patent/DK0807258T3/da

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06705Apparatus for holding or moving single probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07392Multiple probes manipulating each probe element or tip individually

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DK96902914T 1995-02-02 1996-01-24 Prøveindretning til elektroniske plane moduler DK0807258T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19503329A DE19503329C2 (de) 1995-02-02 1995-02-02 Testvorrichtung für elektronische Flachbaugruppen
PCT/EP1996/000280 WO1996024069A1 (de) 1995-02-02 1996-01-24 Testvorrichtung für elektronische flachbaugruppen

Publications (1)

Publication Number Publication Date
DK0807258T3 true DK0807258T3 (da) 2000-05-08

Family

ID=7752974

Family Applications (1)

Application Number Title Priority Date Filing Date
DK96902914T DK0807258T3 (da) 1995-02-02 1996-01-24 Prøveindretning til elektroniske plane moduler

Country Status (9)

Country Link
US (1) US6307389B1 (da)
EP (1) EP0807258B1 (da)
JP (1) JPH10513261A (da)
AT (1) ATE189064T1 (da)
AU (1) AU4713796A (da)
CA (1) CA2211703C (da)
DE (2) DE19503329C2 (da)
DK (1) DK0807258T3 (da)
WO (1) WO1996024069A1 (da)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19709939A1 (de) * 1997-03-11 1998-09-17 Atg Test Systems Gmbh Verfahren und Vorrichtung zum Prüfen von Leiterplatten
DE20005123U1 (de) * 2000-03-20 2001-08-02 atg test systems GmbH & Co. KG Reicholzheim, 97877 Wertheim Vorrichtung zum Prüfen von Leiterplatten
WO2002008773A2 (en) * 2000-07-19 2002-01-31 Orbotech Ltd. Apparatus and method for electrical testing of electrical circuits
DE10042770C1 (de) * 2000-08-31 2002-04-04 Miele & Cie Verfahren zur Hochspannungsprüfung bei einem elektrischen Gerät, insbesondere bei einem Staubsauger
US6657449B2 (en) * 2000-12-21 2003-12-02 Hansaem Digitec Co., Ltd. Test pin unit for PCB test device and feeding device of the same
DE10159165B4 (de) * 2001-12-03 2007-02-08 Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto Vorrichtung zum Messen und/oder Kalibrieren eines Testkopfes
DE10160119A1 (de) 2001-12-07 2003-10-02 Atg Test Systems Gmbh Prüfsonde für einen Fingertester
US6822463B1 (en) 2001-12-21 2004-11-23 Lecroy Corporation Active differential test probe with a transmission line input structure
DE10320381B4 (de) * 2003-05-06 2010-11-04 Scorpion Technologies Ag Platinentestvorrichtung mit schrägstehend angetriebenen Kontaktiernadeln
US20050174139A1 (en) * 2003-10-14 2005-08-11 Mahendran Chidambaram Apparatus for high speed probing of flat panel displays
JP5024740B2 (ja) * 2004-09-30 2012-09-12 学校法人慶應義塾 Lsiチップ試験装置
US7463042B2 (en) * 2005-06-30 2008-12-09 Northrop Grumman Corporation Connector probing system
US8134377B1 (en) 2005-08-31 2012-03-13 Lecroy Corporation Adherable holder and locater tool
US7256596B1 (en) * 2005-11-01 2007-08-14 Russell Robert J Method and apparatus for adapting a standard flying prober system for reliable testing of printed circuit assemblies
DE102006021569A1 (de) * 2006-02-09 2007-08-16 Rohde & Schwarz Gmbh & Co. Kg Prüfsystem für einen Schaltungsträger
US8674714B2 (en) * 2007-06-29 2014-03-18 PPI Systems, Inc. System and method for probing work pieces
TWI381168B (zh) * 2009-09-02 2013-01-01 Au Optronics Mfg Shanghai Corp 通用探針模組
DE102010053766B4 (de) 2010-12-08 2019-05-23 Acculogic Corporation Vorrichtung zum thermischen Testen von Platinen
DE202012101557U1 (de) 2012-04-26 2012-05-10 MPH Mess-, Prüf- und Handling-Systeme GmbH Testvorrichtung
CN104969080B (zh) * 2012-11-21 2019-02-15 康拉德有限责任公司 用于测试工件的方法及装置
DE102013102564A1 (de) * 2013-03-13 2014-09-18 Dtg International Gmbh Traverseneinheit für eine Prüfvorrichtung für Leiterplatten, sowie Prüfvorrichtung damit
CN104597381B (zh) * 2015-01-20 2017-10-31 厦门大学 电连接器机械性能与电气安全性能的检测装置与检测方法
US11255877B2 (en) 2020-07-17 2022-02-22 Acculogic Corporation Method and apparatus for testing printed circuit boards
KR102914441B1 (ko) 2020-08-14 2026-01-19 예놉틱 옵틱컬 시스템즈 게엠베하 광전자 칩 접촉을 위한 접촉 모듈

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3185927A (en) * 1961-01-31 1965-05-25 Kulicke & Soffa Mfg Co Probe instrument for inspecting semiconductor wafers including means for marking defective zones
US5107206A (en) * 1990-05-25 1992-04-21 Tescon Co., Ltd. Printed circuit board inspection apparatus
EP0468153B1 (de) * 1990-07-25 1995-10-11 atg test systems GmbH Kontaktierungsvorrichtung für Prüfzwecke
DE4109684C2 (de) * 1990-07-25 2001-07-12 Atg Test Systems Gmbh Kontaktierungsvorrichtung für Prüfzwecke
KR0176627B1 (ko) * 1995-12-30 1999-05-15 김광호 인쇄회로기판의 통전검사용 프로브 장치

Also Published As

Publication number Publication date
ATE189064T1 (de) 2000-02-15
CA2211703C (en) 2002-08-06
EP0807258B1 (de) 2000-01-19
CA2211703A1 (en) 1996-08-08
DE19503329A1 (de) 1996-08-08
AU4713796A (en) 1996-08-21
US20010028254A1 (en) 2001-10-11
EP0807258A1 (de) 1997-11-19
JPH10513261A (ja) 1998-12-15
WO1996024069A1 (de) 1996-08-08
DE59604229D1 (de) 2000-02-24
DE19503329C2 (de) 2000-05-18
US6307389B1 (en) 2001-10-23

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