DE69936226D1 - Kühlkörper, und halbleiterlaservorrichtung mit einem solchen kühlkörper - Google Patents

Kühlkörper, und halbleiterlaservorrichtung mit einem solchen kühlkörper

Info

Publication number
DE69936226D1
DE69936226D1 DE69936226T DE69936226T DE69936226D1 DE 69936226 D1 DE69936226 D1 DE 69936226D1 DE 69936226 T DE69936226 T DE 69936226T DE 69936226 T DE69936226 T DE 69936226T DE 69936226 D1 DE69936226 D1 DE 69936226D1
Authority
DE
Germany
Prior art keywords
refrigerator
semiconductor laser
laser device
cooling body
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69936226T
Other languages
English (en)
Other versions
DE69936226T2 (de
Inventor
Hirofumi Miyajima
Hirofumi Kan
Toshio Naitoh
Hirokazu Ohta
Takeshi Kanzaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Publication of DE69936226D1 publication Critical patent/DE69936226D1/de
Application granted granted Critical
Publication of DE69936226T2 publication Critical patent/DE69936226T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02375—Positioning of the laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4043—Edge-emitting structures with vertically stacked active layers
    • H01S5/405—Two-dimensional arrays

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69936226T 1998-08-18 1999-04-13 Kühlkörper, und halbleiterlaservorrichtung mit einem solchen kühlkörper Expired - Lifetime DE69936226T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP23157598 1998-08-18
JP23157598 1998-08-18
PCT/JP1999/001968 WO2000011922A1 (en) 1998-08-18 1999-04-13 Heat sink, and semiconductor laser and semiconductor laser stacker using the same

Publications (2)

Publication Number Publication Date
DE69936226D1 true DE69936226D1 (de) 2007-07-12
DE69936226T2 DE69936226T2 (de) 2008-01-24

Family

ID=16925677

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69936226T Expired - Lifetime DE69936226T2 (de) 1998-08-18 1999-04-13 Kühlkörper, und halbleiterlaservorrichtung mit einem solchen kühlkörper

Country Status (5)

Country Link
US (1) US6895026B2 (de)
EP (1) EP1143779B1 (de)
AU (1) AU3169799A (de)
DE (1) DE69936226T2 (de)
WO (1) WO2000011922A1 (de)

Families Citing this family (25)

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US6792017B2 (en) 2002-09-26 2004-09-14 The Regents Of The University Of California High energy laser beam dump
KR20040076650A (ko) * 2003-02-26 2004-09-03 삼성전자주식회사 광픽업 장치
US7416922B2 (en) * 2003-03-31 2008-08-26 Intel Corporation Heat sink with preattached thermal interface material and method of making same
JP4014549B2 (ja) 2003-09-18 2007-11-28 富士電機システムズ株式会社 ヒートシンク及びその製造方法
JP2005166855A (ja) * 2003-12-02 2005-06-23 Hitachi Ltd 電子機器
JP4522725B2 (ja) * 2004-03-16 2010-08-11 三菱電機株式会社 ヒートシンク
JP4074259B2 (ja) 2004-03-17 2008-04-09 浜松ホトニクス株式会社 半導体レーザ装置
JP2005268445A (ja) 2004-03-17 2005-09-29 Hamamatsu Photonics Kk 半導体レーザ装置
JP2008277364A (ja) * 2007-04-26 2008-11-13 Shindengen Electric Mfg Co Ltd 電気回路装置の冷却構造
US7495916B2 (en) 2007-06-19 2009-02-24 Honeywell International Inc. Low cost cold plate with film adhesive
JP5084527B2 (ja) * 2008-01-23 2012-11-28 三菱電機株式会社 ヒートシンクおよび電気機器
JP2012168216A (ja) * 2011-02-10 2012-09-06 Ricoh Co Ltd 熱交換装置及び画像形成装置
JP5910930B2 (ja) * 2011-03-07 2016-04-27 株式会社リコー 熱交換装置及び画像形成装置
JP5287922B2 (ja) * 2011-04-19 2013-09-11 株式会社豊田自動織機 冷却装置
JP2014127543A (ja) * 2012-12-26 2014-07-07 Sony Corp 冷却装置および半導体レーザ装置
US9437523B2 (en) * 2014-05-30 2016-09-06 Toyota Motor Engineering & Manufacturing North America, Inc. Two-sided jet impingement assemblies and power electronics modules comprising the same
JP6726769B2 (ja) * 2016-06-20 2020-07-22 テラダイオード， インコーポレーテッド 高出力レーザデバイスのためのパッケージ
US11095091B2 (en) * 2016-06-20 2021-08-17 TeraDiode, Inc. Packages for high-power laser devices
CN110809841B (zh) * 2017-07-07 2021-04-16 松下知识产权经营株式会社 半导体激光装置
CN212109693U (zh) * 2019-01-28 2020-12-08 达纳加拿大公司 冷板热交换器
US10935330B2 (en) * 2019-03-20 2021-03-02 Senior Uk Limited Heat exchangers capable of bidirectional fluid flow
US11629917B2 (en) * 2019-07-23 2023-04-18 Dana Canada Corporation Three-layer heat exchanger with internal manifold for battery thermal management
WO2021044550A1 (ja) * 2019-09-04 2021-03-11 三菱電機株式会社 ヒートシンクおよび半導体モジュール
DE102020205184A1 (de) * 2020-04-23 2021-10-28 Karlsruher Institut für Technologie Stromzuführung und Verfahren zur ihrer Herstellung
EP4333049A1 (de) * 2022-08-29 2024-03-06 Ovh Kühlblock zur kühlung eines wärmeerzeugenden elektronischen bauteils

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4494171A (en) * 1982-08-24 1985-01-15 Sundstrand Corporation Impingement cooling apparatus for heat liberating device
DE4017749C2 (de) * 1989-03-18 1993-12-16 Abb Patent Gmbh Verfahren zur Herstellung eines Flüssigkeitskühlkörpers aus elektrisch isolierendem Material
US5005640A (en) * 1989-06-05 1991-04-09 Mcdonnell Douglas Corporation Isothermal multi-passage cooler
US5105429A (en) * 1990-07-06 1992-04-14 The United States Of America As Represented By The Department Of Energy Modular package for cooling a laser diode array
US5079619A (en) * 1990-07-13 1992-01-07 Sun Microsystems, Inc. Apparatus for cooling compact arrays of electronic circuitry
JPH05152475A (ja) * 1991-09-30 1993-06-18 Toshiba Corp 半導体装置
JP3093441B2 (ja) * 1992-04-28 2000-10-03 昭和アルミニウム株式会社 高出力電子機器用ヒートシンク
JPH06326226A (ja) * 1993-03-15 1994-11-25 Toshiba Corp 冷却装置
DE4315580A1 (de) * 1993-05-11 1994-11-17 Fraunhofer Ges Forschung Anordnung aus Laserdioden und einem Kühlsystem sowie Verfahren zu deren Herstellung
JPH07249721A (ja) * 1994-03-10 1995-09-26 Fuji Electric Co Ltd 電力用半導体素子の冷却体
JP3462598B2 (ja) * 1994-11-08 2003-11-05 浜松ホトニクス株式会社 ヒートシンク付レーザダイオードアレイ
JP3512249B2 (ja) * 1994-11-08 2004-03-29 浜松ホトニクス株式会社 ヒートシンク
JP3528375B2 (ja) * 1994-11-30 2004-05-17 住友電気工業株式会社 基板およびこれを用いた放熱基板、半導体装置、素子搭載装置
JP3178288B2 (ja) * 1995-02-03 2001-06-18 松下電器産業株式会社 冷却モジュールおよびその製造方法
DE19506093C2 (de) * 1995-02-22 2000-12-07 Dilas Diodenlaser Gmbh Diodenlaserbauelement
JPH09102568A (ja) * 1995-10-05 1997-04-15 Mitsubishi Electric Corp プレート型ヒートシンク
US5745514A (en) * 1996-04-26 1998-04-28 Opto Power Corporation Laser diode structure with integrated heat sink
JP3816194B2 (ja) * 1996-11-22 2006-08-30 ファナック株式会社 冷却装置、光源装置、面発光装置、およびその製造方法
JPH10185467A (ja) * 1996-12-26 1998-07-14 Furukawa Electric Co Ltd:The アルミニウム製ヒートパイプの製造方法

Also Published As

Publication number Publication date
EP1143779A4 (de) 2003-02-05
EP1143779B1 (de) 2007-05-30
AU3169799A (en) 2000-03-14
WO2000011922A1 (en) 2000-03-02
DE69936226T2 (de) 2008-01-24
EP1143779A1 (de) 2001-10-10
US20010004370A1 (en) 2001-06-21
US6895026B2 (en) 2005-05-17

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Legal Events

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