DE7121884U - Halbleiterbauelement - Google Patents
HalbleiterbauelementInfo
- Publication number
- DE7121884U DE7121884U DE19717121884 DE7121884U DE7121884U DE 7121884 U DE7121884 U DE 7121884U DE 19717121884 DE19717121884 DE 19717121884 DE 7121884 U DE7121884 U DE 7121884U DE 7121884 U DE7121884 U DE 7121884U
- Authority
- DE
- Germany
- Prior art keywords
- protective body
- semiconductor component
- alkali
- glass
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 60
- 239000011521 glass Substances 0.000 claims description 46
- 230000001681 protective effect Effects 0.000 claims description 41
- 239000010410 layer Substances 0.000 claims description 30
- 229910052710 silicon Inorganic materials 0.000 claims description 30
- 239000010703 silicon Substances 0.000 claims description 30
- 239000003513 alkali Substances 0.000 claims description 25
- 239000002245 particle Substances 0.000 claims description 23
- 239000003795 chemical substances by application Substances 0.000 claims description 17
- 230000007704 transition Effects 0.000 claims description 17
- 230000005012 migration Effects 0.000 claims description 11
- 238000013508 migration Methods 0.000 claims description 11
- 229910044991 metal oxide Inorganic materials 0.000 claims description 10
- 150000004706 metal oxides Chemical class 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011241 protective layer Substances 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims 1
- 235000005505 Ziziphus oenoplia Nutrition 0.000 claims 1
- 244000104547 Ziziphus oenoplia Species 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 239000002923 metal particle Substances 0.000 claims 1
- 239000005368 silicate glass Substances 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 27
- 238000000034 method Methods 0.000 description 8
- 238000002161 passivation Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000004576 sand Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000010442 halite Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 235000002639 sodium chloride Nutrition 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 208000031872 Body Remains Diseases 0.000 description 1
- 241000251730 Chondrichthyes Species 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910021486 amorphous silicon dioxide Inorganic materials 0.000 description 1
- 210000000709 aorta Anatomy 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000011222 crystalline ceramic Substances 0.000 description 1
- 229910002106 crystalline ceramic Inorganic materials 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 235000005911 diet Nutrition 0.000 description 1
- 230000000378 dietary effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 235000013601 eggs Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US4439170A | 1970-06-08 | 1970-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE7121884U true DE7121884U (de) | 1972-04-27 |
Family
ID=21932128
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19717121884 Expired DE7121884U (de) | 1970-06-08 | 1971-06-05 | Halbleiterbauelement |
| DE19712128039 Pending DE2128039A1 (de) | 1970-06-08 | 1971-06-05 | Halbleiterbauelement und Verfahren zu seiner Herstellung |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19712128039 Pending DE2128039A1 (de) | 1970-06-08 | 1971-06-05 | Halbleiterbauelement und Verfahren zu seiner Herstellung |
Country Status (4)
| Country | Link |
|---|---|
| DE (2) | DE7121884U (enrdf_load_stackoverflow) |
| FR (1) | FR2094112B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1343473A (enrdf_load_stackoverflow) |
| IE (1) | IE35247B1 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1553243A (en) * | 1975-08-04 | 1979-09-26 | Gen Electric | Semiconductor |
| US4168960A (en) * | 1978-04-18 | 1979-09-25 | Westinghouse Electric Corp. | Method of making a glass encapsulated diode |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1303509B (enrdf_load_stackoverflow) * | 1959-09-22 | 1972-07-13 | Carman Laboratories Inc | |
| US3505571A (en) * | 1965-09-30 | 1970-04-07 | Gen Electric | Glass covered semiconductor device |
-
1971
- 1971-05-18 IE IE62771A patent/IE35247B1/xx unknown
- 1971-05-25 GB GB1688871A patent/GB1343473A/en not_active Expired
- 1971-06-05 DE DE19717121884 patent/DE7121884U/de not_active Expired
- 1971-06-05 DE DE19712128039 patent/DE2128039A1/de active Pending
- 1971-06-08 FR FR7120676A patent/FR2094112B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1343473A (en) | 1974-01-10 |
| DE2128039A1 (de) | 1971-12-16 |
| IE35247L (en) | 1971-12-08 |
| FR2094112A1 (enrdf_load_stackoverflow) | 1972-02-04 |
| IE35247B1 (en) | 1975-12-24 |
| FR2094112B1 (enrdf_load_stackoverflow) | 1977-08-05 |
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